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XCZU4EG-2SFVC784I

Xilinx

XCZU4EG-2SFVC784I by Xilinx

XCZU4EG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

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Vyrian

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Kenton Components

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Overview

Discover the ultimate solution for your microprocessor circuit needs with the XCZU4EG-2SFVC784I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers high-quality products that excel in performance and reliability. Ideal for a wide range of applications, this advanced microprocessor circuit offers unparalleled value and benefits to customers. Whether you're looking to enhance efficiency or streamline operations, the XCZU4EG-2SFVC784I is the perfect choice for achieving your goals. Upgrade your technology with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 0.876 V

Provides a safe operating range for the device.

Package Shape: RECTANGULAR

Standard shape for ease of integration into existing designs.

No. of Terminals: 784

Offers a high level of connectivity for complex circuit designs.

Package Style (Meter): GRID ARRAY

Provides a compact footprint for space-constrained applications.

Minimum Supply Voltage: 0.825 V

Allows for operation at lower power consumption levels.

Maximum Operating Temperature: 100 °C

Suitable for industrial applications where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Allows for operation in a wide range of temperature environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy connection to circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 250

Optimal temperature for soldering processes.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers advanced processing capabilities for complex applications.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Allows for reliable and secure connections.

Nominal Supply Voltage: 0.85 V

Stable operating voltage for consistent performance.

Moisture Sensitivity Level (MSL): 4

Suitable for applications with moderate exposure to moisture.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EG-2SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EG-2SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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