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MCIMX6S6AVM10AC

NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology, operating at -40 to 125 °C. It has 624 terminals in a GRID ARRAY package style, suitable for automotive applications due to its low profile design and tin silver copper terminal finish.

Median Price

$37.689

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,900 parts In-Stock

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Flip Electronics (Authorized)

USA . 64 parts In-Stock

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Vyrian

USA . 4,586 parts In-Stock

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Anansix

USA . 2,847 parts In-Stock

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Digiode

USA . 1,644 parts In-Stock

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Nova Conductors

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Semicontronic

India . 64 parts In-Stock

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$8.000

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$7.800

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$7.760

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AZTECH Wire

Italy . 416 parts In-Stock

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$20.260

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Ampacity Inc.

Singapore . 64 parts In-Stock

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$28.000

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Corohmni

South Africa . 132 parts In-Stock

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Microchip USA

USA . 2,074 parts In-Stock

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UNI Independent Distributors

Spain . 4,979 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Netroflash

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Overview

Unleash the power of innovation with the MCIMX6S6AVM10AC by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality microprocessors that revolutionize the way we interact with technology. Designed for automotive applications, this cutting-edge microprocessor offers unparalleled performance and reliability, making it the ideal choice for your next project. Experience the seamless integration and advanced capabilities of the MCIMX6S6AVM10AC and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microprocessor lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 1.5 V

Operating at a maximum supply voltage of 1.5 V ensures energy efficiency and lower power consumption.

No. of Terminals: 624

Having a high number of terminals allows for a greater number of connections and functionality.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microprocessor can withstand high levels of heat without performance degradation.

Minimum Operating Temperature: -40 °C

The microprocessor can operate in extremely cold environments as low as -40°C without any issues.

Technology: CMOS

Utilizing CMOS technology ensures high-speed performance and low power consumption for efficient operation.

Technical Specifications

Microprocessors MCIMX6S6AVM10AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S6AVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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