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XC6VLX130T-2FFG1156C

Xilinx

XC6VLX130T-2FFG1156C by Xilinx

Xilinx XC6VLX130T-2FFG1156C is a FPGA with 128K logic cells, 600 inputs/outputs, and max clock frequency of 1.286 GHz. It operates at 0-85°C, suitable for high-speed applications like telecommunications and networking due to its advanced CMOS technology.

Median Price

$1,611.316

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Nova Conductors

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AZTECH Wire

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Texas Native Microelectronics

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Kenton Components

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Continental Prestige Electronics

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Netroflash

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Overview

Unlock limitless possibilities with the Xilinx XC6VLX130T-2FFG1156C FPGA. Crafted by industry leader Xilinx, this cutting-edge Field Programmable Gate Array boasts 128,000 logic cells and a maximum clock frequency of 1286 MHz. Perfect for a wide range of applications, from aerospace to telecommunications, this FPGA offers unparalleled flexibility and performance. Experience the power of innovation with the Xilinx XC6VLX130T-2FFG1156C and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective housing for the FPGA, making it suitable for a wide range of applications.

No. of Logic Cells: 128000

Offers a high level of design flexibility and complexity, allowing for the implementation of advanced algorithms and functions.

Surface Mount: YES

Enables easy and efficient integration of the FPGA onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.05 V

Allows for low power consumption and efficient operation, making the FPGA suitable for energy-sensitive applications.

Technology Used: CMOS

Provides reliable and high-speed performance, ensuring optimal functionality of the FPGA in various electronic systems.

No. of Inputs: 600

Offers a versatile range of input options for interfacing with external devices and sensors, enhancing the FPGA's connectivity and compatibility.

Package Shape: SQUARE

Facilitates easy placement and alignment of the FPGA on circuit boards, enhancing the overall design and layout of the system.

Form Of Terminal: BALL

Ensures secure and reliable connections with other components, minimizing the risk of signal loss or interference.

Power Supplies (V): 1,1.2/2.5

Supports a wide range of power supply voltages, enabling flexibility in system design and operation.

No. of Terminals: 1156

Provides ample connectivity options for external interfaces and peripherals, enhancing the FPGA's versatility and functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for custom configuration and reprogramming of logic functions, making the FPGA adaptable to changing system requirements.

Package Style (Meter): GRID ARRAY

Ensures a stable and secure mechanical connection to the circuit board, enhancing the reliability and durability of the FPGA.

Minimum Supply Voltage: 0.95 V

Supports low-power operation and energy-efficient design, making the FPGA suitable for battery-powered devices and portable systems.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of environmental conditions, making the FPGA suitable for industrial and automotive applications.

Pitch Of Terminal: 1 mm

Allows for fine-pitch connections, enabling compact design and high-density integration of the FPGA in electronic systems.

Maximum Combinatorial Delay of a CLB: 4.29 ns

Offers high-speed processing and low latency, ensuring efficient execution of complex logic functions in real-time applications.

Minimum Operating Temperature: 0 °C

Ensures reliable performance even in extreme temperature conditions, making the FPGA suitable for outdoor and harsh environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stability of the FPGA connections.

Position Of Terminal: BOTTOM

Facilitates easy connection to the circuit board and other components, simplifying assembly and maintenance of the FPGA.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture damage, ensuring the reliability and longevity of the FPGA in humid conditions.

Maximum Seated Height: 3.5 mm

Allows for compact and low-profile design, enabling the FPGA to be used in space-constrained applications.

Width: 35 mm

Provides a compact form factor, making the FPGA suitable for integration into small electronic devices and systems.

Maximum Clock Frequency: 1286 MHz

Supports high-speed data processing and real-time operation, ensuring optimal performance in demanding applications.

No. of Outputs: 600

Offers a diverse range of output options for driving external devices and components, enhancing the FPGA's capability and versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering and assembly of the FPGA onto the circuit board, minimizing the risk of thermal damage during manufacturing.

Peak Reflow Temperature °C: 245

Indicates the maximum temperature during soldering, ensuring proper bonding and connection of the FPGA to the circuit board.

Length: 35 mm

Provides a compact and standardized dimension, facilitating easy integration and compatibility with existing electronic systems and components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6VLX130T-2FFG1156C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

128000

No. of Inputs:

600

No. of Outputs:

600

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

4.29 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,1.2/2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6VLX130T-2FFG1156C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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