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XC6VLX195T-3FFG784C

Xilinx

XC6VLX195T-3FFG784C by Xilinx

XC6VLX195T-3FFG784C by Xilinx is a CMOS FPGA with 199680 logic cells, 400 inputs/outputs, and 1412 MHz clock frequency. Ideal for high-performance applications requiring fast processing speeds in fields like telecommunications and aerospace.

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$3,796.200

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Overview

Discover the cutting-edge technology of Xilinx's XC6VLX195T-3FFG784C Field Programmable Gate Array (FPGA). With over 199,000 logic cells and a maximum clock frequency of 1412 MHz, this powerful FPGA is perfect for applications requiring high-speed processing. Xilinx's reputation for quality and innovation ensures that you're getting a top-of-the-line product that will exceed your expectations. Whether you're working on telecommunications, automotive, or industrial projects, the XC6VLX195T-3FFG784C offers unmatched value, performance, and flexibility to help you achieve your goals with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 199680

With a high number of logic cells, this FPGA can handle complex processing tasks effectively.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying assembly.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA efficient and reliable.

No. of Inputs: 400

With 400 input channels, this FPGA can interface with a wide range of external devices and sensors.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards and simplifies layout design.

Form Of Terminal: BALL

The use of ball terminals simplifies soldering and ensures reliable electrical connections.

Power Supplies (V): 1,1.2/2.5

Support for multiple voltage supplies allows for flexible power configurations in different applications.

No. of Terminals: 784

Having a high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable device, this FPGA offers flexibility in design and can be reconfigured as needed.

Package Style (Meter): GRID ARRAY

The grid array package style enables easy mounting and alignment during assembly, improving manufacturing efficiency.

Pitch Of Terminal: 1 mm

The tight pitch of terminals allows for high-density mounting, saving space on the circuit board.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing provides good electrical conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom-mounted terminals facilitate easy routing of signal traces on the circuit board and improve signal integrity.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the FPGA can withstand standard reflow soldering processes without issues.

Maximum Clock Frequency: 1412 MHz

The high maximum clock frequency allows for fast operation and efficient execution of real-time tasks.

No. of Outputs: 400

Having 400 output channels provides ample flexibility in driving external devices and communicating with peripherals.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA can withstand soldering processes without damage.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C ensures reliable soldering and mechanical durability of the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6VLX195T-3FFG784C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

199680

No. of Inputs:

400

No. of Outputs:

400

Maximum Clock Frequency:

1412 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1,1.2/2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6VLX195T-3FFG784C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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