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XC6SLX16-3FTG256I

Xilinx

XC6SLX16-3FTG256I by Xilinx

The Xilinx XC6SLX16-3FTG256I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 862 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs with a package style of grid array for compact designs.

Median Price

$69.070

Lifecycle Status

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9

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DigiKey

USA . 375 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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VNN

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Nova Conductors

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AZTECH Wire

Italy . 879 parts In-Stock

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$15.089

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MARBEL Systems

Belgium . 2,594 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Vigor

Singapore . 733 parts In-Stock

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Semicontronic

India . 446 parts In-Stock

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Ampacity Inc.

Singapore . 373 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Continental Prestige Electronics

USA . 6,905 parts In-Stock

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Microchip USA

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Qasali Group International

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Lixinc

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Supply Digital

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Argo Parts USA

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RC Electronics

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Netroflash

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Overview

Enhance your projects with the XC6SLX16-3FTG256I by Xilinx, a top-tier Field Programmable Gate Array that boasts exceptional quality and reliability. With its 14579 logic cells and 1139 CLBs, this FPGA is perfect for a wide range of applications. From industrial automation to telecommunications, this versatile component offers unparalleled flexibility and performance. Experience the benefits of cutting-edge CMOS technology and seamless integration with a grid array, low profile package style. Trust Xilinx to deliver innovative solutions that exceed expectations and unlock endless possibilities for your designs. Elevate your creations with the XC6SLX16-3FTG256I and unleash your full potential!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside, making the FPGA reliable for various applications.

No. of Logic Cells: 14579

High number of logic cells allow for complex programmable logic designs to be implemented on the FPGA, making it versatile for different projects.

Surface Mount: YES

Surface mount capability makes it easy to integrate the FPGA onto circuit boards, reducing assembly time and simplifying production processes.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy efficient.

Technology Used: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various logic levels, making the FPGA suitable for a wide range of applications.

No. of Inputs: 186

A high number of input pins allows for more flexibility and connectivity options when designing circuits and interfacing with other components.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage of 1.2V ensures consistent performance and reliable operation of the FPGA.

Maximum Clock Frequency: 862 MHz

High maximum clock frequency enables fast processing speeds and efficient operation of the FPGA in real-time applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX16-3FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

14579

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

1139

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1139 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX16-3FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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