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MCIMX6X2EVN10ABR

NXP Semiconductors

MCIMX6X2EVN10ABR by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;

Median Price

$24.277

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$23.600

100+ parts

$22.180

1k+ parts

$20.060

10k+ parts

-

2,000

$23.600

$22.180

$20.060

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$42.190

100+ parts

$31.201

1k+ parts

$28.550

10k+ parts

-

1,000

$42.190

$31.201

$28.550

-

Flip Electronics (Authorized)

USA . 18,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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18,479

-

-

-

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Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$24.277

10k+ parts

-

10,000

-

-

$24.277

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,550 parts In-Stock

1+ parts

$22.420

100+ parts

-

1k+ parts

-

10k+ parts

-

3,550

$22.420

-

-

-

Flip Electronics

USA . 19,620 parts In-Stock

1+ parts

-

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19,620

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Vyrian

USA . 7,508 parts In-Stock

1+ parts

-

100+ parts

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7,508

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Chip Stock

USA . 5,500 parts In-Stock

1+ parts

-

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5,500

-

-

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Anansix

USA . 1,729 parts In-Stock

1+ parts

-

100+ parts

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1,729

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-

-

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TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$27.926

10k+ parts

-

1,000

-

-

$27.926

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,444 parts In-Stock

1+ parts

$20.060

100+ parts

-

1k+ parts

-

10k+ parts

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5,444

$20.060

-

-

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Corphita

USA . 3,649 parts In-Stock

1+ parts

$21.240

100+ parts

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3,649

$21.240

-

-

-

Lixinc

USA . 9,631 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,631

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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7,000

-

-

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Microchip USA

USA . 3,116 parts In-Stock

1+ parts

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3,116

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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100+ parts

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1,600

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UNI Independent Distributors

Spain . 1,482 parts In-Stock

1+ parts

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100+ parts

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1,482

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Technical Specifications

Microprocessors MCIMX6X2EVN10ABR attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Bit Size:

32

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.27 mm

Speed:

800 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX6X2EVN10ABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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