Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Xilinx XC2S200-5FGG456I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and PLASTIC/EPOXY material.
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Durable material that provides protection to the internal components of the FPGA.
High number of logic cells allowing for complex logic operations and designs to be implemented.
Ease of installation and integration into circuit boards.
Optimal voltage supply for efficient performance and power consumption.
Sufficient number of Configurable Logic Blocks for versatile functionality.
High number of inputs allowing for diverse input sources to be processed.
Compact shape for efficient use of space on PCBs.
Provides reliable electrical connections for signal transmission.
High number of equivalent gates enabling complex digital operations.
Stable supply voltage for consistent performance.
Support for multiple power supply options for flexibility in design and integration.
Sufficient terminals for connectivity and signal routing.
Programmable nature allows for customization and reconfiguration of logic functions.
Organized grid array layout for efficient routing and connectivity.
Low minimum supply voltage for energy efficiency.
Wide operating temperature range suitable for industrial environments.
Optimal pitch for compact PCB design and easy placement.
Low combinatorial delay for faster logic operations.
Organized structure of CLBs and gates for efficient logic implementation.
Wide temperature range for operation in harsh environments.
Tin, silver, and copper finishing for reliable electrical connections and corrosion resistance.
Bottom terminal position for easy mounting and connection in circuits.
Moderate moisture sensitivity level for standard handling and storage practices.
Low seated height for compact PCB designs.
Optimal width size for fitting into various PCB layouts.
High clock frequency for fast signal processing and operations.
High number of outputs for diverse signal routing and processing capabilities.
Sufficient time at peak reflow temperature for reliable soldering during assembly.
High peak reflow temperature for secure solder joints during assembly.
Optimal length size for fitting into various PCB layouts.
Industrial-grade temperature rating for reliable operation in rugged environments.
Field Programmable Gate Arrays (FPGA) XC2S200-5FGG456I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC2S200-5FGG456I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Silicon Standard
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
Transys Electronics
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
NE555D
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
XC7A25T-1CPG238C
Xilinx
The Xilinx XC7A25T-1CPG238C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
10CL040YF484I7G
Intel
Intel's 10CL040YF484I7G FPGA features 2475 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high performance and flexibility in a compact square grid array package.
XC7A100T-1FG484I
Xilinx XC7A100T-1FG484I FPGA features 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Utilized in various applications due to its CMOS technology, with a max operating temperature of 100°C and a min of -40°C. Ideal for high-performance computing tasks requiring fast combinatorial delays.
5CGXFC7C6F23I7N
Altera
The Altera 5CGXFC7C6F23I7N is a FPGA with 149,500 logic cells and 240 inputs and outputs. It has a maximum supply voltage of 1.13V and uses CMOS technology. This FPGA is surface mountable and comes in a BGA484 package. Its dimensions are 23mm x 23mm and it has a grid array style.
10M02SCU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
LFE5U-85F-8BG381C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): NOT SPECIFIED;
A3P1000-FG144M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
LCMXO2-7000HC-4FTG256C
LCMXO2-7000HC-4FTG256C by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed processing in compact designs with a max operating temperature of 85°C.
LCMXO2-1200HC-6SG32I
LCMXO2-1200HC-6SG32I by Lattice Semiconductor is a 1280 Logic Cells FPGA with 160 CLBs, 21 Inputs/Outputs. Operating at -40 to 100°C, it has a max supply voltage of 3.6V and nominal voltage of 2.5V. Ideal for industrial applications requiring high-performance in compact form factor.
M2GL090T-1FG676I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
ICE40HX4K-CB132
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: FBGA; Package Shape: SQUARE;
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
XC7A12T-2CSG325I
XC7A12T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and a max clock frequency of 1286 MHz. It is commonly used in industrial applications for its high performance and programmability.
A3P1000-PQG208M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCAU25P-2FFVB676E
FIELD PROGRAMMABLE GATE ARRAY;
EP3C40U484I7
EP3C40U484I7 by Intel is a FPGA with 39600 logic cells, 331 inputs/outputs, and max clock frequency of 472.5 MHz. It operates in industrial temperature range (-40 to 100°C) and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable logic capabilities.
M1AGL600V2-FGG144I
Microchip Technology
M1AGL600V2-FGG144I by Microchip Technology is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.575 V, and features a grid array package style. Ideal for industrial applications requiring high gate count and low profile packaging in compact spaces.
XC7S50-1FGGA484C
The Xilinx XC7S50-1FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
A3P250-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCAU25P-1FFVB676I
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XC2S600E-6FGG456I
Xilinx XC2S600E-6FGG456I FPGA features 15552 logic cells, 864 CLBs, and 52000 equivalent gates. With a max clock frequency of 357 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC2S50-5PQG208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC2S30-6VQ100C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2S30-6VQG100C
XC2S30-5VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2S200-5FG456I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
XC2S200-6PQG208C
XC2S30-6CSG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XC2S200-5PQG208C
XC2S200-5PQG208C by Xilinx is a Field Programmable Gate Array (FPGA) with 5292 logic cells and 1176 configurable logic blocks (CLBs). It operates at a max clock frequency of 263 MHz and is commonly used in applications requiring high-speed data processing.
XC2S300E-6PQ208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC2S50-5PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;
XC2S15-5CS144I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA144,13X13,32;
XC2S200-6PQ208C
XC2S30-5VQG100C
XC2S50-5TQ144Q
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2S30-5TQ144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2S30-5VQ100C
XC2S150-5PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC2S100-6PQG208C
XC2S100-5PQG208C
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