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AM6526BACDXEAF

Texas Instruments

AM6526BACDXEAF by Texas Instruments

The Texas Instruments AM6526BACDXEAF microprocessor features 32-bit architecture, 8-word data RAM width, and a max clock frequency of 27 MHz. Ideal for industrial applications requiring high-speed processing with low power consumption.

Median Price

$102.777

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 180 parts In-Stock

1+ parts

$73.134

100+ parts

$70.935

1k+ parts

$54.988

10k+ parts

-

180

$73.134

$70.935

$54.988

-

Mouser Electronics

USA . 320 parts In-Stock

1+ parts

$132.420

100+ parts

$101.590

1k+ parts

-

10k+ parts

-

320

$132.420

$101.590

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,601 parts In-Stock

1+ parts

$69.477

100+ parts

-

1k+ parts

-

10k+ parts

-

3,601

$69.477

-

-

-

Vyrian

USA . 3,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,606

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,229 parts In-Stock

1+ parts

$2.975

100+ parts

-

1k+ parts

-

10k+ parts

-

1,229

$2.975

-

-

-

Parana Technologies

USA . 1,130 parts In-Stock

1+ parts

$55.471

100+ parts

$5,151.327

1k+ parts

$49.924

10k+ parts

-

1,130

$55.471

$5,151.327

$49.924

-

DigiPath Technology Company

USA . 858 parts In-Stock

1+ parts

$61.080

100+ parts

$56.194

1k+ parts

-

10k+ parts

-

858

$61.080

$56.194

-

-

ChromeModa Solutions

Germany . 4,580 parts In-Stock

1+ parts

$62.327

100+ parts

$51.108

1k+ parts

-

10k+ parts

-

4,580

$62.327

$51.108

-

-

IDEA Electronic Components Group

UK . 1,296 parts In-Stock

1+ parts

$62.327

100+ parts

$59.211

1k+ parts

$56.094

10k+ parts

-

1,296

$62.327

$59.211

$56.094

-

Corphita

USA . 2,602 parts In-Stock

1+ parts

$65.821

100+ parts

-

1k+ parts

-

10k+ parts

-

2,602

$65.821

-

-

-

Native Components

USA . 81 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.624

10k+ parts

-

81

-

-

$2.624

-

Overview

Unlock the power of cutting-edge technology with the AM6526BACDXEAF by Texas Instruments. As a leader in microprocessor manufacturing, Texas Instruments delivers top-quality products that guarantee superior performance and reliability. Perfect for a wide range of applications, this microprocessor offers unmatched value with integrated cache, low power mode, and a high clock frequency. Experience seamless operation and efficient processing with the AM6526BACDXEAF, setting new standards in industrial-grade microprocessors. Elevate your projects with Texas Instruments - where innovation meets excellence.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve overall performance by reducing the time needed to access frequently used data.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures efficient power consumption while delivering optimal performance.

Address Bus Width: 28

A wider address bus width of 28 increases the memory addressability, allowing for larger memory storage and faster data retrieval.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microprocessor can withstand intense computing tasks without overheating.

RAM Words: 2097152

The large RAM capacity of 2097152 words enables efficient multitasking and processing of complex computational tasks.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it is optimized for handling multiple instructions simultaneously, leading to higher efficiency and improved performance.

Technology: CMOS

Built using CMOS technology, this microprocessor offers lower power consumption, reduced heat generation, and faster processing speeds.

Technical Specifications

Microprocessors AM6526BACDXEAF attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

1

No. of Serial I/Os:

5

No. of Terminals:

784

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA784,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2097152

Maximum Seated Height:

1.63 mm

Speed:

1100 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM6526BACDXEAF Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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