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784 Other Function uPs,uCs & Peripheral ICs 75

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU5EV-3SFVC784E by Xilinx

XCZU5EV-3SFVC784E

Xilinx

XCZU5EV-3SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.9V. With 784 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5EV-L1SFVC784I by Xilinx

XCZU5EV-L1SFVC784I

Xilinx

The Xilinx XCZU5EV-L1SFVC784I is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU5EV-L2SFVC784E by Xilinx

XCZU5EV-L2SFVC784E

Xilinx

XCZU5EV-L2SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a rectangular grid array package. It operates at temperatures ranging from 0 to 110 °C and has a max supply voltage of 0.742 V. This IC is commonly used in various applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SFVC784E by Xilinx

XCZU2CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784E by Xilinx

XCZU2EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3CG-2SFVC784E by Xilinx

XCZU3CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3EG-2SFVC784E by Xilinx

XCZU3EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4CG-2SFVC784E by Xilinx

XCZU4CG-2SFVC784E

Xilinx

XCZU4CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with 0.85V supply voltage. Its 784-ball grid array package is ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4EG-2SFVC784E by Xilinx

XCZU4EG-2SFVC784E

Xilinx

XCZU4EG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 784 terminals is ideal for applications requiring high-performance computing in compact spaces.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4EV-2SFVC784E by Xilinx

XCZU4EV-2SFVC784E

Xilinx

XCZU4EV-2SFVC784E by Xilinx is a rectangular, surface mount microprocessor circuit with 784 terminals. It operates on a supply voltage range of 0.825 V to 0.876 V and has a max operating temperature of 100°C. This IC is commonly used in various applications requiring high-performance computing and advanced processing capabilities.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU5CG-2SFVC784E by Xilinx

XCZU5CG-2SFVC784E

Xilinx

XCZU5CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w 0-100°C, it has a nominal voltage of 0.85V and terminal pitch of 0.8mm, suitable for various embedded applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU5EG-2SFVC784E by Xilinx

XCZU5EG-2SFVC784E

Xilinx

XCZU5EG-2SFVC784E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance computing and programmable logic solutions.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EV-2SFVC784E by Xilinx

XCZU5EV-2SFVC784E

Xilinx

XCZU5EV-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for high-performance computing applications.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784I by Xilinx

XAZU2EG-1SFVC784I

Xilinx

Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784Q by Xilinx

XAZU2EG-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVC784I by Xilinx

XAZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784I by Xilinx

XAZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784Q by Xilinx

XAZU3EG-1SFVC784Q

Xilinx

Xilinx XAZU3EG-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8 mm and nominal voltage of 0.85 V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVC784I by Xilinx

XAZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-1SFVC784Q by Xilinx

XAZU4EV-1SFVC784Q

Xilinx

Xilinx XAZU4EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8mm and nominal voltage of 0.85V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-L1SFVC784I by Xilinx

XAZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784I by Xilinx

XAZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784Q by Xilinx

XAZU5EV-1SFVC784Q

Xilinx

Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-L1SFVC784I by Xilinx

XAZU5EV-L1SFVC784I

Xilinx

Xilinx XAZU5EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This package features 784 terminals in a GRID ARRAY, FINE PITCH style, suitable for various uPs and uCs applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

MPFS160T-1FCVG784E by Microchip Technology

MPFS160T-1FCVG784E

Microchip Technology

MPFS160T-1FCVG784E by Microchip Technology is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This GRID ARRAY IC is ideal for applications requiring fine pitch and surface mount capabilities in electronic devices.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B784

23 mm

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

PROGRAMMABLE SoC

MPFS250T-1FCVG784I by Microchip Technology

MPFS250T-1FCVG784I

Microchip Technology

MPFS250T-1FCVG784I by Microchip Tech is a 784-terminal IC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring PROGRAMMABLE SoC in a SQUARE GRID ARRAY package style.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B784

23 mm

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

PROGRAMMABLE SoC

MPFS095T-1FCVG784I by Microchip Technology

MPFS095T-1FCVG784I

Microchip Technology

MPFS095T-1FCVG784I by Microchip Technology is a 784-terminal GRID ARRAY IC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring PROGRAMMABLE SoC in compact SQUARE package style.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B784

23 mm

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

PROGRAMMABLE SoC