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T4160NSN7PQB

NXP Semiconductors

T4160NSN7PQB by NXP Semiconductors

MICROPROCESSOR, RISC; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Technology: CMOS;

Median Price

$1,034.660

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,545 parts In-Stock

1+ parts

$827.730

100+ parts

$778.070

1k+ parts

$728.400

10k+ parts

-

1,545

$827.730

$778.070

$728.400

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DigiKey

USA . 3,021 parts In-Stock

1+ parts

$1,034.660

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3,021

$1,034.660

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Verical

USA . 1,545 parts In-Stock

1+ parts

$1,034.662

100+ parts

$972.587

1k+ parts

$910.500

10k+ parts

-

1,545

$1,034.662

$972.587

$910.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,521 parts In-Stock

1+ parts

$760.855

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-

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3,521

$760.855

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Vyrian

USA . 6,646 parts In-Stock

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6,646

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Flip Electronics

USA . 3,492 parts In-Stock

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3,492

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Anansix

USA . 983 parts In-Stock

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983

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TME

Poland . 3 parts In-Stock

1+ parts

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$1,171.980

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3

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$1,171.980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 60 parts In-Stock

1+ parts

$680.760

100+ parts

-

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60

$680.760

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Corphita

USA . 2,954 parts In-Stock

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$720.810

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2,954

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Microchip USA

USA . 1,288 parts In-Stock

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$939.686

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1,288

$939.686

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UNI Independent Distributors

Spain . 4,075 parts In-Stock

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4,075

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Perfect Parts

USA . 148 parts In-Stock

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148

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Technical Specifications

Microprocessors T4160NSN7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

250

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

T4160NSN7PQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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