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LX2160SN72232B

NXP Semiconductors

LX2160SN72232B by NXP Semiconductors

The NXP Semiconductors LX2160SN72232B is a 64-bit microprocessor with 36-bit address bus width and 128-bit external data bus width. It operates at speeds up to 2200 rpm, suitable for low power mode applications. With integrated cache and 12 external interrupts, it's ideal for high-performance computing in various industries.

Median Price

$593.325

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

$527.400

100+ parts

$495.760

1k+ parts

$464.110

10k+ parts

-

21

$527.400

$495.760

$464.110

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Verical

USA . 21 parts In-Stock

1+ parts

$659.250

100+ parts

$619.700

1k+ parts

$580.138

10k+ parts

-

21

$659.250

$619.700

$580.138

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$564.347

100+ parts

-

1k+ parts

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650

$564.347

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Digiode

USA . 3,242 parts In-Stock

1+ parts

$581.742

100+ parts

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3,242

$581.742

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Vyrian

USA . 7,586 parts In-Stock

1+ parts

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7,586

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Anansix

USA . 240 parts In-Stock

1+ parts

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240

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Flip Electronics

USA . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$10.923

100+ parts

-

1k+ parts

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273

$10.923

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Ampacity Inc.

Singapore . 21 parts In-Stock

1+ parts

$520.510

100+ parts

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21

$520.510

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Corphita

USA . 2,392 parts In-Stock

1+ parts

$551.124

100+ parts

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2,392

$551.124

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$564.347

100+ parts

$553.060

1k+ parts

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2,000

$564.347

$553.060

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Microchip USA

USA . 2,421 parts In-Stock

1+ parts

$712.929

100+ parts

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2,421

$712.929

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UNI Independent Distributors

Spain . 7,005 parts In-Stock

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7,005

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Overview

Unleash the power of cutting-edge technology with the LX2160SN72232B microprocessor by NXP Semiconductors. This innovative product boasts top-notch quality and reliability from a trusted manufacturer, offering unparalleled performance in a wide range of applications. Experience seamless integration and enhanced efficiency with this versatile microprocessor, delivering value and benefits that exceed expectations. Upgrade your systems today and stay ahead of the curve with the LX2160SN72232B.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and thermal stability, making it a reliable choice for long-term use.

Integrated Cache: YES

The integrated cache enhances processing speed and efficiency, making this microprocessor suitable for handling complex tasks.

Surface Mount: YES

The surface mount feature makes installation easier and more convenient, reducing the overall assembly time and effort.

Maximum Supply Voltage: 0.88 V

With a higher maximum supply voltage, this microprocessor can operate effectively under varying power conditions.

Address Bus Width: 36

The wide address bus width allows for efficient data processing and memory addressing, improving overall performance.

Package Shape: SQUARE

The square package shape saves space and facilitates easier PCB layout designs, making it ideal for compact systems.

Bit Size: 64

A 64-bit size enables the microprocessor to handle large amounts of data simultaneously, enhancing its computational capabilities.

No. of Terminals: 1517

The high number of terminals provides ample connectivity options, allowing for versatile integration with other system components.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and electrical connectivity, ensuring better reliability.

Minimum Supply Voltage: 0.82 V

With a low minimum supply voltage, this microprocessor conserves power and operates efficiently, making it energy-efficient.

Maximum Operating Temperature: 105 °C

Operating at a high temperature range ensures reliable performance even in demanding conditions, making it suitable for industrial applications.

No. of External Interrupts: 12

The multiple external interrupts enhance the microprocessor's responsiveness to external events, improving real-time processing capabilities.

Minimum Operating Temperature: 0 °C

Able to operate at low temperatures, this microprocessor remains functional in colder environments, expanding its potential applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections for long-term use.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process, making it more user-friendly and efficient.

Maximum Seated Height: 3.51 mm

With a low seated height, this microprocessor can be used in slim devices or compact spaces, enhancing design flexibility.

Width: 40 mm

The 40mm width allows for easy integration into standard PCB layouts, making it compatible with a wide range of electronic devices.

Boundary Scan: YES

The boundary scan feature enables comprehensive testing and debugging capabilities, ensuring the reliability and quality of the microprocessor.

External Data Bus Width: 128

A wide external data bus width enables high-speed data transfer and processing, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this microprocessor minimizes the risk of heat damage during assembly.

Peak Reflow Temperature °C: 245

Able to withstand high reflow temperatures, this microprocessor is suitable for reflow soldering processes, ensuring secure solder joints.

Length: 40 mm

The 40mm length provides a compact form factor, making this microprocessor ideal for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Designed as a RISC microprocessor with various peripheral capabilities, this product offers versatile functionality for different applications.

Technology: CMOS

Utilizing CMOS technology, this microprocessor delivers low power consumption and high speed performance, making it energy-efficient.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances connection reliability, ensuring a secure bond between the microprocessor and PCB.

Maximum Supply Current: 0.05 mA

With a low maximum supply current, this microprocessor operates efficiently and saves power, making it suitable for battery-powered devices.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides stable power delivery, ensuring consistent performance and reliability in various operating conditions.

No. of Serial I/Os: 17

The multiple serial I/O ports allow for versatile connectivity options, enhancing the microprocessor's compatibility with different devices.

Terminal Pitch: 1 mm

With a 1mm terminal pitch, this microprocessor offers easy integration and reliable connections, facilitating the assembly process.

Format: FIXED POINT

The fixed-point format simplifies data processing and arithmetic operations, making this microprocessor suitable for specific computational tasks.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this microprocessor can withstand typical storage and handling conditions without degradation.

Speed: 2200 rpm

Operating at a high speed of 2200 rpm, this microprocessor delivers fast and efficient processing capabilities, ideal for time-sensitive applications.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, extending battery life and reducing overall power consumption.

Technical Specifications

Microprocessors LX2160SN72232B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

36

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

128

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

12

No. of Serial I/Os:

17

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1517.39X39,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Speed:

2200 rpm

Maximum Supply Current:

.05 mA

Maximum Supply Voltage:

.88 V

Minimum Supply Voltage:

.82 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

LX2160SN72232B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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