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MCIMX6L2EVN10AC

NXP Semiconductors

MCIMX6L2EVN10AC by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$23.616

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,600 parts In-Stock

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$23.616

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$23.616

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Distributors (In-Stock)

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Vyrian

USA . 4,905 parts In-Stock

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4,905

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Digiode

USA . 1,354 parts In-Stock

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Anansix

USA . 426 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,106 parts In-Stock

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$2.000

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$2.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$15.765

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$14.346

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$12.927

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3,000

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$12.927

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AZTECH Wire

Italy . 693 parts In-Stock

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$18.490

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Microchip USA

USA . 1,926 parts In-Stock

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$73.830

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UNI Independent Distributors

Spain . 4,871 parts In-Stock

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iodParts Technologies Inc.

India . 3,478 parts In-Stock

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Epart123

USA . 3,200 parts In-Stock

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$321.970

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 917 parts In-Stock

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Technical Specifications

Microprocessors MCIMX6L2EVN10AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.375 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MCIMX6L2EVN10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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