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XCZU4EG-1SFVC784E

Xilinx

XCZU4EG-1SFVC784E by Xilinx

XCZU4EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

Median Price

$1,101.250

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DigiKey

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Digiode

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VNN

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AZTECH Wire

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Overview

Unlock the power of innovation with the XCZU4EG-1SFVC784E by Xilinx. As a leader in cutting-edge semiconductor technology, Xilinx delivers unparalleled quality and reliability in their products. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers seamless integration and maximum performance. With advanced CMOS technology and a grid array package style, this product ensures superior functionality and efficiency. Experience the future of technology with Xilinx's XCZU4EG-1SFVC784E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy integration into circuit boards, saving space and simplifying the overall design process.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle varying power levels, ensuring stable performance in different operating conditions.

Package Shape: RECTANGULAR

The rectangular shape offers a standardized form factor, making it compatible with a wide range of mounting options and layouts.

No. of Terminals: 784

The high number of terminals allows for extensive connectivity options, enabling complex circuit configurations and functionalities.

Package Style (Meter): GRID ARRAY

The grid array design provides a compact footprint and efficient heat dissipation, making it suitable for compact and high-performance applications.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage helps in reducing power consumption and extending the battery life of the device.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable operation in demanding applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for use in both indoor and outdoor environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier routing of signals and power connections on the circuit board, improving overall design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time allows for quick and efficient soldering, reducing production time and costs.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature, this product can withstand the soldering process without compromising its structural integrity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit offers advanced processing capabilities, making this product ideal for high-performance computing tasks.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form offers reliable connections and easy soldering, ensuring robust electrical connections in various applications.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures consistent power delivery, optimizing the performance and efficiency of the product.

Moisture Sensitivity Level (MSL): 4

With a moderate moisture sensitivity level, this product can withstand humid and damp environments without compromising its functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EG-1SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EG-1SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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