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SVF311R3K2CKU2

NXP Semiconductors

SVF311R3K2CKU2 by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;

Median Price

$29.125

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 40 parts In-Stock

1+ parts

$39.210

100+ parts

$29.313

1k+ parts

$27.021

10k+ parts

-

40

$39.210

$29.313

$27.021

-

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

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3,000

-

-

-

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Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$23.300

1k+ parts

$20.850

10k+ parts

$19.620

40

-

$23.300

$20.850

$19.620

Verical

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$29.125

1k+ parts

$26.063

10k+ parts

$24.525

40

-

$29.125

$26.063

$24.525

Distributors (In-Stock)

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Digiode

USA . 4,090 parts In-Stock

1+ parts

$24.586

100+ parts

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4,090

$24.586

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Vyrian

USA . 7,321 parts In-Stock

1+ parts

-

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7,321

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Flip Electronics

USA . 4,440 parts In-Stock

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4,440

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Anansix

USA . 1,257 parts In-Stock

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1,257

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Distributors (Availability)

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Corphita

USA . 3,822 parts In-Stock

1+ parts

$23.292

100+ parts

-

1k+ parts

-

10k+ parts

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3,822

$23.292

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Microchip USA

USA . 7,568 parts In-Stock

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$90.804

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7,568

$90.804

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UNI Independent Distributors

Spain . 6,662 parts In-Stock

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6,662

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A-Z Elektronik GmbH

Germany . 1,373 parts In-Stock

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1,373

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Technical Specifications

Microprocessors SVF311R3K2CKU2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

266 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.23 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SVF311R3K2CKU2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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