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XC6VLX130T-2FF784I

Xilinx

XC6VLX130T-2FF784I by Xilinx

Xilinx XC6VLX130T-2FF784I FPGA features 128000 logic cells, 400 inputs/outputs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

Median Price

$3,002.581

Lifecycle Status

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Digiode

USA . 205 parts In-Stock

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Modulus Dynamics

Lithuania . 278 parts In-Stock

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Texas Native Microelectronics

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Corohmni

South Africa . 1,089 parts In-Stock

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Kenton Components

USA . 340 parts In-Stock

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Qasali Group International

UK . 999 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the XC6VLX130T-2FF784I by Xilinx. As a leader in the field programmable gate arrays (FPGA) industry, Xilinx delivers top-quality solutions for a wide range of applications. With 128000 logic cells and 400 inputs/outputs, this FPGA offers unparalleled flexibility and performance. Whether you're designing complex systems or pushing the boundaries of innovation, the XC6VLX130T-2FF784I provides the value, benefits, and advantages you need to bring your ideas to life. Upgrade to Xilinx and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging.

No. of Logic Cells: 128000

High number of logic cells for complex designs and functionalities.

Surface Mount: YES

Ease of assembly and compact design for efficient PCB layout.

Maximum Supply Voltage: 1.05 V

Low power consumption and reduced heat dissipation.

Technology Used: CMOS

Low power consumption and compatibility with modern electronic systems.

No. of Inputs: 400

Sufficient input channels for versatile input requirements.

Package Shape: SQUARE

Saves space on the PCB and offers uniform mounting.

Form Of Terminal: BALL

Provides secure soldering connection and easy handling during assembly.

Power Supplies (V): 1,1.2/2.5

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 784

Sufficient connectivity options for complex circuit designs and interfacing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Customizable logic functions for specific application requirements.

Package Style (Meter): GRID ARRAY

Efficient grid layout for optimized signal routing and thermal management.

Minimum Supply Voltage: 0.95 V

Supports low voltage operation for energy-efficient performance.

Maximum Operating Temperature: 100 °C

Suitable for industrial environments with high temperature variations.

Pitch Of Terminal: 1 mm

Fine pitch terminals for compact design and space-saving assembly.

Maximum Combinatorial Delay of a CLB: 4.29 ns

Low delay for fast logic operations and high performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for diverse application environments.

Finishing Of Terminal Used: TIN LEAD

Reliable soldering finish and compatibility with leaded solder.

Position Of Terminal: BOTTOM

Bottom-mounted terminals for easy PCB layout and component placement.

Moisture Sensitivity Level (MSL): 4

Suitable protection against moisture during storage and handling.

Maximum Seated Height: 2.86 mm

Low profile design for compact electronic devices and PCB assemblies.

Width: 29 mm

Compact and standardized width dimension for easy integration into PCB layouts.

Maximum Clock Frequency: 1286 MHz

High clock frequency for fast data processing and real-time operations.

No. of Outputs: 400

Sufficient output channels for diverse output requirements and signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

Controlled reflow process for reliable soldering and assembly.

Peak Reflow Temperature °C: 220

Optimal peak reflow temperature for secure solder joints and component assembly.

Length: 29 mm

Compact and standardized length dimension for easy integration into PCB layouts.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial temperature ranges and rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6VLX130T-2FF784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

128000

No. of Inputs:

400

No. of Outputs:

400

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

4.29 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,1.2/2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

220 °C (428 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.86 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6VLX130T-2FF784I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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