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XCZU5EG-1SFVC784I

Xilinx

XCZU5EG-1SFVC784I by Xilinx

XCZU5EG-1SFVC784I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and versatility.

Median Price

$2,306.700

Lifecycle Status

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DigiKey

USA . 3 parts In-Stock

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Mouser Electronics

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Digiode

USA . 141 parts In-Stock

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$1,988.350

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Nova Conductors

Japan . 86 parts In-Stock

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VNN

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Vyrian

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AZTECH Wire

Italy . 688 parts In-Stock

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Corohmni

South Africa . 2,157 parts In-Stock

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MARBEL Systems

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Modulus Dynamics

Lithuania . 799 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Microchip USA

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One Stop Electronics

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Semicontronic

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Corphita

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Netroflash

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Ampacity Inc.

Singapore . 4 parts In-Stock

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Continental Prestige Electronics

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Supply Digital

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Argo Parts USA

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Overview

Unlock limitless possibilities with the XCZU5EG-1SFVC784I by Xilinx. As a leader in the industry, Xilinx guarantees top-notch quality and reliability. This versatile programmable SoC opens up a world of opportunities in various applications. From robotics to industrial automation, this product offers unparalleled value and benefits to customers. Experience seamless integration and enhanced performance with the XCZU5EG-1SFVC784I, setting new standards in the world of Other Function uPs, uCs, and Peripheral ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration onto circuit boards.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

No. of Terminals: 784

High number of terminals provides flexibility in connectivity options for the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and reliability in connections.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures product can function in various environments.

Maximum Operating Temperature: 100 °C

High maximum operating temperature indicates product's resilience in heat-sensitive conditions.

Terminal Finish: TIN SILVER COPPER

Triple finish enhances conductivity and durability of terminal connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access during assembly and maintenance.

Maximum Seated Height: 3.32 mm

Low seated height enables a compact product design suitable for space-constrained applications.

Width: 23 mm

Standard width measurement for ease of integration into various system designs.

Peak Reflow Temperature: 250 C

High peak reflow temperature ensures reliable soldering during manufacturing processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the product suitable for rugged environments.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable System-on-Chip offers versatility and customization options for diverse applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and ease of soldering.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent performance of the product.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density packing and miniaturization of the product.

Moisture Sensitivity Level (MSL): 4

MSL level of 4 indicates the product can withstand multiple reflow cycles without performance degradation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EG-1SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA784,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.32 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XCZU5EG-1SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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