Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.
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FS32V234CMN1VUB
NXP Semiconductors
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
0
64
YES
40 MHz
FLOATING POINT
S-PBGA-B621
e2
17 mm
3
32
1
621
8
125 Cel
-40 Cel
PLASTIC/EPOXY
FBGA
BGA621,25X25,25
SQUARE
GRID ARRAY, FINE PITCH
260
4194304
AEC-Q100
2.44 mm
1000 rpm
1.05 V
.95 V
1 V
CMOS
INDUSTRIAL
TIN SILVER
BALL
.65 mm
BOTTOM
40
MICROPROCESSOR, RISC
FS32V234CON1VUB
SVF311R3K2CKU2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;
S-PQFP-G176
e3
24 mm
176
85 Cel
HLFQFP
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
1.6 mm
266 rpm
1.26 V
1.16 V
1.23 V
TIN
GULL WING
.5 mm
QUAD
P1012NXE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
16
S-PBGA-B689
31 mm
689
BGA
GRID ARRAY
2.46 mm
800 rpm
1 mm
CP3CN37VVAWQX/NOPB
Texas Instruments
CP3CN37VVAWQX/NOPB by Texas Instruments is a Microprocessor with 20-bit Address Bus, 16-bit External Data Bus, and Integrated Cache. It operates b/w -40 to 85°C, suitable for industrial applications requiring low power consumption and high-speed processing. The package style is flatpack with matte tin terminal finish, making it ideal for surface mount assembly in compact electronic devices.
20
FIXED POINT
S-PQFP-G144
20 mm
144
LFQFP
FLATPACK, LOW PROFILE, FINE PITCH
96 rpm
3.7 V
2.7 V
3.3 V
MATTE TIN
30
MIMXRT1051DVL6A
NXP Semiconductors' MIMXRT1051DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for low power applications, it offers integrated cache, 29 serial I/Os, and supports boundary scan technology.
24 MHz
FLOATING-POINT
S-PBGA-B196
10 mm
29
196
95 Cel
0 Cel
LFBGA
BGA196,14X14,25
GRID ARRAY, LOW PROFILE, FINE PITCH
524288
1.43 mm
600 rpm
105 mA
1.3 V
1.25 V
OTHER
P2040NXE7MMC
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;
e1
245
TIN SILVER COPPER
MIMXRT1021DAF5A
NXP Semiconductors' MIMXRT1021DAF5A microprocessor features 32-bit architecture, 262144 RAM words, and 24 MHz clock frequency. Ideal for applications requiring low power mode, it offers 57 I/O lines and integrated PWM channels for efficient performance in various embedded systems.
13
S-PQFP-G100
14 mm
57
14
100
QFP100,.63SQ,20
262144
1.7 mm
500 rpm
90 mA
S9S08RN16W2MLFR
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
MICROPROCESSOR
S9S08RN16W2MTJR
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RN48W1MLCR
MICROPROCESSOR; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
S9S08RN8W2MTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MIMXRT1061DVL6A
MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MICROCONTROLLER, RISC
LS1043ASE7KQB
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
ALSO OPERATES AT 1V NOMINAL SUPPLY
21 mm
105 Cel
250
2.07 mm
.93 V
.87 V
.9 V
.8 mm
SoC
LS1043ASE7PQB
1400 rpm
LS1043ASE7QQB
1600 rpm
LS1043ASE8PQB
LS1043ASE8PQB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 32-bit external data bus width, and low power mode. It is used in System on Chip (SoC) applications for high-speed processing at temperatures up to 105°C.
S-PBGA-B780
23 mm
780
LS1043ASN8MQB
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
1200 rpm
LS1043AXE7QQB
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
MIMXRT1064DVL6A
The NXP Semiconductors MIMXRT1064DVL6A is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
10
1048576
110 mA
MIMXRT1015DAF5A
NXP Semiconductors' MIMXRT1015DAF5A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 131072 RAM words. Ideal for low power applications, it offers integrated cache, 1.25-1.3 V supply voltage range, and 16 serial I/Os for efficient data processing in compact designs.
131072
MPC8572CLVJAULE
MICROPROCESSOR; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e2;
MPC8572LVJAULE
MICROPROCESSOR; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572LVJAVNE
MICROPROCESSOR; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572VJATLE
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER;
MPC8572VJAULE
MICROPROCESSOR; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
MPC8572VJAVNE
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245;
S9S08RN16W2VLC
MICROPROCESSOR; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
S9S08RN16W2VTG
MICROPROCESSOR; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S9S08RN16W2VTJR
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
S9S08RN16W2VTJ
MICROPROCESSOR; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2MLCR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
S9S08RNA16W2MLC
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2MLF
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RNA16W2MTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
S9S08RNA16W2MTG
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
S9S08RNA16W2MTJR
MICROPROCESSOR; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
S9S08RNA16W2MTJ
MICROPROCESSOR; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VLCR
MICROPROCESSOR; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VLC
S9S08RNA16W2VTGR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08RNA16W2VTG
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
S9S08RNA16W2VTJR
MICROPROCESSOR; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA16W2VTJ
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08RNA8W2CLFR
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08RNA8W2CTJR
MICROPROCESSOR; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA8W2CTJ
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08RNA8W2MLC
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
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