Loading...

DRA829JMTGBALFRQ1

Texas Instruments

DRA829JMTGBALFRQ1 by Texas Instruments

DRA829JMTGBALFRQ1 by Texas Instruments is a Microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. It operates b/w -40 to 125 °C and features a max clock frequency of 27 MHz. Ideal for automotive applications requiring high processing power in a compact package.

Median Price

$91.238

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,547 parts In-Stock

1+ parts

$91.238

100+ parts

$88.494

1k+ parts

$68.600

10k+ parts

-

1,547

$91.238

$88.494

$68.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,073 parts In-Stock

1+ parts

$86.676

100+ parts

-

1k+ parts

-

10k+ parts

-

2,073

$86.676

-

-

-

Vyrian

USA . 7,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,554

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 91 parts In-Stock

1+ parts

$8.040

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$8.040

-

-

-

Parana Technologies

USA . 968 parts In-Stock

1+ parts

$21.890

100+ parts

-

1k+ parts

$22.381

10k+ parts

-

968

$21.890

-

$22.381

-

DigiPath Technology Company

USA . 1,257 parts In-Stock

1+ parts

$24.103

100+ parts

$22.175

1k+ parts

-

10k+ parts

-

1,257

$24.103

$22.175

-

-

Native Components

USA . 351 parts In-Stock

1+ parts

$24.298

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$24.298

-

-

-

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$24.595

100+ parts

$23.365

1k+ parts

$22.136

10k+ parts

-

179

$24.595

$23.365

$22.136

-

ChromeModa Solutions

Germany . 67 parts In-Stock

1+ parts

$24.595

100+ parts

$20.168

1k+ parts

-

10k+ parts

-

67

$24.595

$20.168

-

-

Northwest PG Solutions

USA . 2,111 parts In-Stock

1+ parts

$26.727

100+ parts

$24.055

1k+ parts

-

10k+ parts

-

2,111

$26.727

$24.055

-

-

Corphita

USA . 1,417 parts In-Stock

1+ parts

$82.114

100+ parts

-

1k+ parts

-

10k+ parts

-

1,417

$82.114

-

-

-

Microchip USA

USA . 2,452 parts In-Stock

1+ parts

$120.050

100+ parts

$116.850

1k+ parts

$115.250

10k+ parts

$113.650

2,452

$120.050

$116.850

$115.250

$113.650

Lixinc

USA . 2,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,506

-

-

-

-

Perfect Parts

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Overview

Enhance your projects with the DRA829JMTGBALFRQ1 by Texas Instruments, a top-of-the-line microprocessor that guarantees unmatched quality and reliability. With a focus on innovation and cutting-edge technology, Texas Instruments is a trusted manufacturer renowned for creating high-performance solutions. Ideal for a wide range of applications, this microprocessor offers customers unparalleled value, benefits, and advantages. Elevate your designs with the DRA829JMTGBALFRQ1 and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor suitable for portable devices.

Integrated Cache: YES

Having integrated cache helps improve the performance and efficiency of the microprocessor by reducing memory access time.

Maximum Supply Voltage: 0.84 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and multitasking capabilities.

Screening Level: AEC-Q100

This level of screening ensures high quality and reliability, making the microprocessor suitable for automotive applications.

Bit Size: 64

A 64-bit architecture enables the microprocessor to handle large amounts of data and perform complex calculations efficiently.

No. of Terminals: 827

The high number of terminals allows for the microprocessor to connect with a wide range of peripherals and devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the microprocessor suitable for industrial and automotive applications where temperature can vary.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microprocessor can function in cold environments without reliability issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers high performance and efficiency in processing instructions.

Technology: CMOS

CMOS technology allows for low power consumption and high speed operation, making it suitable for a variety of applications.

Technical Specifications

Microprocessors DRA829JMTGBALFRQ1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B827

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Serial I/Os:

31

No. of Terminals:

827

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA827,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

9961472

Screening Level:

AEC-Q100

Maximum Seated Height:

2.8 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

DRA829JMTGBALFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2