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XC6SLX25-2FT256I

Xilinx

XC6SLX25-2FT256I by Xilinx

Xilinx XC6SLX25-2FT256I FPGA features 24051 logic cells, 1879 CLBs, and max clock freq of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

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$81.895

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Overview

Unleash the power of Xilinx's XC6SLX25-2FT256I Field Programmable Gate Array (FPGA) for your next project! With 24051 logic cells and 1879 CLBs, this cutting-edge technology offers unmatched flexibility and performance. Whether you're designing high-speed communication systems, industrial automation solutions, or advanced digital signal processing applications, this FPGA delivers the reliability and efficiency you need. Experience the value and benefits of Xilinx's top-tier manufacturing quality and innovative technology - take your designs to the next level with the XC6SLX25-2FT256I FPGA today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FPGA.

No. of Logic Cells: 24051

High number of logic cells allow for complex and large scale programmable logic designs.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs.

Maximum Supply Voltage: 1.26 V

Lower maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 1879

A high number of Configurable Logic Blocks (CLBs) provide flexibility in designing custom logic functions.

Technology Used: CMOS

CMOS technology offers high speed performance and low power consumption.

No. of Inputs: 186

Sufficient number of inputs for connecting external signals and data.

Package Shape: SQUARE

Square shape provides uniformity and ease of layout on PCBs.

Form Of Terminal: BALL

Ball terminals are suitable for grid array packages and offer good connectivity.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures reliable operation.

Power Supplies (V): 1.2,2.5/3.3

Supports multiple supply voltages for different logic levels and peripherals.

No. of Terminals: 256

Adequate number of terminals for connectivity and interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA type allows for reprogramming and customization of logic functions as per requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array style offers high density and low profile for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures proper operation even at lower power levels.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial applications.

Pitch Of Terminal: 1 mm

Optimal pitch for easy soldering and connectivity with PCB.

Maximum Combinatorial Delay of a CLB: 0.26 ns

Low combinatorial delay ensures fast logic processing and reduced signal propagation delay.

Organization: 1879 CLBS

Organized structure of CLBs provides efficient design implementation and testing.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme environmental conditions.

Finishing Of Terminal Used: TIN LEAD

Tin lead finish ensures good solderability and reliability in connections.

Position Of Terminal: BOTTOM

Bottom position of terminals facilitates easy PCB layout and routing.

Moisture Sensitivity Level (MSL): 3

MSL rating ensures proper handling and storage of the component to prevent moisture damage.

Maximum Seated Height: 1.55 mm

Low profile design for space-efficient integration in compact devices.

Width: 17 mm

Compact width for efficient placement on PCBs and space optimization.

Maximum Clock Frequency: 667 MHz

High clock frequency support for rapid data processing and real-time applications.

No. of Outputs: 186

Sufficient number of outputs for driving external devices and interfaces.

Maximum Time At Peak Reflow Temperature (s): 30

Supports peak reflow temperature for soldering within specified time limits.

Peak Reflow Temperature °C: 225

High peak reflow temperature for reliable and secure solder joints during assembly.

Length: 17 mm

Compact length for space-efficient mounting and layout on PCB.

Grading Of Temperature: INDUSTRIAL

Industrial grade temperature rating for reliable performance in rugged environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX25-2FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

24051

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

1879

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1879 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6SLX25-2FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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