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Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 957

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
OSD3358-512M-IND by Octavo Systems

OSD3358-512M-IND

Octavo Systems

OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.

64kbytes shared l3 ram also available

28

YES

16

FIXED POINT

NO

S-PBGA-B400

27 mm

NO

4

1

400

8

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

245

65536

2.6 mm

1000 rpm

2000 mA

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

MC8640HJ1250HE by NXP Semiconductors

MC8640HJ1250HE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

0 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1250 rpm

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

MC8640DTHJ1250HE by NXP Semiconductors

MC8640DTHJ1250HE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

-40 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1250 rpm

1.1 V

1 V

1.05 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

MC8640DHJ1067NE by NXP Semiconductors

MC8640DHJ1067NE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

0 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1067 rpm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

LX2080SC72029B by NXP Semiconductors

LX2080SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN71826B by NXP Semiconductors

LX2080SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC71826B by NXP Semiconductors

LX2080XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72029B by NXP Semiconductors

LX2080XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72232B by NXP Semiconductors

LX2080XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72029B by NXP Semiconductors

LX2080XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN71826B by NXP Semiconductors

LX2120SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN72029B by NXP Semiconductors

LX2120SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72029B by NXP Semiconductors

LX2120XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN71826B by NXP Semiconductors

LX2120XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72029B by NXP Semiconductors

LX2120XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72029B by NXP Semiconductors

LX2160SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72232B by NXP Semiconductors

LX2160SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE71826B by NXP Semiconductors

LX2160XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72029B by NXP Semiconductors

LX2160XE72029B

NXP Semiconductors

NXP Semiconductors' LX2160XE72029B microprocessor features 64-bit architecture, 128-bit external data bus width, and 36-bit address bus. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is a grid array with a max operating temperature of 105°C.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN72029B by NXP Semiconductors

LX2080SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE71826B by NXP Semiconductors

LX2080XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC71826B by NXP Semiconductors

LX2120SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SE71826B by NXP Semiconductors

LX2120SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SE72029B by NXP Semiconductors

LX2120SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN72232B by NXP Semiconductors

LX2120SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72029B by NXP Semiconductors

LX2120XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SC72232B by NXP Semiconductors

LX2080SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SE71826B by NXP Semiconductors

LX2080SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN72232B by NXP Semiconductors

LX2080SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72232B by NXP Semiconductors

LX2080XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SE72232B by NXP Semiconductors

LX2120SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE71826B by NXP Semiconductors

LX2120XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72232B by NXP Semiconductors

LX2120XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE72232B by NXP Semiconductors

LX2160SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN71826B by NXP Semiconductors

LX2160SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC71826B by NXP Semiconductors

LX2160XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC71826B by NXP Semiconductors

LX2160SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE71826B by NXP Semiconductors

LX2160SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE72029B by NXP Semiconductors

LX2160SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN72029B by NXP Semiconductors

LX2160SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN72232B by NXP Semiconductors

LX2160SN72232B

NXP Semiconductors

The NXP Semiconductors LX2160SN72232B is a 64-bit microprocessor with 36-bit address bus width and 128-bit external data bus width. It operates at speeds up to 2200 rpm, suitable for low power mode applications. With integrated cache and 12 external interrupts, it's ideal for high-performance computing in various industries.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72232B by NXP Semiconductors

LX2160XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN71826B by NXP Semiconductors

LX2160XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72232B by NXP Semiconductors

LX2160XN72232B

NXP Semiconductors

The NXP Semiconductors LX2160XN72232B microprocessor features a 64-bit architecture, 128-bit external data bus width, and 36-bit address bus width. Ideal for industrial applications requiring high-speed processing and low power consumption.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SC71826B by NXP Semiconductors

LX2080SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SE72232B by NXP Semiconductors

LX2080SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72232B by NXP Semiconductors

LX2080XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72029B by NXP Semiconductors

LX2080XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC