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MCIMX6L3EVN10AC

NXP Semiconductors

MCIMX6L3EVN10AC by NXP Semiconductors

MCIMX6L3EVN10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.375V to 1.5V. Ideal for industrial applications requiring high performance in a compact GRID ARRAY package.

Median Price

$33.981

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$36.560

100+ parts

$27.971

1k+ parts

$24.981

10k+ parts

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800

$36.560

$27.971

$24.981

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Flip Electronics (Authorized)

USA . 1,499 parts In-Stock

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1,499

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Verical

USA . 600 parts In-Stock

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$31.402

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600

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$31.402

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Distributors (In-Stock)

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Digiode

USA . 4,213 parts In-Stock

1+ parts

$30.656

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4,213

$30.656

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Vyrian

USA . 5,904 parts In-Stock

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5,904

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Anansix

USA . 2,821 parts In-Stock

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Flip Electronics

USA . 1,499 parts In-Stock

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1,499

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

1+ parts

$27.430

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1,029

$27.430

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Corphita

USA . 1,567 parts In-Stock

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$29.043

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1,567

$29.043

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Microchip USA

USA . 3,155 parts In-Stock

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$52.144

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3,155

$52.144

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Corohmni

South Africa . 399 parts In-Stock

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$69.439

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399

$69.439

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Continental Prestige Electronics

USA . 2,997 parts In-Stock

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2,997

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 705 parts In-Stock

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705

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Aranea Global

USA . 500 parts In-Stock

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500

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UNI Independent Distributors

Spain . 101 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MCIMX6L3EVN10AC by NXP Semiconductors. This top-of-the-line microprocessor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With NXP's reputation for excellence in semiconductor manufacturing, you can trust that you're getting a high-quality product that will exceed your expectations. Whether you're designing the next generation of IoT devices or pushing the boundaries of industrial automation, the MCIMX6L3EVN10AC delivers value, efficiency, and innovation like never before. Elevate your projects to new heights with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal performance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly processes, reducing production time and costs.

Maximum Supply Voltage: 1.5 V

Operating at a maximum supply voltage of 1.5V ensures energy efficiency and helps in minimizing power consumption.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing space utilization within electronic devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high performance in a small form factor, ideal for dense PCB layouts.

Minimum Supply Voltage: 1.375 V

Operating at a low minimum supply voltage of 1.375V contributes to energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the product can withstand high temperature environments, ensuring reliable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate at a minimum temperature of -40°C makes it suitable for use in a wide range of environments, including industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent solderability and corrosion resistance, enhancing the overall reliability of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and facilitates efficient heat dissipation, improving overall system performance.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm enables a slim and compact profile, ideal for space-constrained electronic applications.

Width: 13 mm

The width of 13mm offers a balance between compactness and ease of handling during assembly and integration processes.

Maximum Time At Peak Reflow Temperature (s): 40

The product's maximum time at peak reflow temperature of 40 seconds ensures proper soldering and joint reliability during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for secure soldering joints and reliable connections, promoting the longevity of the product.

Length: 13 mm

The length of 13mm complements the square package shape, providing a well-balanced form factor for efficient PCB integration.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product can operate reliably in harsh environments with extended temperature ranges and varying conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC-based microprocessor, the product offers high performance, reduced power consumption, and efficient execution of instructions, making it suitable for diverse computing applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and reliability, making the product suitable for a wide range of electronic devices.

Terminal Form: BALL

With a ball terminal form, the product offers reliable connections and ease of soldering, enhancing overall electrical performance and durability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on PCBs, enabling compact designs and improved signal integrity.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during storage and assembly processes, ensuring long-term reliability in diverse environments.

Technical Specifications

Microprocessors MCIMX6L3EVN10AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.375 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MCIMX6L3EVN10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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