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10CX220YU484I6G

Intel

10CX220YU484I6G by Intel

Intel's 10CX220YU484I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 188 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

Median Price

$375.980

Lifecycle Status

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8

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1k+

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DigiKey

USA . 37 parts In-Stock

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$375.980

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$357.170

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DF Sales Co.

USA . 14 parts In-Stock

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$145.000

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DF Sales Co.

USA . 14 parts In-Stock

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$145.000

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Digiode

USA . 391 parts In-Stock

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$324.710

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Nova Conductors

Japan . 38 parts In-Stock

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$339.878

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VNN

France . 3,800 parts In-Stock

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Chip Stock

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Vyrian

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145

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AZTECH Wire

Italy . 393 parts In-Stock

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$16.926

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Texas Native Microelectronics

USA . 5,658 parts In-Stock

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$103.828

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$99.675

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$96.560

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Kenton Components

USA . 887 parts In-Stock

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$124.594

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$109.642

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Vigor

Singapore . 453 parts In-Stock

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$275.880

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Ampacity Inc.

Singapore . 145 parts In-Stock

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Corphita

USA . 353 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$319.757

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Continental Prestige Electronics

USA . 4,759 parts In-Stock

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$339.878

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$333.080

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Argo Parts USA

USA . 472 parts In-Stock

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$339.878

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$336.479

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$333.080

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$329.682

472

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$329.682

Microchip USA

USA . 4,668 parts In-Stock

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$351.890

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MARBEL Systems

Belgium . 1,607 parts In-Stock

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Qasali Group International

UK . 826 parts In-Stock

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$269.122

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$246.695

826

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$269.122

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$246.695

Overview

Unleash the power of innovation with the 10CX220YU484I6G by Intel. This top-of-the-line Field Programmable Gate Array (FPGA) boasts 220,000 logic cells and TSMC technology for unparalleled performance. With 80330 CLBs and a maximum operating temperature of 100°C, this FPGA is perfect for industrial applications that demand high-speed processing and reliability. Trust Intel's reputation for quality and cutting-edge technology to take your projects to the next level. Elevate your designs with the 10CX220YU484I6G and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, ensuring longevity and reliability.

No. of Logic Cells: 220000

With a large number of logic cells, this FPGA can handle complex and high-performance processing tasks efficiently.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 0.93 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

Technology Used: TSMC

Utilizing TSMC technology ensures high-quality manufacturing and performance consistency in the FPGA.

No. of Inputs: 188

Having a high number of inputs allows for a greater range of data inputs and connectivity options, making the FPGA versatile.

Package Shape: SQUARE

A square package shape is space-efficient and facilitates uniform heat dissipation for reliable operation.

Form Of Terminal: BALL

Ball terminals provide secure connections and ease of soldering during installation, enhancing the overall reliability of the FPGA.

Nominal Supply Voltage (V): 0.9

A low nominal supply voltage contributes to energy efficiency and extends the lifespan of the FPGA.

No. of Terminals: 484

A high number of terminals enable extensive connectivity options, facilitating integration with various systems and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility in design and customization, making it adaptable to diverse application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides uniformity in terminal arrangement and simplifies the installation process, enhancing reliability and ease of use.

Minimum Supply Voltage: 0.87 V

Having a low minimum supply voltage ensures stable performance under varying voltage conditions and contributes to overall energy efficiency.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures, this FPGA is suitable for industrial settings and demanding applications where reliability under harsh conditions is essential.

Organization: 80330 CLBS

The organizational structure of 80330 CLBs provides a high degree of parallel processing capability, enabling efficient execution of complex algorithms and tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, this FPGA is suitable for a wide range of environments and applications, including those with demanding temperature requirements.

Position Of Terminal: BOTTOM

Having terminals located at the bottom allows for a clean and compact installation, reducing the overall footprint of the FPGA on the circuit board.

No. of Outputs: 188

A high number of outputs enable the FPGA to drive multiple devices or systems simultaneously, enhancing its capabilities in complex processing tasks.

Grading Of Temperature: INDUSTRIAL

With an industrial-grade temperature rating, this FPGA is designed to operate reliably in harsh industrial environments with extreme temperature fluctuations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YU484I6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

188

No. of Outputs:

188

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10CX220YU484I6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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