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MCIMX6U1AVM10AC

NXP Semiconductors

MCIMX6U1AVM10AC by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$45.720

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$40.640

1k+ parts

$36.360

10k+ parts

$34.220

600

-

$40.640

$36.360

$34.220

DigiKey

USA . 600 parts In-Stock

1+ parts

-

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600

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Flip Electronics (Authorized)

USA . 460 parts In-Stock

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460

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Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$50.800

1k+ parts

$45.450

10k+ parts

$42.775

300

-

$50.800

$45.450

$42.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,454 parts In-Stock

1+ parts

$42.892

100+ parts

-

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3,454

$42.892

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Vyrian

USA . 7,432 parts In-Stock

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DigiKey Marketplace

USA . 600 parts In-Stock

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600

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Flip Electronics

USA . 460 parts In-Stock

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460

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Anansix

USA . 329 parts In-Stock

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329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$11.770

100+ parts

-

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474

$11.770

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Corphita

USA . 2,699 parts In-Stock

1+ parts

$40.635

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2,699

$40.635

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Component Stockers USA

USA . 366 parts In-Stock

1+ parts

$50.850

100+ parts

$47.800

1k+ parts

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366

$50.850

$47.800

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Microchip USA

USA . 2,745 parts In-Stock

1+ parts

$109.918

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2,745

$109.918

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,784 parts In-Stock

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2,784

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Technical Specifications

Microprocessors MCIMX6U1AVM10AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U1AVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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