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DRA829JMTGBALFR

Texas Instruments

DRA829JMTGBALFR by Texas Instruments

DRA829JMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates b/w -40 to 105 °C, has a max clock frequency of 27 MHz, and features boundary scan for testing. Ideal for applications requiring high-speed processing in automotive systems or industrial automation.

Median Price

$115.656

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 796 parts In-Stock

1+ parts

$86.676

100+ parts

$84.069

1k+ parts

$65.170

10k+ parts

-

796

$86.676

$84.069

$65.170

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Mouser Electronics

USA . 204 parts In-Stock

1+ parts

$116.170

100+ parts

$90.390

1k+ parts

$84.360

10k+ parts

-

204

$116.170

$90.390

$84.360

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$115.656

10k+ parts

-

250

-

-

$115.656

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 484 parts In-Stock

1+ parts

$82.342

100+ parts

-

1k+ parts

-

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484

$82.342

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-

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Vyrian

USA . 5,765 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 692 parts In-Stock

1+ parts

$0.672

100+ parts

-

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692

$0.672

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-

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Northwest PG Solutions

USA . 1,636 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

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1,636

$0.740

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-

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Parana Technologies

USA . 1,799 parts In-Stock

1+ parts

$54.673

100+ parts

-

1k+ parts

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1,799

$54.673

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DigiPath Technology Company

USA . 270 parts In-Stock

1+ parts

$60.201

100+ parts

-

1k+ parts

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270

$60.201

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ChromeModa Solutions

Germany . 6,037 parts In-Stock

1+ parts

$61.430

100+ parts

$50.373

1k+ parts

-

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6,037

$61.430

$50.373

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$61.430

100+ parts

$58.358

1k+ parts

$55.287

10k+ parts

-

1,425

$61.430

$58.358

$55.287

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Corphita

USA . 3,025 parts In-Stock

1+ parts

$78.008

100+ parts

-

1k+ parts

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10k+ parts

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3,025

$78.008

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Overview

Experience the ultimate in performance and reliability with the Texas Instruments DRA829JMTGBALFR microprocessor. Crafted with precision and cutting-edge technology, this powerhouse of a chip is perfect for a wide range of applications, from automotive to industrial. With integrated cache and a wide data RAM width, this microprocessor offers unparalleled speed and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and discover the countless benefits and advantages that the DRA829JMTGBALFR can bring to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product durable and resistant to external factors, ensuring reliability in various operating conditions.

Integrated Cache: YES

The integrated cache improves the performance of the microprocessor by reducing the average time to access data, making it suitable for high-speed computing applications.

Surface Mount: YES

Being surface mountable makes the installation and replacement process easier and more efficient, saving time and effort during assembly or maintenance.

Maximum Supply Voltage: 0.84 V

The maximum supply voltage of 0.84 V ensures safe and efficient operation of the microprocessor, preventing potential damage due to overvoltage.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 improves data processing speed and efficiency, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into electronic devices, making the microprocessor a compact and versatile component.

Bit Size: 64

With a bit size of 64, the microprocessor can handle large amounts of data and perform complex calculations with high precision and accuracy.

No. of Terminals: 827

The large number of terminals enables the microprocessor to interface with multiple components and peripherals, expanding its connectivity and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style provides efficient thermal dissipation and enhanced electrical performance, contributing to the reliability and overall quality of the microprocessor.

Minimum Supply Voltage: 0.76 V

The minimum supply voltage of 0.76 V ensures the microprocessor's stability and functionality even under low power conditions, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the microprocessor to withstand elevated temperatures without compromising performance, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the microprocessor's functionality in cold environments, making it versatile for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and facilitates better heat dissipation, optimizing the performance and longevity of the microprocessor.

Maximum Seated Height: 2.8 mm

The maximum seated height of 2.8 mm allows for compact and space-saving designs when integrating the microprocessor into electronic devices, enhancing overall product aesthetics and functionality.

RAM Words: 9961472

With a large RAM capacity of 9961472 words, the microprocessor can efficiently handle and process a vast amount of data, enabling high-performance computing in various applications.

Width: 24 mm

The compact width of 24 mm allows for flexible integration into electronic devices with space constraints, ensuring versatility and compatibility in a wide range of applications.

Boundary Scan: YES

The boundary scan capability enables efficient testing and debugging of the microprocessor's connections and functionality, ensuring high product quality and reliability.

External Data Bus Width: 32

With an external data bus width of 32, the microprocessor can efficiently transfer data between external components, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 27 MHz

The high maximum clock frequency of 27 MHz allows the microprocessor to perform tasks quickly and efficiently, making it ideal for compute-intensive applications that require high-speed processing.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures the microprocessor's reliability during the soldering process, contributing to the quality and longevity of the product.

Length: 24 mm

The compact length of 24 mm contributes to the overall space-saving design of the microprocessor, making it suitable for integration into a variety of electronic devices and applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers simplified instruction set architecture and optimized performance for specific computing tasks, making it efficient and suitable for targeted applications.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption, high noise immunity, and fast switching speeds, making it energy-efficient and reliable for a range of applications.

Terminal Form: BALL

The ball terminal form facilitates easy and reliable connections, ensuring efficient signal transmission and robust performance of the microprocessor in diverse applications.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8 V ensures stable and efficient operation of the microprocessor across various operating conditions, contributing to its reliability and longevity.

No. of Serial I/Os: 31

The 31 serial I/Os enable the microprocessor to communicate with multiple peripherals and devices simultaneously, expanding its connectivity and functionality in complex systems.

Terminal Pitch: 0.8 mm

The compact terminal pitch of 0.8 mm allows for efficient space utilization and high-density integration of the microprocessor, enhancing its versatility and compatibility in modern electronic designs.

Format: FIXED POINT

The fixed-point format supports efficient arithmetic operations and simplifies data processing tasks, making the microprocessor suitable for real-time computing and signal processing applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor is resistant to moisture-related damage during storage and assembly processes, ensuring long-term reliability and performance.

Speed: 2000 rpm

The high-speed capability of 2000 rpm allows the microprocessor to quickly execute instructions and process data, enhancing overall system performance and responsiveness in demanding applications.

Low Power Mode: YES

The low power mode feature enables the microprocessor to conserve energy during idle or low-load conditions, promoting energy efficiency and extending battery life in portable devices.

Technical Specifications

Microprocessors DRA829JMTGBALFR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B827

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Serial I/Os:

31

No. of Terminals:

827

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA827,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

9961472

Maximum Seated Height:

2.8 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

DRA829JMTGBALFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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