Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
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Flip Electronics (Authorized)
Vyrian
Digiode
Anansix
Flip Electronics
Ampacity Inc.
$11.000
AZTECH Wire
$19.250
Microchip USA
$1,606.968
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Corphita
Microprocessors T4241NSE7TTB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
T4241NSE7TTB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - T408x/T416x/T424x 01/Jul/2022
PCN Assembly/Origin - Mult Dev 12/Jan/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
1N4148
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATSAMA5D31A-CFU
Microchip Technology
ATSAMA5D31A-CFU by Microchip Technology is a 32-bit microprocessor with integrated cache and a max clock frequency of 48 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
MIMXRT1011DAE5A
MICROPROCESSOR, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
AM3354BZCZD60
Texas Instruments
AM3354BZCZD60 by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 26 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.
MPC5123YVY400B
NXP Semiconductors' MPC5123YVY400B microprocessor features 32-bit address and external data bus width, with a max clock frequency of 35 MHz. Ideal for industrial applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.
MCF5484CZP200
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MPC880CVR66
NXP Semiconductors' MPC880CVR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for RISC-based applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V. The package style is grid array, making it suitable for various electronic devices requiring high processing power in a compact form factor.
STM32MP157DAB1
STM32MP157DAB1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16-bit address bus width. It operates at a max clock frequency of 64 MHz, suitable for industrial applications requiring low power consumption. With 48 DMA channels and boundary scan support, it offers high performance in a compact package style.
MCF54450VM240J
MCF54450VM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It features a package style of grid array, low profile, and operates at speeds up to 240 rpm. Ideal for applications requiring low power mode and commercial temperature grade.
LX2160XC72232B
The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.
MPC8377VRAGDA
The NXP Semiconductors MPC8377VRAGDA microprocessor features a 32-bit architecture with integrated cache and 64-bit external data bus width. It operates at speeds up to 400 rpm, suitable for low power mode applications. With a max supply voltage of 1.05 V and boundary scan capability, it is ideal for high-performance embedded systems requiring efficient processing.
AM3358BZCZ60
AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.
P2010NXN2KFC
The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.
MC7448VU800ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
MCF5307AI90B
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
T1023NXE7MQA
The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.
MIMXRT1062DVJ6A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;
MIMXRT1052CVL5BR
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MIMXRT1165XVM5A
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MCF5235CVM150
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MPC860PCZQ50D4
The NXP Semiconductors MPC860PCZQ50D4 is a 32-bit microprocessor with integrated cache and a max clock frequency of 50 MHz. It is commonly used in applications requiring low power mode and high-speed processing, such as embedded systems and industrial automation.
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T4240NSE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
T4240NSN7QTB
T4241NXN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;
T4241NXE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;
T4241NSE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;
T4241NXN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
T4240NSE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;
T4240NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
T4241NSN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
T4241NSN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
T4241NXE7QTB
T4240NXN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Length: 45 mm;
T4241NXN7PQB
T4240NSN7PQB
T4241NSE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
T4240NSE7PQB
T4241NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
T4240NXE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
T4241NXE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
Supply Digital Components
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