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784 Other Function uPs,uCs & Peripheral ICs 75

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU2CG-1SFVC784E by Xilinx

XCZU2CG-1SFVC784E

Xilinx

XCZU2CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVC784I by Xilinx

XCZU2CG-1SFVC784I

Xilinx

XCZU2CG-1SFVC784I by Xilinx is a CMOS microprocessor circuit with 784 terminals in a square grid array package. Operating b/w -40 to 100 °C, it has a peak reflow temp of 250C. Ideal for industrial applications requiring low voltage supply and high processing power.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SFVC784I by Xilinx

XCZU2CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L1SFVC784I by Xilinx

XCZU2CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVC784E by Xilinx

XCZU2EG-1SFVC784E

Xilinx

XCZU2EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVC784I by Xilinx

XCZU2EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784I by Xilinx

XCZU2EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L1SFVC784I by Xilinx

XCZU2EG-L1SFVC784I

Xilinx

The Xilinx XCZU2EG-L1SFVC784I is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L2SFVC784E by Xilinx

XCZU2EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784E by Xilinx

XCZU3CG-1SFVC784E

Xilinx

XCZU3CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784I by Xilinx

XCZU3CG-1SFVC784I

Xilinx

XCZU3CG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 BALL terminals. It operates in industrial temperature range (-40 to 100 °C) and has a supply voltage of 0.85 V. Ideal for applications requiring high-performance computing in harsh environments.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-2SFVC784I by Xilinx

XCZU3CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L1SFVC784I by Xilinx

XCZU3CG-L1SFVC784I

Xilinx

XCZU3CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This device comes in a GRID ARRAY package with 784 terminals, suitable for various applications requiring high-performance processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SFVC784E by Xilinx

XCZU3EG-1SFVC784E

Xilinx

XCZU3EG-1SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and processing capabilities.

R-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SFVC784I by Xilinx

XCZU3EG-1SFVC784I

Xilinx

XCZU3EG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-2SFVC784I by Xilinx

XCZU3EG-2SFVC784I

Xilinx

XCZU3EG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.825V to 0.876V.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-3SFVC784E by Xilinx

XCZU3EG-3SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-L1SFVC784I by Xilinx

XCZU3EG-L1SFVC784I

Xilinx

The Xilinx XCZU3EG-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. This GRID ARRAY package with 784 terminals is ideal for industrial applications requiring high performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-L2SFVC784E by Xilinx

XCZU3EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1SFVC784E by Xilinx

XCZU4CG-1SFVC784E

Xilinx

XCZU4CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1SFVC784I by Xilinx

XCZU4CG-1SFVC784I

Xilinx

XCZU4CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with a supply voltage of 0.85 V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-2SFVC784I by Xilinx

XCZU4CG-2SFVC784I

Xilinx

XCZU4CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, featuring 784 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring a 0.85V supply voltage and capable of peak reflow at 250°C within 30s.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L1SFVC784I by Xilinx

XCZU4CG-L1SFVC784I

Xilinx

Xilinx XCZU4CG-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.72 V supply voltage. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L2SFVC784E by Xilinx

XCZU4CG-L2SFVC784E

Xilinx

XCZU4CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 784 terminals in a GRID ARRAY package style. Operating at 0.72V, it's ideal for various applications requiring high-performance computing and processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-1SFVC784E by Xilinx

XCZU4EG-1SFVC784E

Xilinx

XCZU4EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-1SFVC784I by Xilinx

XCZU4EG-1SFVC784I

Xilinx

XCZU4EG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 terminals in GRID ARRAY package. Operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-2SFVC784I by Xilinx

XCZU4EG-2SFVC784I

Xilinx

XCZU4EG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-3SFVC784E by Xilinx

XCZU4EG-3SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-L1SFVC784I by Xilinx

XCZU4EG-L1SFVC784I

Xilinx

The Xilinx XCZU4EG-L1SFVC784I is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w -40 to 100°C, with supply voltage ranging from 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EG-L2SFVC784E by Xilinx

XCZU4EG-L2SFVC784E

Xilinx

The Xilinx XCZU4EG-L2SFVC784E is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY package style. Operating b/w 0-110 °C, it's ideal for applications requiring low power consumption and high processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-1SFVC784E by Xilinx

XCZU4EV-1SFVC784E

Xilinx

XCZU4EV-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs.

