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XC2S200-5FGG456I

Xilinx

XC2S200-5FGG456I by Xilinx

Xilinx XC2S200-5FGG456I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and PLASTIC/EPOXY material.

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Overview

Unlock endless possibilities with the Xilinx XC2S200-5FGG456I Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA offers unparalleled quality and reliability. With 1176 CLBs and 200000 equivalent gates, this product provides exceptional performance for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing industrial processes, the XC2S200-5FGG456I delivers unmatched value, flexibility, and efficiency to help you achieve your goals. Elevate your projects to new heights with Xilinx's superior FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components of the FPGA.

No. of Logic Cells: 5292

High number of logic cells allowing for complex logic operations and designs to be implemented.

Surface Mount: YES

Ease of installation and integration into circuit boards.

Maximum Supply Voltage: 2.625 V

Optimal voltage supply for efficient performance and power consumption.

No. of CLBs: 1176

Sufficient number of Configurable Logic Blocks for versatile functionality.

No. of Inputs: 284

High number of inputs allowing for diverse input sources to be processed.

Package Shape: SQUARE

Compact shape for efficient use of space on PCBs.

Form Of Terminal: BALL

Provides reliable electrical connections for signal transmission.

No. of Equivalent Gates: 200000

High number of equivalent gates enabling complex digital operations.

Nominal Supply Voltage (V): 2.5

Stable supply voltage for consistent performance.

Power Supplies (V): 1.5/3.3,2.5

Support for multiple power supply options for flexibility in design and integration.

No. of Terminals: 456

Sufficient terminals for connectivity and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Programmable nature allows for customization and reconfiguration of logic functions.

Package Style (Meter): GRID ARRAY

Organized grid array layout for efficient routing and connectivity.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Pitch Of Terminal: 1 mm

Optimal pitch for compact PCB design and easy placement.

Maximum Combinatorial Delay of a CLB: 0.7 ns

Low combinatorial delay for faster logic operations.

Organization: 1176 CLBS, 200000 GATES

Organized structure of CLBs and gates for efficient logic implementation.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in harsh environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing for reliable electrical connections and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom terminal position for easy mounting and connection in circuits.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage practices.

Maximum Seated Height: 2.6 mm

Low seated height for compact PCB designs.

Width: 23 mm

Optimal width size for fitting into various PCB layouts.

Maximum Clock Frequency: 263 MHz

High clock frequency for fast signal processing and operations.

No. of Outputs: 284

High number of outputs for diverse signal routing and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature for reliable soldering during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature for secure solder joints during assembly.

Length: 23 mm

Optimal length size for fitting into various PCB layouts.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in rugged environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S200-5FGG456I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5292

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

1176

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.7 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

1176 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA456,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC2S200-5FGG456I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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