Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
Median Price
$1,210.891
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Verical
1+ parts
-
100+ parts
1k+ parts
10k+ parts
Flip Electronics (Authorized)
Vyrian
Digiode
Anansix
Flip Electronics
Ampacity Inc.
$4.000
AZTECH Wire
$12.650
Microchip USA
$1,246.507
UNI Independent Distributors
Corphita
Microprocessors T4161NXN7QTB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
T4161NXN7QTB Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - T408x/T416x/T424x 01/Jul/2022
PCN Assembly/Origin - Mult Dev 12/Jan/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Formosa Microsemi
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Weitronic Enterprise
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
30026-13
National Semiconductor's 30026-13 microprocessor features a 32-bit address bus width, integrated cache, and max clock frequency of 33.61 MHz. Ideal for low power applications, this CMOS technology-based processor operates b/w 0 to 85 °C with a supply voltage range of 2.09 V to 2.31 V.
MPC5200VR400B
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
MCF5270CVM150R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;
FH8065301487717SR1X6
Intel
The Intel FH8065301487717SR1X6 microprocessor features a 64-bit architecture, 16-bit address bus width, and 1910 rpm speed. It is ideal for applications requiring high processing power in a compact form factor, such as embedded systems and industrial automation.
STM32MP157CAA3
STMicroelectronics
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
PPC440EP-3JC400C
Applied Micro Circuits
PPC440EP-3JC400C by Applied Micro Circuits is a 32-bit microprocessor with integrated cache and operates at a max clock frequency of 66.66 MHz. It features a package style of GRID ARRAY and is commonly used in applications requiring high-speed processing, such as networking equipment and embedded systems.
RH80536GC0332MSL8U6
Intel's RH80536GC0332MSL8U6 microprocessor features 32-bit architecture, 64-bit external data bus width, and a speed of 1800 rpm. Ideal for applications requiring high processing power in compact devices due to its low power mode and CMOS technology.
FH8065801974816SR267
Intel FH8065801974816SR267 is a 64-bit microprocessor with 1168 terminals in a grid array package. It operates at a speed of 3200 rpm and features integrated cache. This CPU is ideal for high-performance computing applications requiring fast processing speeds.
AM3357BZCZA80
Texas Instruments
AM3357BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.
MPC8313CVRAFFC
NXP Semiconductors
NXP Semiconductors' MPC8313CVRAFFC microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66.67 MHz. Ideal for low power applications, it integrates cache memory and supports boundary scan testing.
STM32MP157CAD3T
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
AT91SAM9G45C-CU
AT91SAM9G45C-CU by Microchip: ARM9 CPU with 32-bit architecture, 50 MHz clock frequency, and 65536 ROM words. Ideal for industrial applications requiring high-speed processing and low power consumption. Features integrated cache, ADC channels, and 160 I/O lines for versatile connectivity options.
TN80C188EA-20
TN80C188EA-20 by Intel is a 16-bit microprocessor with 20-bit address bus width, operating at a max clock frequency of 40 MHz. It is suitable for industrial applications requiring low power mode and features 5 external interrupts, 2 DMA channels, and operates within a temperature range of -40 to 85°C.
MIMXRT1051DVL6B
The NXP Semiconductors MIMXRT1051DVL6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power consumption and high-speed processing in a compact form factor. Suitable for use in IoT devices, wearables, and industrial automation systems.
MCF5272VM66
NXP Semiconductors' MCF5272VM66 microprocessor features 32-bit architecture, 23-bit address bus width, and integrated cache. Ideal for commercial applications, it operates at a max clock frequency of 66 MHz with low power mode support.
P1021NXE2FFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
MCF5251CVM140R2
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
MD80C88-2/B
Intersil
Intersil's MD80C88-2/B microprocessor features 20-bit address bus, 16-bit bit size, and 8 MHz clock frequency. Ideal for military applications due to its CMOS technology, low power mode, and MIL-graded temperature range of -55°C to 125°C.
FH8065301487918SR1X7
Intel FH8065301487918SR1X7 microprocessor features 64-bit architecture, 16-bit address bus width, and 64 external data bus width. Suitable for high-performance computing applications due to its low power mode and integrated cache.
STM32MP153AAD3
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T4161NSE7TTB
T4160NSN7QTB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
T4161NXE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Width: 45 mm;
T4161NSN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
T4161NSE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;
T4161NXN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16;
T4160NSE7QTB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
T4161NSN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;
T4160NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
T4161NXE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
T4161NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;
T4160NXN7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Technology: CMOS; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
T4161NXN7PQB
T4160NSN7PQB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Technology: CMOS;
T4161NSE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
T4160NSE7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Technology: CMOS; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
T4160NSE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
T4160NXE7PQB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Technology: CMOS;
T4161NXE7PQB
Supply Digital Components
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