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XC6SLX25T-3FG484I

Xilinx

XC6SLX25T-3FG484I by Xilinx

XC6SLX25T-3FG484I by Xilinx is a CMOS-based FPGA with 24051 logic cells and 1879 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in industrial applications requiring high-performance programmable ICs.

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$163.640

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Overview

Discover the XC6SLX25T-3FG484I, a game-changing Field Programmable Gate Array (FPGA) by Xilinx. With its cutting-edge technology and superior quality, this FPGA opens up a world of possibilities for customization and innovation. Its 24051 logic cells and 1879 CLBs ensure unmatched performance and flexibility. Whether you're designing high-speed communication systems or advanced industrial automation solutions, this FPGA delivers unrivaled power and efficiency. Say goodbye to limitations and hello to endless opportunities with the XC6SLX25T-3FG484I. Upgrade your projects today and experience the true value and benefits it brings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components, making this FPGA suitable for various environments.

No. of Logic Cells: 24051

With a large number of logic cells, this FPGA offers high versatility and complexity in designing and implementing custom logic circuits.

Surface Mount: YES

The surface mount capability allows for easier and more efficient installation on circuit boards, saving valuable space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in system integration.

No. of CLBs: 1879

The significant number of configurable logic blocks (CLBs) enables the implementation of complex digital functions, enhancing the product's versatility and performance.

Technology Used: CMOS

Utilizing CMOS technology results in low power consumption, high noise immunity, and fast switching speeds, making this FPGA energy-efficient and reliable.

No. of Inputs: 250

Having a large number of inputs allows for the processing and manipulation of numerous signals simultaneously, supporting the development of advanced digital systems.

Package Shape: SQUARE

The square package shape provides ease of mounting and alignment, ensuring compatibility with standardized mounting techniques.

Form Of Terminal: BALL

The ball terminal form simplifies the soldering process and provides excellent electrical and mechanical connections, enhancing the product's reliability and ease of use.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures consistent and stable performance, enabling reliable operation even in demanding applications.

Power Supplies (V): 1.2,2.5/3.3

The multiple power supply options allow for integration with different voltage systems, enhancing compatibility and adaptability to various environments.

No. of Terminals: 484

With a large number of terminals, this FPGA can accommodate extensive input and output connections, enabling versatile connectivity and functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array enables the customization and reprogramming of the integrated circuits, offering flexibility for various applications and system designs.

Package Style (Meter): GRID ARRAY

The grid array package style allows for high pin density, simplifying routing and improving signal integrity, making this FPGA suitable for high-performance applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with low-power systems and extends battery life, making this FPGA suitable for portable and energy-efficient devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environments and maintain optimal performance, enhancing its reliability and durability.

Pitch Of Terminal: 1 mm

The small pitch of the terminals enables high-density integration and compact circuit designs, offering space-saving benefits and improved efficiency.

Maximum Combinatorial Delay of a CLB: 0.21 ns

The low maximum combinatorial delay of a CLB allows for fast data processing and reduces signal propagation time, ensuring high-speed performance.

Organization: 1879 CLBS

The organized structure of 1879 configurable logic blocks (CLBs) allows for efficient design implementation, making this FPGA suitable for complex digital systems.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures makes this FPGA suitable for applications in cold environments or industrial scenarios.

Finishing Of Terminal Used: TIN LEAD

The use of tin lead finishing on the terminals ensures excellent solderability and robust electrical connections, improving overall product reliability.

Position Of Terminal: BOTTOM

The bottom terminal position simplifies the integration and assembly process, allowing for easier PCB layout and reducing the overall height of the system.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates good resistance to moisture-related failures, ensuring the reliability and longevity of the FPGA in humid conditions.

Maximum Seated Height: 2.6 mm

The low maximum seated height allows for compact PCB designs and facilitates proper airflow and heat dissipation, enhancing system performance and reliability.

Width: 23 mm

The compact width of 23mm enables efficient use of space on PCBs, accommodating more components and enabling compact and dense system designs.

Maximum Clock Frequency: 862 MHz

The high maximum clock frequency allows for fast data processing and high-speed operation, making this FPGA suitable for demanding applications that require real-time processing.

No. of Outputs: 250

Having a large number of outputs enables the FPGA to drive multiple signals simultaneously, expanding its functionality and versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The FPGA can withstand the peak reflow temperature for up to 30 seconds, ensuring the integrity of solder joints and reliable manufacturing processes.

Peak Reflow Temperature °C: 225

The peak reflow temperature of 225°C indicates the FPGA's ability to withstand high-temperature assembly processes, ensuring proper soldering and reducing the risk of component damage.

Length: 23 mm

The compact length of 23mm allows for space-saving integration, accommodating more components and enabling miniaturized system designs.

Grading Of Temperature: INDUSTRIAL

The FPGA's industrial-grade temperature rating ensures its reliable operation in harsh conditions and industrial environments, making it suitable for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX25T-3FG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

24051

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1879

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1879 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6SLX25T-3FG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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