Loading...

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 957

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T4161NSE7PQB by NXP Semiconductors

T4161NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7QTB by NXP Semiconductors

T4161NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7TTB by NXP Semiconductors

T4161NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7PQB by NXP Semiconductors

T4161NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7QTB by NXP Semiconductors

T4161NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7TTB by NXP Semiconductors

T4161NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7PQB by NXP Semiconductors

T4161NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7QTB by NXP Semiconductors

T4161NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7TTB by NXP Semiconductors

T4161NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Width: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7PQB by NXP Semiconductors

T4161NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7QTB by NXP Semiconductors

T4161NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7TTB by NXP Semiconductors

T4161NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

LS1046ASE8Q1A by NXP Semiconductors

LS1046ASE8Q1A

NXP Semiconductors

LS1046ASE8Q1A by NXP Semiconductors is a microprocessor with a package shape of square and 780 terminals. It has a max seated height of 2.07 mm and operates at a speed of 64 rpm. This processor is commonly used in various applications requiring high-performance computing.

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

2.07 mm

64 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AC by NXP Semiconductors

MCIMX6S1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AC by NXP Semiconductors

MCIMX6S4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AC by NXP Semiconductors

MCIMX6S6AVM10AC

NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology, operating at -40 to 125 °C. It has 624 terminals in a GRID ARRAY package style, suitable for automotive applications due to its low profile design and tin silver copper terminal finish.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AC by NXP Semiconductors

MCIMX6U1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AC by NXP Semiconductors

MCIMX6U4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AC by NXP Semiconductors

MCIMX6U6AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

T1042NXE7PQB by NXP Semiconductors

T1042NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7MQB by NXP Semiconductors

T1022NSE7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7PQB by NXP Semiconductors

T1022NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7WQB by NXP Semiconductors

T1022NSE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1500 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7MQB by NXP Semiconductors

T1022NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7PQB by NXP Semiconductors

T1022NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7WQB by NXP Semiconductors

T1022NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXE7MQB by NXP Semiconductors

T1022NXE7MQB

NXP Semiconductors

The NXP Semiconductors T1022NXE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. The package style is grid array, fine pitch, making it ideal for surface mount assembly in compact electronic devices.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXE7WQB by NXP Semiconductors

T1022NXE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7MQB by NXP Semiconductors

T1022NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7PQB by NXP Semiconductors

T1022NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7WQB by NXP Semiconductors

T1022NXN7WQB

NXP Semiconductors

The NXP Semiconductors T1022NXN7WQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. With low power mode enabled, it offers efficient performance in a compact square package measuring 23mm x 23mm.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7MQB by NXP Semiconductors

T1042NSE7MQB

NXP Semiconductors

The NXP Semiconductors T1042NSE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for high-speed computing applications requiring low power mode operation. The package style is grid array, fine pitch, making it ideal for compact designs in various electronic devices.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7PQB by NXP Semiconductors

T1042NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7WQB by NXP Semiconductors

T1042NSE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7MQB by NXP Semiconductors

T1042NSN7MQB

NXP Semiconductors

The NXP Semiconductors T1042NSN7MQB microprocessor features a 32-bit architecture with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 133.3 MHz, making it suitable for high-speed computing applications. With low power mode support and CMOS technology, this processor is ideal for energy-efficient systems requiring fast processing capabilities.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7PQB by NXP Semiconductors

T1042NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7WQB by NXP Semiconductors

T1042NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXE7MQB by NXP Semiconductors

T1042NXE7MQB

NXP Semiconductors

The NXP Semiconductors T1042NXE7MQB microprocessor features a 32-bit architecture with a clock frequency of 133.3 MHz, ideal for high-speed applications. With integrated cache and low power mode, it offers efficient performance at a supply voltage range of 0.97 V to 1.03 V. This square-shaped processor in grid array package is suitable for various RISC-based systems requiring fast data processing.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXE7WQB by NXP Semiconductors

T1042NXE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7MQB by NXP Semiconductors

T1042NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1200 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7PQB by NXP Semiconductors

T1042NXN7PQB

NXP Semiconductors

T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7WQB by NXP Semiconductors

T1042NXN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1500 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T4240NSE7PQB by NXP Semiconductors

T4240NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSE7TTB by NXP Semiconductors

T4240NSE7TTB

NXP Semiconductors

NXP Semiconductors T4240NSE7TTB microprocessor features 64-bit external data bus, 16-bit address bus, and integrated cache. Ideal for applications requiring high processing speed and low power consumption. Package style is grid array with 1932 terminals in a square shape measuring 45mm x 45mm.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7PQB by NXP Semiconductors

T4240NSN7PQB

NXP Semiconductors

The NXP Semiconductors T4240NSN7PQB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. Ideal for applications requiring high-speed processing such as networking equipment, servers, and industrial automation systems.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7QTB by NXP Semiconductors

T4240NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7TTB by NXP Semiconductors

T4240NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NXE7PQB by NXP Semiconductors

T4240NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC