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XC3S400AN-4FGG400I

Xilinx

XC3S400AN-4FGG400I by Xilinx

Xilinx XC3S400AN-4FGG400I FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with a square shape and ball terminals, making it suitable for surface mount assembly.

Median Price

$112.970

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Overview

Unlock limitless possibilities with the XC3S400AN-4FGG400I by Xilinx, a cutting-edge Field Programmable Gate Array that empowers innovation and flexibility. With over 400,000 equivalent gates and 896 configurable logic blocks, this FPGA delivers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, trust Xilinx's expertise in semiconductor technology to provide top-notch quality and reliability. Experience seamless integration and faster time-to-market with the XC3S400AN-4FGG400I, the ultimate solution for your advanced design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package lightweight and durable, suitable for various applications.

No. of Logic Cells: 8064

Higher number of logic cells allows for complex programmable functionality and tasks to be implemented.

Surface Mount: YES

Surface mount option makes it easier to integrate the FPGA into circuit boards and layouts efficiently.

Maximum Supply Voltage: 1.26 V

Efficient power consumption with a relatively low maximum supply voltage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

No. of Inputs: 311

Ample number of inputs allow for versatile input configurations and connectivity options.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes it suitable for use in various environmental conditions and applications.

Maximum Clock Frequency: 667 MHz

High clock frequency allows for fast processing and execution of tasks, increasing overall performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S400AN-4FGG400I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

8064

No. of Inputs:

311

No. of Outputs:

248

No. of CLBs:

896

No. of Equivalent Gates:

400000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

896 CLBS, 400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

21 mm

Width:

21 mm

Maximum Seated Height:

2.43 mm

Package Equivalence Code:

BGA400,20X20,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

400

Standards

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S400AN-4FGG400I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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