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ATSAMA5D26C-CN

Microchip Technology

ATSAMA5D26C-CN by Microchip Technology

The Microchip Technology ATSAMA5D26C-CN microprocessor features 32-bit architecture, 131072 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption, it offers 32 DMA channels and operates in an extended temperature range from -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 5 parts In-Stock

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Vyrian

USA . 5,179 parts In-Stock

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VNN

France . 1,069 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Speed Components Ltd

Israel . 25 parts In-Stock

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Ampacity Inc.

Singapore . 5 parts In-Stock

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$5.000

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$5.000

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Vigor

Singapore . 396 parts In-Stock

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$8.910

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AZTECH Wire

Italy . 670 parts In-Stock

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$14.790

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Fulton Briggs Corp.

USA . 4,648 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology ATSAMA5D26C-CN Microprocessor. Manufactured by industry leader Microchip Technology, this high-quality processor offers unparalleled performance and reliability. Ideal for a wide range of applications, this microprocessor features integrated cache, low power mode, and a maximum clock frequency of 24 MHz. Elevate your projects to the next level with the ATSAMA5D26C-CN and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and ensuring longevity.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for better performance and stability under heavy workloads.

Surface Mount: YES

Being surface mountable makes the microprocessor easy to install and suitable for compact designs.

Address Bus Width: 26

With a wider address bus width, the microprocessor can handle larger amounts of memory, improving overall performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space in circuit board layouts.

Bit Size: 32

A 32-bit microprocessor can handle larger chunks of data at a time, enhancing processing speed.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, making it ideal for space-constrained applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures allows the microprocessor to be used in a wide range of environments.

RAM Words: 131072

Having a large RAM capacity enables the microprocessor to handle multiple tasks simultaneously without slowing down.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC microprocessor architecture offers efficient processing of instructions, leading to improved performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Technical Specifications

Microprocessors ATSAMA5D26C-CN attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ATSAMA5D26C-CN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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