R-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-1SFVC784I by Xilinx

XCZU4EV-1SFVC784I

Xilinx

XCZU4EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-2SFVC784I by Xilinx

XCZU4EV-2SFVC784I

Xilinx

XCZU4EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 784 terminals is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4EV-L1SFVC784I by Xilinx

XCZU4EV-L1SFVC784I

Xilinx

The Xilinx XCZU4EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5CG-1SFVC784E by Xilinx

XCZU5CG-1SFVC784E

Xilinx

XCZU5CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact form factors.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5CG-1SFVC784I by Xilinx

XCZU5CG-1SFVC784I

Xilinx

XCZU5CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 100 °C. The package has 784 terminals, a GRID ARRAY style, and uses Tin/Silver/Copper terminal finish for various applications.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5CG-2SFVC784I by Xilinx

XCZU5CG-2SFVC784I

Xilinx

XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5CG-L1SFVC784I by Xilinx

XCZU5CG-L1SFVC784I

Xilinx

XCZU5CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, with a supply voltage of 0.72V. This SQUARE package has 784 terminals and is ideal for industrial applications requiring high-performance processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5CG-L2SFVC784E by Xilinx

XCZU5CG-L2SFVC784E

Xilinx

XCZU5CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY package style. Suitable for applications requiring low supply voltage of 0.72 V and high peak reflow temperature of 250°C, making it ideal for advanced electronic systems.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5EG-1SFVC784E by Xilinx

XCZU5EG-1SFVC784E

Xilinx

XCZU5EG-1SFVC784E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 784 terminals in a GRID ARRAY package style, with a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high performance and versatility in Other Function uPs,uCs & Peripheral ICs.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EG-1SFVC784I by Xilinx

XCZU5EG-1SFVC784I

Xilinx

XCZU5EG-1SFVC784I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and versatility.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EG-2SFVC784I by Xilinx

XCZU5EG-2SFVC784I

Xilinx

The Xilinx XCZU5EG-2SFVC784I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has 784 terminals on a grid array package (23x23 mm). With a supply voltage range of 0.825V to 0.876V, it's suitable for various applications requiring high-performance processing capabilities.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EG-3SFVC784E by Xilinx

XCZU5EG-3SFVC784E

Xilinx

XCZU5EG-3SFVC784E by Xilinx is a 784-terminal programmable SoC with CMOS technology. Operating b/w 0-100 °C, it has a supply voltage range of 0.873-0.927 V. Ideal for various applications requiring high-performance computing in a compact form factor.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

SQUARE

GRID ARRAY

250

3.32 mm

.927 V

.873 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EG-L1SFVC784I by Xilinx

XCZU5EG-L1SFVC784I

Xilinx

The Xilinx XCZU5EG-L1SFVC784I is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and flexibility.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EG-L2SFVC784E by Xilinx

XCZU5EG-L2SFVC784E

Xilinx

The Xilinx XCZU5EG-L2SFVC784E is a programmable SoC with CMOS technology. It features 784 terminals in a grid array package style, with a terminal pitch of 0.8mm. Operating b/w 0-110°C, it's suitable for applications requiring high processing power and flexibility like industrial automation and telecommunications.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

23 mm

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.742 V

.698 V

.72 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EV-1SFVC784E by Xilinx

XCZU5EV-1SFVC784E

Xilinx

The Xilinx XCZU5EV-1SFVC784E is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. This IC is ideal for applications requiring high-performance processing capabilities in various electronic systems.

R-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5EV-1SFVC784I by Xilinx

XCZU5EV-1SFVC784I

Xilinx

XCZU5EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5EV-2SFVC784I by Xilinx

XCZU5EV-2SFVC784I

Xilinx

XCZU5EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT