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Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 957

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T4240NXN7PQB by NXP Semiconductors

T4240NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Length: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7PQB by NXP Semiconductors

T4241NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7QTB by NXP Semiconductors

T4241NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7TTB by NXP Semiconductors

T4241NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7PQB by NXP Semiconductors

T4241NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7QTB by NXP Semiconductors

T4241NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7TTB by NXP Semiconductors

T4241NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7PQB by NXP Semiconductors

T4241NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7QTB by NXP Semiconductors

T4241NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7TTB by NXP Semiconductors

T4241NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7PQB by NXP Semiconductors

T4241NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7QTB by NXP Semiconductors

T4241NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7TTB by NXP Semiconductors

T4241NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

DM3725CBPDR100 by Texas Instruments

DM3725CBPDR100

Texas Instruments

The Texas Instruments DM3725CBPDR100 microprocessor features a 26-bit address bus, 16-bit external data bus, and integrated cache. Ideal for industrial applications requiring a max clock frequency of 54 MHz and low power mode capability. Package style is grid array with very thin profile and fine pitch terminals.

26

YES

54 MHz

16

FLOATING POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

515

90 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.71 mm

1000 rpm

1.2 V

1.08 V

1.14 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

12 mm

MICROPROCESSOR, RISC

MCIMX6X2EVN10ABR by NXP Semiconductors

MCIMX6X2EVN10ABR

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;

32

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MCIMX7D2DVM12SC by NXP Semiconductors

MCIMX7D2DVM12SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

16

FLOATING POINT

YES

S-PBGA-B541

19 mm

YES

3

541

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1200 rpm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX6Q4AVT10ADR by NXP Semiconductors

MCIMX6Q4AVT10ADR

NXP Semiconductors

MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.

PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.

16

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

ATSAMA5D22C-CNR by Microchip Technology

ATSAMA5D22C-CNR

Microchip Technology

ATSAMA5D22C-CNR by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, thin profile, fine pitch with terminal finish of tin silver copper nickel.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B196

e2

11 mm

YES

32

1

196

8

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,30

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

1.2 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.75 mm

BOTTOM

11 mm

MICROPROCESSOR, RISC

ATSAMA5D22C-CN by Microchip Technology

ATSAMA5D22C-CN

Microchip Technology

Microchip Technology's ATSAMA5D22C-CN is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 1.2 mm seated height. Ideal for industrial applications, it features a RISC architecture, 196 terminals in a grid array package style, and operates at temperatures ranging from -40 to 105 °C.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B196

e2

11 mm

YES

32

1

196

8

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,30

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

1.2 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.75 mm

BOTTOM

11 mm

MICROPROCESSOR, RISC

ATSAMA5D22C-CU by Microchip Technology

ATSAMA5D22C-CU

Microchip Technology

ATSAMA5D22C-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 196 terminals. Ideal for industrial applications, it features a floating-point format, boundary scan capability, and low power mode for efficient performance.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B196

e2

11 mm

YES

32

1

196

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,30

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

1.2 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.75 mm

BOTTOM

11 mm

MICROPROCESSOR, RISC

ATSAMA5D26C-CNR by Microchip Technology

ATSAMA5D26C-CNR

Microchip Technology

ATSAMA5D26C-CNR by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 1.25 V nominal voltage. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features integrated cache, boundary scan support, and 32 DMA channels for efficient data handling.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

ATSAMA5D26C-CN by Microchip Technology

ATSAMA5D26C-CN

Microchip Technology

The Microchip Technology ATSAMA5D26C-CN microprocessor features 32-bit architecture, 131072 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption, it offers 32 DMA channels and operates in an extended temperature range from -40 to 105 °C.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

ATSAMA5D27C-CN by Microchip Technology

ATSAMA5D27C-CN

Microchip Technology

Microchip's ATSAMA5D27C-CN is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at up to 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

ATSAMA5D27C-CU by Microchip Technology

ATSAMA5D27C-CU

Microchip Technology

ATSAMA5D27C-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

DM383AAAR21F by Texas Instruments

DM383AAAR21F

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 609; Package Code: LFBGA; Package Shape: SQUARE;

27

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B609

e1

16 mm

YES

3

609

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

16 mm

MICROPROCESSOR, RISC

DM383AAAR21 by Texas Instruments

DM383AAAR21

Texas Instruments

The Texas Instruments DM383AAAR21 microprocessor features a 32-bit architecture with 27-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 30 MHz, making it suitable for low-power applications requiring high-speed processing. With integrated cache memory and boundary scan capability, this processor is ideal for compact devices in industrial automation and IoT systems.

27

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B609

e1

16 mm

YES

3

609

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

16 mm

MICROPROCESSOR, RISC

AM3351BZCE30R by Texas Instruments

AM3351BZCE30R

Texas Instruments

AM3351BZCE30R by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 26 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and IoT devices.

ALSO OPERATES AT MIN 0.912 V

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

300 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

AM3351BZCE60R by Texas Instruments

AM3351BZCE60R

Texas Instruments

AM3351BZCE60R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With a package style of grid array and boundary scan support, it's ideal for embedded systems requiring high-speed processing in compact form factors.

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

600 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

HPSDM8148CCYE2 by Texas Instruments

HPSDM8148CCYE2

Texas Instruments

The Texas Instruments HPSDM8148CCYE2 microprocessor features 32-bit architecture, 1.42V max supply voltage, and 30MHz clock frequency. Ideal for applications requiring high-speed processing in a compact form factor with integrated cache and low power mode support.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

1114112

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR, RISC

MTDM8148CCYE2 by Texas Instruments

MTDM8148CCYE2

Texas Instruments

The Texas Instruments MTDM8148CCYE2 microprocessor features 32-bit architecture, 1114112 RAM words, and a max clock frequency of 30 MHz. Ideal for applications requiring high-speed processing and low power consumption in industrial settings.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

1114112

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR, RISC

AM5718AZBOXEM by Texas Instruments

AM5718AZBOXEM

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: MILITARY; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE;

ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED

16

YES

32 MHz

32

FIXED POINT

NO

S-PBGA-B760

e0

23 mm

YES

3

1

760

8

125 Cel

-55 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

524288

AEC-Q100

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

MILITARY

TIN LEAD

BALL

BOTTOM

23 mm

MICROPROCESSOR, RISC

LS1020ASE7HNB by NXP Semiconductors

LS1020ASE7HNB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Integrated Cache: YES;

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

800 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020ASE7KQB by NXP Semiconductors

LS1020ASE7KQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Width: 19 mm;

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020ASN7HNB by NXP Semiconductors

LS1020ASN7HNB

NXP Semiconductors

LS1020ASN7HNB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133.3 MHz. It features a CMOS technology, 16-bit address bus width, and low power mode, suitable for applications requiring high-speed processing in compact devices.

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

800 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020ASN7KQB by NXP Semiconductors

LS1020ASN7KQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; External Data Bus Width: 32;

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020AXE7HNB by NXP Semiconductors

LS1020AXE7HNB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

800 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020AXE7KQB by NXP Semiconductors

LS1020AXE7KQB

NXP Semiconductors

LS1020AXE7KQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133.3 MHz. It features a 16-bit address bus width and external data bus width of 32 bits, suitable for applications requiring low power mode and boundary scan capabilities.

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

LS1020AXN7KQB by NXP Semiconductors

LS1020AXN7KQB

NXP Semiconductors

LS1020AXN7KQB by NXP Semiconductors is a Microprocessor with 32-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It features integrated cache, operates at a max clock frequency of 133.3 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in compact devices.

16

32

YES

133.3 MHz

32

FLOATING POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

525

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

ATSAMA5D225C-D1M-CU by Microchip Technology

ATSAMA5D225C-D1M-CU

Microchip Technology

ATSAMA5D225C-D1M-CU by Microchip Technology is a microprocessor with integrated cache and a max clock frequency of 24 MHz. It is used in industrial applications, has a temperature range of -40 to 85 °C, and features low power mode for energy efficiency.

0

16

YES

24 MHz

0

FIXED POINT

YES

S-PBGA-B196

e2

11 mm

YES

51

1

196

16

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,30

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

65536

1.2 mm

500 rpm

1.3 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.75 mm

BOTTOM

11 mm

MICROPROCESSOR, RISC

ATSAMA5D41B-CU by Microchip Technology

ATSAMA5D41B-CU

Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

50 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

2

289

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

131072

TS 16949

1.4 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

14 mm

MICROPROCESSOR, RISC

ATSAMA5D42B-CU by Microchip Technology

ATSAMA5D42B-CU

Microchip Technology

ATSAMA5D42B-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and high-speed processing. The package style is grid array, thin profile, fine pitch, making it ideal for compact designs in automotive or embedded systems.

26

32

YES

50 MHz

32

FLOATING POINT

YES

S-PBGA-B361

16 mm

YES

32

1

2

361

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

TS 16949

1.2 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

16 mm

MICROPROCESSOR, RISC

ATSAMA5D44B-CU by Microchip Technology

ATSAMA5D44B-CU

Microchip Technology

ATSAMA5D44B-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 50 MHz clock frequency, and 32 DMA channels. Ideal for industrial applications, it features low power mode, floating point format, and RISC technology for efficient processing.

26

32

YES

50 MHz

32

FLOATING POINT

YES

S-PBGA-B361

16 mm

YES

32

1

2

361

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

TS 16949

1.2 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

16 mm

MICROPROCESSOR, RISC

MCIMX6L2DVN10AC by NXP Semiconductors

MCIMX6L2DVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.1 mm;

S-PBGA-B

e1

13 mm

3

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6L2EVN10AC by NXP Semiconductors

MCIMX6L2EVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

S-PBGA-B

e1

13 mm

3

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6L3EVN10AC by NXP Semiconductors

MCIMX6L3EVN10AC

NXP Semiconductors

MCIMX6L3EVN10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.375V to 1.5V. Ideal for industrial applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B

e1

13 mm

3

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6L8DVN10AC by NXP Semiconductors

MCIMX6L8DVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B

e1

13 mm

3

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AB by NXP Semiconductors

MCIMX6DP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AB by NXP Semiconductors

MCIMX6QP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC