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10CX220YF672I5G

Intel

10CX220YF672I5G by Intel

Intel's 10CX220YF672I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 236 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

Median Price

$463.460

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Mouser Electronics

USA . 122 parts In-Stock

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DigiKey

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Digiode

USA . 467 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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VNN

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Vyrian

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Chip Stock

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AZTECH Wire

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Corohmni

South Africa . 390 parts In-Stock

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Vigor

Singapore . 680 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Ampacity Inc.

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Microchip USA

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Futuretech Components

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Netroflash

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Qasali Group International

UK . 75 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Intel 10CX220YF672I5G Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA boasts 220,000 logic cells and a TSMC technology that guarantees top-notch performance. Perfect for a wide range of applications, from telecommunications to industrial automation, this FPGA offers unmatched flexibility and customization. With a maximum operating temperature of 100°C and a durable plastic/epoxy package body material, the Intel 10CX220YF672I5G delivers exceptional value, reliability, and innovation to customers seeking superior solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

No. of Logic Cells: 220000

With a large number of logic cells, this FPGA can handle complex designs and tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic systems.

Maximum Supply Voltage: 0.93 V

Operates at a relatively low maximum supply voltage, which can help in reducing power consumption.

No. of CLBs: 80330

High number of Configurable Logic Blocks (CLBs) provide flexibility in design implementation and customization.

Technology Used: TSMC

Utilizing TSMC technology ensures high performance and reliability in the FPGA.

No. of Inputs: 236

Having a large number of inputs enables handling of multiple data streams and signals efficiently.

Package Shape: SQUARE

The square shape of the package provides a compact form factor and ease of handling during assembly.

Form Of Terminal: BALL

Ball terminals offer secure connections and facilitate better heat dissipation in the FPGA.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9 V ensures stable and consistent operation of the FPGA.

No. of Terminals: 672

With a high number of terminals, there are plenty of connectivity options available for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for reprogramming and customization of the device as per specific requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and better mechanical stability for the FPGA.

Minimum Supply Voltage: 0.87 V

Operating at a low minimum supply voltage ensures energy efficiency and reduced power consumption.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures, making it suitable for industrial applications where heat dissipation is crucial.

Organization: 80330 CLBS

The organization of 80330 Configurable Logic Blocks provides a high degree of flexibility and scalability in design implementation.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperatures, making it suitable for a wide range of environments and applications.

Position Of Terminal: BOTTOM

Having terminals at the bottom facilitates easy and secure connections in the system layout.

No. of Outputs: 236

A high number of outputs allow for efficient signal processing and data transmission capabilities.

Grading Of Temperature: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliability and performance in harsh operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YF672I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

236

No. of Outputs:

236

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX220YF672I5G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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