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MMC2001HCAB33B

NXP Semiconductors

MMC2001HCAB33B by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;

Median Price

$32.602

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 1,535 parts In-Stock

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1,535

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Rochester

USA . 66 parts In-Stock

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$28.980

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$25.930

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$24.410

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$25.930

$24.410

DigiKey

USA . 66 parts In-Stock

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66

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Verical

USA . 50 parts In-Stock

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$36.225

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$32.413

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$30.512

50

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$36.225

$32.413

$30.512

Distributors (In-Stock)

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Digiode

USA . 1,620 parts In-Stock

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$30.676

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Vyrian

USA . 6,257 parts In-Stock

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Anansix

USA . 1,365 parts In-Stock

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USA . 1,037 parts In-Stock

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Bristol Electronics

USA . 900 parts In-Stock

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DigiKey Marketplace

USA . 75 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,224 parts In-Stock

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$29.061

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Microchip USA

USA . 433 parts In-Stock

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$71.277

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QUARKTWIN TECHNOLOGY LTD

USA . 11,794 parts In-Stock

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UNI Independent Distributors

Spain . 5,212 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,087 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

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ChipTracer

USA . 900 parts In-Stock

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900

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Technical Specifications

Microprocessors MMC2001HCAB33B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

16.38 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

8

No. of Serial I/Os:

2

No. of Terminals:

144

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Speed:

34 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MMC2001HCAB33B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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