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P1010NXN5FFB

NXP Semiconductors

P1010NXN5FFB by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$49.444

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$43.950

1k+ parts

$39.320

10k+ parts

$37.010

236

-

$43.950

$39.320

$37.010

Verical

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$54.938

1k+ parts

$49.150

10k+ parts

$46.263

236

-

$54.938

$49.150

$46.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,994 parts In-Stock

1+ parts

$46.388

100+ parts

-

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-

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3,994

$46.388

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-

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Vyrian

USA . 2,649 parts In-Stock

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2,649

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Anansix

USA . 2,478 parts In-Stock

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2,478

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Flip Electronics

USA . 172 parts In-Stock

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172

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Distributors (Availability)

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$19.430

100+ parts

-

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642

$19.430

-

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Corphita

USA . 3,881 parts In-Stock

1+ parts

$43.947

100+ parts

-

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3,881

$43.947

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Component Stockers USA

USA . 70 parts In-Stock

1+ parts

$56.070

100+ parts

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70

$56.070

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Vigor

Singapore . 799 parts In-Stock

1+ parts

$87.890

100+ parts

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799

$87.890

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Microchip USA

USA . 448 parts In-Stock

1+ parts

$117.510

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448

$117.510

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UNI Independent Distributors

Spain . 1,422 parts In-Stock

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Perfect Parts

USA . 94 parts In-Stock

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94

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Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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Technical Specifications

Microprocessors P1010NXN5FFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.9 mm

Speed:

667 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

P1010NXN5FFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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