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Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 957

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX535DVP2C2 by NXP Semiconductors

MCIMX535DVP2C2

NXP Semiconductors

MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1200 rpm

800 mA

1.4 V

1.3 V

1.35 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX535DVP1C2 by NXP Semiconductors

MCIMX535DVP1C2

NXP Semiconductors

MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1000 rpm

800 mA

1.4 V

1.2 V

1.25 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MIMXRT1021DAF5B by NXP Semiconductors

MIMXRT1021DAF5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1021DAF5B is a 32-bit microprocessor with integrated cache and a max clock frequency of 24 MHz. It is commonly used in applications requiring low power mode, such as IoT devices and wearable technology.

13

32

YES

24 MHz

32

FLOATING POINT

YES

S-PQFP-G100

e3

14 mm

YES

3

32

14

100

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.7 mm

500 rpm

90 mA

1.3 V

1.25 V

YES

CMOS

OTHER

TIN

GULL WING

.5 mm

QUAD

40

14 mm

MICROPROCESSOR, RISC

T1023NSN7KQA by NXP Semiconductors

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7KQA by NXP Semiconductors

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7MQA by NXP Semiconductors

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7KQA by NXP Semiconductors

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7MQA by NXP Semiconductors

T1023NXE7MQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7MQA by NXP Semiconductors

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7KQA by NXP Semiconductors

T1013NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7MQA by NXP Semiconductors

T1013NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7PQA by NXP Semiconductors

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7KQA by NXP Semiconductors

T1013NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7PQA by NXP Semiconductors

T1013NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7KQA by NXP Semiconductors

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7MQA by NXP Semiconductors

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7PQA by NXP Semiconductors

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7PQA by NXP Semiconductors

T1023NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7PQA by NXP Semiconductors

T1023NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7KQA by NXP Semiconductors

T1023NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7PQA by NXP Semiconductors

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7MQA by NXP Semiconductors

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7KQA by NXP Semiconductors

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7PQA by NXP Semiconductors

T1013NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1013NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It is designed for applications requiring high-speed processing and low power consumption, with integrated cache memory and support for boundary scan testing.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7MQA by NXP Semiconductors

T1023NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

AM6548BACDXEAF by Texas Instruments

AM6548BACDXEAF

Texas Instruments

Texas Instruments AM6548BACDXEAF is a 32-bit microprocessor with 1.05-1.15 V supply voltage range, operating from -40 to 105 °C. Features include 27 MHz clock frequency, 16-bit external data bus width, and integrated cache for industrial applications requiring low power mode and boundary scan capabilities.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

e1

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC

AM6526BACDXA by Texas Instruments

AM6526BACDXA

Texas Instruments

AM6526BACDXA by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM width and 16-bit external data bus width. It operates at a max clock frequency of 27 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

e1

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC

AM6526BACDXEAF by Texas Instruments

AM6526BACDXEAF

Texas Instruments

The Texas Instruments AM6526BACDXEAF microprocessor features 32-bit architecture, 8-word data RAM width, and a max clock frequency of 27 MHz. Ideal for industrial applications requiring high-speed processing with low power consumption.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

e1

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC

AM6528BACDXEA by Texas Instruments

AM6528BACDXEA

Texas Instruments

The Texas Instruments AM6528BACDXEA microprocessor features 32-bit architecture, 1.15V max supply voltage, and 27MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

e1

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC

LS1028AXE7KQA by NXP Semiconductors

LS1028AXE7KQA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

64

YES

32

FIXED-POINT

YES

S-PBGA-B448

17 mm

YES

3

1

33

448

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30x30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

TDA4VM88TGBALFR by Texas Instruments

TDA4VM88TGBALFR

Texas Instruments

TDA4VM88TGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various embedded systems.

0

64

YES

27 MHz

32

FLOATING-POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

26

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

DRA829VMTGBALFR by Texas Instruments

DRA829VMTGBALFR

Texas Instruments

DRA829VMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for high-speed computing applications. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various industrial settings.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

3670016

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

TDA4VM88TGBALFRQ1 by Texas Instruments

TDA4VM88TGBALFRQ1

Texas Instruments

TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.

0

64

YES

27 MHz

32

FLOATING-POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

26

827

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

MIMXRT1021DAG5B by NXP Semiconductors

MIMXRT1021DAG5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1021DAG5B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 262144 RAM words. Ideal for low power applications with a max supply voltage of 1.3V, it offers integrated cache and 32 DMA channels for efficient data processing.

