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AM6546BACDXA

Texas Instruments

AM6546BACDXA by Texas Instruments

The Texas Instruments AM6546BACDXA microprocessor features 32-bit architecture, 8-word data RAM width, and 16-bit external data bus. Ideal for applications requiring high-speed processing, it operates at a max clock frequency of 27 MHz with low power mode support. The package style is grid array with a square shape and a terminal pitch of 0.8 mm.

Median Price

$100.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 280 parts In-Stock

1+ parts

$77.740

100+ parts

$75.402

1k+ parts

$58.451

10k+ parts

-

280

$77.740

$75.402

$58.451

-

DigiKey

USA . 200 parts In-Stock

1+ parts

$122.680

100+ parts

$94.879

1k+ parts

-

10k+ parts

-

200

$122.680

$94.879

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,137 parts In-Stock

1+ parts

$73.853

100+ parts

-

1k+ parts

-

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1,137

$73.853

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Vyrian

USA . 5,703 parts In-Stock

1+ parts

-

100+ parts

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5,703

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 131 parts In-Stock

1+ parts

$66.080

100+ parts

$64.428

1k+ parts

$64.098

10k+ parts

-

131

$66.080

$64.428

$64.098

-

Ampacity Inc.

Singapore . 126 parts In-Stock

1+ parts

$66.080

100+ parts

-

1k+ parts

-

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126

$66.080

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-

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Corphita

USA . 3,814 parts In-Stock

1+ parts

$69.966

100+ parts

-

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3,814

$69.966

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-

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Corohmni

South Africa . 181 parts In-Stock

1+ parts

$77.740

100+ parts

-

1k+ parts

-

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181

$77.740

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-

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Component Stockers USA

USA . 146 parts In-Stock

1+ parts

$90.350

100+ parts

$83.350

1k+ parts

-

10k+ parts

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146

$90.350

$83.350

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Microchip USA

USA . 1,342 parts In-Stock

1+ parts

$153.160

100+ parts

$150.500

1k+ parts

$149.160

10k+ parts

$147.830

1,342

$153.160

$150.500

$149.160

$147.830

Native Components

USA . 918 parts In-Stock

1+ parts

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918

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Northwest PG Solutions

USA . 363 parts In-Stock

1+ parts

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363

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Overview

Experience the power of innovation with the AM6546BACDXA by Texas Instruments, a cutting-edge microprocessor that delivers unmatched performance and reliability. Manufactured by a trusted industry leader, this product is designed to meet the highest quality standards. Ideal for a wide range of applications, this microprocessor offers seamless integration, advanced features, and exceptional value. Enhance your projects with the AM6546BACDXA and unlock endless possibilities in technology and beyond. Trust Texas Instruments for superior solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight material helps reduce overall weight of the product, making it more portable and easier to handle.

Integrated Cache: YES

Integrated cache improves performance by allowing quick access to frequently used data and instructions.

Maximum Supply Voltage: 1.15 V

Operates efficiently within a safe voltage range, ensuring stability and longevity of the product.

On Chip Data RAM Width: 8

Wide on chip data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 28

Wide address bus width enables the processor to access a larger memory space efficiently.

Package Shape: SQUARE

Square package shape is space-efficient and easy to mount on circuit boards.

Bit Size: 32

32-bit architecture enables the processor to handle larger chunks of data at once, improving overall performance.

No. of Terminals: 784

High number of terminals allow for greater connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style provides a compact design with fine pitch for improved signal integrity and reliability.

Minimum Supply Voltage: 1.05 V

Low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, even in extreme cold.

Terminal Position: BOTTOM

Bottom terminal position makes mounting and connecting the processor easier and more convenient.

Maximum Seated Height: 1.63 mm

Low profile design with maximum seated height of 1.63 mm allows for slim and compact product designs.

RAM Words: 2097152

Large RAM capacity allows for efficient data storage and processing, enabling complex tasks to be handled smoothly.

Width: 23 mm

Compact width size makes the processor suitable for small form factor devices and applications.

Boundary Scan: YES

Boundary scan feature allows for easy testing and debugging of the processor during manufacturing and maintenance.

External Data Bus Width: 16

Wide external data bus width improves data transfer speeds and overall system performance.

Maximum Clock Frequency: 27 MHz

High maximum clock frequency allows for faster data processing and execution of instructions.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures reliable soldering during manufacturing processes.

Length: 23 mm

Compact length size makes the processor suitable for small form factor devices and applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture provides efficient processing power for various applications with reduced complexity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation for energy-efficient performance.

Terminal Form: BALL

Ball terminal form allows for easy and reliable soldering connections, ensuring secure attachment to circuit boards.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable performance of the processor.

No. of DMA Channels: 2

Multiple DMA channels enable efficient data transfer between peripherals and memory, improving overall system performance.

No. of Serial I/Os: 5

Multiple serial I/O ports allow for versatile connectivity options with external devices and components.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm enables high-density mounting and connectivity, saving space on the circuit board.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and processing tasks, improving efficiency and speed.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the processor has a moderate level of moisture sensitivity, requiring proper handling during storage and manufacturing.

Speed: 1100 rpm

Operates at high speed of 1100 rpm for quick data processing and efficient performance.

Low Power Mode: YES

Low power mode option helps in reducing power consumption and extending battery life for energy-efficient operation.

Technical Specifications

Microprocessors AM6546BACDXA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

1

No. of Serial I/Os:

5

No. of Terminals:

784

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA784,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2097152

Maximum Seated Height:

1.63 mm

Speed:

1100 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM6546BACDXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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