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HPSDM8148CCYE2

Texas Instruments

HPSDM8148CCYE2 by Texas Instruments

The Texas Instruments HPSDM8148CCYE2 microprocessor features 32-bit architecture, 1.42V max supply voltage, and 30MHz clock frequency. Ideal for applications requiring high-speed processing in a compact form factor with integrated cache and low power mode support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,388 parts In-Stock

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3,388

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Vyrian

USA . 2,270 parts In-Stock

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2,270

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Distributors (Availability)

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One Stop Electronics

USA . 897 parts In-Stock

1+ parts

$9.000

100+ parts

-

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897

$9.000

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AZTECH Wire

Italy . 877 parts In-Stock

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$14.270

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877

$14.270

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Parana Technologies

USA . 2,211 parts In-Stock

1+ parts

$59.964

100+ parts

$5,568.544

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$53.967

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2,211

$59.964

$5,568.544

$53.967

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DigiPath Technology Company

USA . 1,589 parts In-Stock

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$66.028

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1,589

$66.028

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IDEA Electronic Components Group

UK . 1,877 parts In-Stock

1+ parts

$67.375

100+ parts

$64.006

1k+ parts

$60.638

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1,877

$67.375

$64.006

$60.638

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ChromeModa Solutions

Germany . 472 parts In-Stock

1+ parts

$67.375

100+ parts

$55.248

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472

$67.375

$55.248

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Component Stockers USA

USA . 78 parts In-Stock

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$990.420

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78

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Microchip USA

USA . 2,497 parts In-Stock

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2,497

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Corphita

USA . 2,091 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the HPSDM8148CCYE2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch microprocessors that are perfect for a wide range of applications. From high-speed data processing to efficient multitasking, this product offers exceptional value and benefits to customers looking for cutting-edge technology. Trust in Texas Instruments to provide you with quality products that will exceed your expectations. Elevate your projects with the HPSDM8148CCYE2 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the package, making it suitable for various environments and handling conditions.

Integrated Cache: YES

Integrated cache enhances the processor's performance by reducing memory access times and increasing overall speed.

Maximum Supply Voltage: 1.42 V

Higher maximum supply voltage allows for increased performance and flexibility in power management.

On Chip Data RAM Width: 8

On-chip data RAM width of 8 ensures efficient data processing and storage capabilities.

Address Bus Width: 28

Wider address bus width of 28 enables the processor to access and manage larger memory spaces efficiently.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for easier integration into various electronic systems.

Bit Size: 32

32-bit architecture offers improved processing capabilities and compatibility with a wide range of software applications.

No. of Terminals: 684

Higher number of terminals allow for increased connectivity options and support for various peripherals and external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch style offers efficient heat dissipation and compact layout for enhanced performance and reliability.

Minimum Supply Voltage: 1.28 V

Lower minimum supply voltage helps in reducing power consumption and improving energy efficiency of the processor.

Maximum Operating Temperature: 90 °C

Higher maximum operating temperature ensures stable performance even in harsh environmental conditions or extended usage periods.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in a microprocessor type ensures faster processing speeds and efficient use of resources for enhanced performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of electronic systems.

Technical Specifications

Microprocessors HPSDM8148CCYE2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

1114112

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

HPSDM8148CCYE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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