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XC6SLX45-2CSG484I

Xilinx

XC6SLX45-2CSG484I by Xilinx

The Xilinx XC6SLX45-2CSG484I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at industrial temperature range (-40 to 100°C) and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

Median Price

$126.260

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Mouser Electronics

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Digiode

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

Lithuania . 145 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Vigor

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Ampacity Inc.

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Overview

Unlock limitless possibilities with the XC6SLX45-2CSG484I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). Packed with 43661 logic cells and 3411 CLBs, this FPGA offers unparalleled flexibility and performance for a wide range of applications. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, this FPGA delivers exceptional value, reliability, and efficiency. Experience seamless integration, rapid prototyping, and accelerated time-to-market with the XC6SLX45-2CSG484I - your key to success in the world of advanced digital design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the FPGA suitable for a wide range of applications.

No. of Logic Cells: 43661

With a high number of logic cells, this FPGA can handle complex and large-scale designs efficiently.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

This low supply voltage helps reduce power consumption and heat dissipation in the system.

No. of CLBs: 3411

A high number of configurable logic blocks provide flexibility in designing custom logic functions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

No. of Inputs: 310

Having a large number of input pins allows for versatile connectivity with other components in the system.

Package Shape: SQUARE

The square shape makes the FPGA easy to handle and mount on the circuit board with consistent alignment.

Form Of Terminal: BALL

Ball terminals provide reliable connections and are suitable for advanced soldering techniques.

Nominal Supply Voltage (V): 1.2

This standard supply voltage ensures compatibility with common power sources in various applications.

Power Supplies (V): 1.2, 2.5/3.3

Supporting multiple power supply voltages allows for versatile integration into different systems with varying requirements.

No. of Terminals: 484

Having a sufficient number of terminals enables the FPGA to interface with a wide range of external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility in customizing logic functions without the need for physical changes.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch design simplifies the routing of signals on the PCB and enhances signal integrity.

Minimum Supply Voltage: 1.14 V

With a low minimum supply voltage, the FPGA can operate efficiently even under low-power conditions.

Maximum Operating Temperature: 100 °C

The high operating temperature tolerance makes this FPGA suitable for industrial applications with challenging environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for high-density mounting and efficient use of space on the circuit board.

Maximum Combinatorial Delay of a CLB: 0.26 ns

Low combinatorial delay ensures fast data processing and high-speed performance of the FPGA.

Organization: 3411 CLBS

Having a well-organized structure with a high number of CLBs enables efficient logic implementation and design flexibility.

Minimum Operating Temperature: -40 °C

The FPGA can operate reliably in low-temperature environments, making it suitable for a wide range of applications.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of this finishing material provides reliable soldering connections and ensures long-term performance.

Position Of Terminal: BOTTOM

The terminal position at the bottom facilitates easy integration and soldering on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the FPGA can withstand moderate exposure to moisture during handling and soldering processes.

Maximum Seated Height: 1.8 mm

The low seated height profile allows for compact designs and efficient airflow for cooling.

Width: 19 mm

The compact width of the FPGA enables easy integration into various system designs.

Maximum Clock Frequency: 667 MHz

Support for high clock frequencies allows for fast data processing and real-time applications.

No. of Outputs: 310

A high number of output pins enable the FPGA to drive multiple external devices and interface with various subsystems.

Maximum Time At Peak Reflow Temperature (s): 30

The FPGA can withstand peak reflow temperatures for a sufficient duration during the assembly process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, the FPGA can undergo robust soldering processes without thermal damage.

Length: 19 mm

The compact length of the FPGA facilitates space-saving designs and efficient board layouts.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments and industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45-2CSG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

310

No. of Outputs:

310

No. of CLBs:

3411

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45-2CSG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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