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T4240NXN7PQB

NXP Semiconductors

T4240NXN7PQB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Length: 45 mm;

Median Price

$1,186.187

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 132 parts In-Stock

1+ parts

$1,063.100

100+ parts

-

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132

$1,063.100

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Rochester

USA . 6 parts In-Stock

1+ parts

$1,144.490

100+ parts

$1,075.820

1k+ parts

$1,007.150

10k+ parts

-

6

$1,144.490

$1,075.820

$1,007.150

-

Verical

USA . 132 parts In-Stock

1+ parts

$1,227.884

100+ parts

-

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132

$1,227.884

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Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$1,783.380

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4

$1,783.380

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Flip Electronics (Authorized)

USA . 144 parts In-Stock

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144

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,955 parts In-Stock

1+ parts

$1,001.424

100+ parts

-

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3,955

$1,001.424

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Vyrian

USA . 8,652 parts In-Stock

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8,652

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Anansix

USA . 1,428 parts In-Stock

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1,428

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Flip Electronics

USA . 137 parts In-Stock

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137

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Cyclops Electronics Ltd

UK . 62 parts In-Stock

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62

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TME

Poland . 7 parts In-Stock

1+ parts

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100+ parts

$1,620.500

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7

-

$1,620.500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,834 parts In-Stock

1+ parts

$948.717

100+ parts

-

1k+ parts

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2,834

$948.717

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Microchip USA

USA . 3,655 parts In-Stock

1+ parts

$1,367.630

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3,655

$1,367.630

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QUARKTWIN TECHNOLOGY LTD

USA . 6,944 parts In-Stock

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6,944

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UNI Independent Distributors

Spain . 3,604 parts In-Stock

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3,604

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Perfect Parts

USA . 40 parts In-Stock

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40

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Technical Specifications

Microprocessors T4240NXN7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1932

JESD-609 Code:

e1

Length:

45 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.33 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.055 V

Minimum Supply Voltage:

.995 V

Nominal Supply Voltage:

1.025 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

45 mm

Peripheral IC Type:

Trade Compliance

T4240NXN7PQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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