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XC6VLX130T-1FFG1156I

Xilinx

XC6VLX130T-1FFG1156I by Xilinx

Xilinx XC6VLX130T-1FFG1156I FPGA features 128,000 logic cells, 600 inputs/outputs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array and operating temperature range from -40 to 100°C.

Median Price

$2,341.920

Lifecycle Status

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1k+

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Nova Conductors

Japan . 45 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 328 parts In-Stock

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One Stop Electronics

USA . 1,532 parts In-Stock

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Ampacity Inc.

Singapore . 339 parts In-Stock

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Semicontronic

India . 481 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,807 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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MARBEL Systems

Belgium . 1,489 parts In-Stock

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Texas Native Microelectronics

USA . 10 parts In-Stock

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Kenton Components

USA . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 1,568 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Continental Prestige Electronics

USA . 3,491 parts In-Stock

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Argo Parts USA

USA . 2,870 parts In-Stock

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$2,271.662

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Microchip USA

USA . 2,134 parts In-Stock

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Supply Digital

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Lixinc

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Perfect Parts

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Corphita

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Vigor

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Qasali Group International

UK . 25 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XC6VLX130T-1FFG1156I by Xilinx. As a leader in the industry, Xilinx delivers top-quality Field Programmable Gate Arrays that offer unparalleled performance and flexibility. With 128,000 logic cells and 600 inputs/outputs, this FPGA is ideal for a wide range of applications. Whether you're designing advanced electronics for industrial automation or pushing the boundaries of artificial intelligence, the XC6VLX130T-1FFG1156I provides the value, benefits, and advantages you need to bring your innovations to life. Choose Xilinx for reliability, versatility, and innovation in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and light weight, making the product suitable for various applications.

No. of Logic Cells: 128000

Offers high logic density for complex designs and processing capabilities.

Surface Mount: YES

Allows for easy mounting on PCBs, simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

Operates at low voltage, reducing power consumption and heat generation.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

No. of Inputs: 600

Offers a high number of inputs for data processing and connectivity.

Package Shape: SQUARE

Optimizes space utilization on the PCB and allows for efficient layout designs.

Form Of Terminal: BALL

Enables reliable and efficient electrical connections on the PCB.

Power Supplies (V): 1,1.2/2.5

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 1156

Provides a high number of terminals for connectivity and interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for reprogrammability and customization of logic functions for specific applications.

Package Style (Meter): GRID ARRAY

Offers a grid array package style for efficient signal routing and high-density integration.

Minimum Supply Voltage: 0.95 V

Supports operation at low voltages for power efficiency and reduced heat dissipation.

Maximum Operating Temperature: 100 °C

Operates reliably at high temperatures, suitable for industrial environments.

Pitch Of Terminal: 1 mm

Provides a standard pitch size for easy PCB layout and assembly.

Maximum Combinatorial Delay of a CLB: 5.08 ns

Offers fast combinatorial delay for rapid data processing and high-performance applications.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold environments, enhancing product reliability.

Finishing Of Terminal Used: TIN SILVER COPPER

Utilizes high-quality terminal finishing for reliable electrical connections and corrosion resistance.

Position Of Terminal: BOTTOM

Allows for easy and secure mounting on the PCB, ensuring stable electrical connections.

Moisture Sensitivity Level (MSL): 4

Indicates the product's resistance to moisture, suitable for various environmental conditions.

Maximum Seated Height: 3.5 mm

Offers a low-profile design for space-constrained applications and compact PCB layouts.

Width: 35 mm

Provides a compact form factor for easy integration into diverse electronic systems.

Maximum Clock Frequency: 1098 MHz

Supports high-speed processing and data transfer rates for demanding applications.

No. of Outputs: 600

Offers a high number of outputs for data transmission and signal distribution.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient solder reflow during manufacturing processes, ensuring reliable connections.

Peak Reflow Temperature °C: 245

Withstands high reflow temperatures for robust manufacturing and assembly processes.

Length: 35 mm

Provides a compact size for space-efficient PCB designs and electronic systems.

Grading Of Temperature: INDUSTRIAL

Designed to operate in industrial temperature ranges, ensuring reliability in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6VLX130T-1FFG1156I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

128000

No. of Inputs:

600

No. of Outputs:

600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

5.08 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,1.2/2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6VLX130T-1FFG1156I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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