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Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 957

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LX2080XN71826B by NXP Semiconductors

LX2080XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC72029B by NXP Semiconductors

LX2120SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC72232B by NXP Semiconductors

LX2120SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC71826B by NXP Semiconductors

LX2120XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72232B by NXP Semiconductors

LX2120XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72232B by NXP Semiconductors

LX2120XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72029B by NXP Semiconductors

LX2160XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72232B by NXP Semiconductors

LX2160XC72232B

NXP Semiconductors

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72029B by NXP Semiconductors

LX2160XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

MIMXRT1061DVJ6B by NXP Semiconductors

MIMXRT1061DVJ6B

NXP Semiconductors

MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;

e2

3

260

TIN SILVER

40

MICROCONTROLLER, RISC

MIMXRT1061DVL6B by NXP Semiconductors

MIMXRT1061DVL6B

NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT106ADVL6A by NXP Semiconductors

MIMXRT106ADVL6A

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT1062DVL6B by NXP Semiconductors

MIMXRT1062DVL6B

NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

LS1012AXE7HKB by NXP Semiconductors

LS1012AXE7HKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASE7HKB by NXP Semiconductors

LS1012ASE7HKB

NXP Semiconductors

The NXP LS1012ASE7HKB microprocessor features a 64-bit architecture, 16-bit address and data bus width, and operates at a max clock frequency of 25 MHz. Ideal for low power applications, it is designed for use in microprocessor-based systems requiring high performance with integrated cache memory.

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7KKB by NXP Semiconductors

LS1012AXN7KKB

NXP Semiconductors

LS1012AXN7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address and data bus width, operating at up to 25 MHz. Ideal for industrial applications, it features low power mode, integrated cache, and boundary scan support for efficient performance in compact designs.

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

1000 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7EKB by NXP Semiconductors

LS1012AXN7EKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7HKB by NXP Semiconductors

LS1012AXN7HKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASN7EKB by NXP Semiconductors

LS1012ASN7EKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASE7EKB by NXP Semiconductors

LS1012ASE7EKB

NXP Semiconductors

LS1012ASE7EKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. It features integrated cache, low power mode, and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact devices.

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXE7EKB by NXP Semiconductors

LS1012AXE7EKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

T1040NSN7WQB by NXP Semiconductors

T1040NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NXN7PQB by NXP Semiconductors

T1040NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NXN7MQB by NXP Semiconductors

T1040NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NSN7PQB by NXP Semiconductors

T1040NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NSN7MQB by NXP Semiconductors

T1040NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

P1010NSN5HFB by NXP Semiconductors

P1010NSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5FFB by NXP Semiconductors

P1010NXE5FFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5KHB by NXP Semiconductors

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5HFB by NXP Semiconductors

P1010NXE5HFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5KHB by NXP Semiconductors

P1010NXE5KHB

NXP Semiconductors

The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5FFB by NXP Semiconductors

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSE5FFB by NXP Semiconductors

P1010NSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5DFB by NXP Semiconductors

P1010NSN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5FFB by NXP Semiconductors

P1010NSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5KHB by NXP Semiconductors

P1010NSN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5DFB by NXP Semiconductors

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MIMXRT1024DAG5A by NXP Semiconductors

MIMXRT1024DAG5A

NXP Semiconductors

NXP's MIMXRT1024DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for low power applications with its integrated cache, it offers 3.6V max supply voltage and operates b/w 0-95°C.

13

32

YES

24 MHz

16

FLOATING POINT

YES

S-PQFP-G144

20 mm

YES

3

32

8

144

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

500 rpm

90 mA

3.6 V

3 V

3.3 V

YES

CMOS

OTHER

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1024CAG4A by NXP Semiconductors

MIMXRT1024CAG4A

NXP Semiconductors

The NXP Semiconductors MIMXRT1024CAG4A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PQFP-G144

20 mm

YES

3

32

0

20

144

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

396 rpm

90 mA

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1171AVM8A by NXP Semiconductors

MIMXRT1171AVM8A

NXP Semiconductors

NXP's MIMXRT1171AVM8A microprocessor features integrated cache, 32 DMA channels, and 48 MHz clock frequency. Ideal for automotive applications due to its low power mode, CMOS technology, and wide temperature range (-40 to 125 °C).

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1172AVM8A by NXP Semiconductors

MIMXRT1172AVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1172AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 125 °C and supports low power mode.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1175AVM8A by NXP Semiconductors

MIMXRT1175AVM8A

NXP Semiconductors

The NXP MIMXRT1175AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C with low power mode support.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

LS1012ASE7HKA by NXP Semiconductors

LS1012ASE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASN7EKA by NXP Semiconductors

LS1012ASN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXE7HKA by NXP Semiconductors

LS1012AXE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7EKA by NXP Semiconductors

LS1012AXN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASE7EKA by NXP Semiconductors

LS1012ASE7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

MCIMX537CVP8C2 by NXP Semiconductors

MCIMX537CVP8C2

NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

32

52

529

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

800 rpm

800 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC