Loading...

LX2160XE72029B

NXP Semiconductors

LX2160XE72029B by NXP Semiconductors

NXP Semiconductors' LX2160XE72029B microprocessor features 64-bit architecture, 128-bit external data bus width, and 36-bit address bus. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is a grid array with a max operating temperature of 105°C.

Median Price

$694.572

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 42 parts In-Stock

1+ parts

$757.970

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$757.970

-

-

-

Verical

USA . 9,996 parts In-Stock

1+ parts

-

100+ parts

$631.173

1k+ parts

-

10k+ parts

-

9,996

-

$631.173

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,225 parts In-Stock

1+ parts

$548.625

100+ parts

-

1k+ parts

-

10k+ parts

-

2,225

$548.625

-

-

-

DigiKey Marketplace

USA . 5 parts In-Stock

1+ parts

$709.160

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$709.160

-

-

-

Vyrian

USA . 10,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,400

-

-

-

-

Anansix

USA . 1,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,039

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,315 parts In-Stock

1+ parts

$475.180

100+ parts

$457.900

1k+ parts

$449.260

10k+ parts

$440.620

1,315

$475.180

$457.900

$449.260

$440.620

Corphita

USA . 4,594 parts In-Stock

1+ parts

$519.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,594

$519.750

-

-

-

UNI Independent Distributors

Spain . 7,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,235

-

-

-

-

Overview

Unleash the power of innovation with the LX2160XE72029B from NXP Semiconductors. This cutting-edge microprocessor offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With integrated cache and advanced technology, this product delivers exceptional speed and efficiency. Whether you're designing industrial equipment or powering next-generation devices, this microprocessor will exceed your expectations. Elevate your projects with the LX2160XE72029B and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to physical damage.

Integrated Cache: YES

Having an integrated cache improves performance by reducing memory access times and increasing data retrieval speed.

Maximum Supply Voltage: 0.88 V

The lower supply voltage helps in reducing power consumption, making the product energy-efficient.

Address Bus Width: 36

A wider address bus allows for more memory addresses to be accessed, enhancing the processing capabilities of the product.

Bit Size: 64

With a 64-bit architecture, the product can handle larger chunks of data at once, leading to improved performance.

No. of Terminals: 1517

The high number of terminals enables efficient connectivity and communication within the system.

No. of External Interrupts: 12

Having multiple external interrupts allows for efficient handling of external events and signals, enhancing system responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for energy-efficient and reliable operations.

Speed: 2000 rpm

The high speed of the product allows for quick data processing and execution of tasks, enhancing overall performance.

Low Power Mode: YES

The presence of a low power mode helps in reducing energy consumption during idle or low processing load periods, increasing efficiency.

Technical Specifications

Microprocessors LX2160XE72029B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

36

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

128

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

12

No. of Serial I/Os:

17

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1517.39X39,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Speed:

2000 rpm

Maximum Supply Current:

.05 mA

Maximum Supply Voltage:

.88 V

Minimum Supply Voltage:

.82 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

LX2160XE72029B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20