13

32

YES

24 MHz

32

FLOATING POINT

YES

S-PQFP-G144

20 mm

YES

3

32

14

144

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

500 rpm

90 mA

1.3 V

1.25 V

YES

CMOS

OTHER

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1015CAF4B by NXP Semiconductors

MIMXRT1015CAF4B

NXP Semiconductors

The NXP Semiconductors MIMXRT1015CAF4B microprocessor features a 32-bit architecture with integrated cache and 131072 RAM words. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. With 32 DMA channels and 6 serial I/Os, it offers versatile connectivity options in a compact square package.

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PQFP-G100

14 mm

YES

3

32

0

6

100

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

131072

1.7 mm

396 rpm

90 mA

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

40

14 mm

MICROPROCESSOR, RISC

DRA829JMTGBALFR by Texas Instruments

DRA829JMTGBALFR

Texas Instruments

DRA829JMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates b/w -40 to 105 °C, has a max clock frequency of 27 MHz, and features boundary scan for testing. Ideal for applications requiring high-speed processing in automotive systems or industrial automation.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

DRA829JMTGBALFRQ1 by Texas Instruments

DRA829JMTGBALFRQ1

Texas Instruments

DRA829JMTGBALFRQ1 by Texas Instruments is a Microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. It operates b/w -40 to 125 °C and features a max clock frequency of 27 MHz. Ideal for automotive applications requiring high processing power in a compact package.

0

64

YES

27 MHz

32

FIXED POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

31

827

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC

T2080NXN8MQB by NXP Semiconductors

T2080NXN8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8P1B by NXP Semiconductors

T2080NXE8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8MQB by NXP Semiconductors

T2080NXE8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

P2020PSE2MZB by NXP Semiconductors

P2020PSE2MZB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Speed: 1200 rpm;

16

YES

64

FIXED POINT

YES

S-PBGA-B689

31 mm

YES

4

7

689

125 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA689,29X29,40

SQUARE

GRID ARRAY

2.46 mm

1200 rpm

1.1 V

1 V

1.05 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

MICROPROCESSOR, RISC

AT91SAM9G45-CU-999 by Microchip Technology

AT91SAM9G45-CU-999

Microchip Technology

Microchip AT91SAM9G45-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 50 MHz clock frequency and features integrated cache for enhanced performance. Ideal for low power applications due to its min supply voltage of 0.9 V and max seated height of 1.2 mm.

26

32

YES

50 MHz

32

FIXED POINT

YES

S-PBGA-B324

15 mm

YES

37

1

7

324

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

65536

1.2 mm

400 rpm

1.1 V

.9 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

15 mm

MICROPROCESSOR, RISC

AT91SAM9G45B-CU-999 by Microchip Technology

AT91SAM9G45B-CU-999

Microchip Technology

AT91SAM9G45B-CU-999 by Microchip Technology is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 50 MHz, suitable for applications requiring high-speed processing. With 37 DMA channels and low power mode, it is ideal for embedded systems needing efficient data transfer and energy-saving capabilities.

26

32

YES

50 MHz

32

FIXED POINT

YES

S-PBGA-B324

15 mm

YES

37

1

7

324

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

65536

1.2 mm

400 rpm

1.1 V

.9 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

15 mm

MICROPROCESSOR, RISC

FS32V234CTN1VUB by NXP Semiconductors

FS32V234CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Integrated Cache: YES;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V232CTN1VUB by NXP Semiconductors

FS32V232CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MMC2001HCAB33B by NXP Semiconductors

MMC2001HCAB33B

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;

22

32

YES

16.38 MHz

16

FIXED POINT

NO

S-PQFP-G144

20 mm

YES

3

8

2

144

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

32768

1.6 mm

34 rpm

40 mA

3.6 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

AM6546BACDXA by Texas Instruments

AM6546BACDXA

Texas Instruments

The Texas Instruments AM6546BACDXA microprocessor features 32-bit architecture, 8-word data RAM width, and 16-bit external data bus. Ideal for applications requiring high-speed processing, it operates at a max clock frequency of 27 MHz with low power mode support. The package style is grid array with a square shape and a terminal pitch of 0.8 mm.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC

HD6417750SX167V by Renesas Electronics

HD6417750SX167V

Renesas Electronics

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of External Interrupts: 5;

26

32

YES

34 MHz

64

FLOATING POINT

YES

S-PQFP-G208

28 mm

YES

4

5

2

208

8

75 Cel

-20 Cel

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

3.56 mm

167 rpm

650 mA

2 V

1.6 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

28 mm

MICROPROCESSOR, RISC