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INDUSTRIAL Other Function Memory ICs 106

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
CY8C24033-24PVXI by Cypress Semiconductor

CY8C24033-24PVXI

Cypress Semiconductor

CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.

R-PDSO-G56

18.415 mm

8192 bit

MEMORY CIRCUIT

1

1

56

8192 words

8K

SYNCHRONOUS

85 Cel

-40 Cel

8KX1

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Not Qualified

2.794 mm

5.25 V

3 V

YES

CMOS

INDUSTRIAL

GULL WING

.635 mm

DUAL

7.5057 mm

MT29C4G48MAZAPAKQ-5IT by Micron Technology

MT29C4G48MAZAPAKQ-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

S-PBGA-B168

e1

12 mm

2097152 bit

MEMORY CIRCUIT

16

FLASH+SDRAM

1

168

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.75 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

12 mm

MT29C2G48MAKLCJI-6IT by Micron Technology

MT29C2G48MAKLCJI-6IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: TFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;

S-PBGA-B168

e1

12 mm

2097152 bit

MEMORY CIRCUIT

16

FLASH+SDRAM

1

168

131072 words

128K

ASYNCHRONOUS

85 Cel

-40 Cel

128KX16

PLASTIC/EPOXY

TFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8

Not Qualified

1.1 mm

Other Memory ICs

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

12 mm

M39L0R8090U3ZE6E by Micron Technology

M39L0R8090U3ZE6E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B133

8 mm

536870912 bit

MEMORY CIRCUIT

16

1

133

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

8 mm

MR10Q010CMB by Everspin Technologies

MR10Q010CMB

Everspin Technologies

MR10Q010CMB by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. Operating at 3.3V, it offers synchronous operation and industrial temperature grade suitability. With a package style of grid array and low profile, it is ideal for applications requiring high-speed data storage in compact spaces.

R-PBGA-B24

8 mm

1048576 bit

MEMORY CIRCUIT

8

3

1

24

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

1.35 mm

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

6 mm

ST25TA02K-AC6B5 by STMicroelectronics

ST25TA02K-AC6B5

STMicroelectronics

ST25TA02K-AC6B5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, featuring a 256x8 organization and operating in asynchronous mode. It supports a wide temperature range from -40 °C to 85 °C. This unencased chip is ideal for compact designs requiring reliable data storage.

X-XUUC-N

2048 bit

MEMORY CIRCUIT

8

1

256 words

256

ASYNCHRONOUS

85 Cel

-40 Cel

256X8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA02KD-C6C5 by STMicroelectronics

ST25TA02KD-C6C5

STMicroelectronics

ST25TA02KD-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with an industrial temperature range of -40 °C to 85 °C. It features asynchronous operation, 256x8 organization, and a very thin profile (0.6mm height). Ideal for space-constrained applications in various electronic devices.

R-PDSO-N8

3 mm

2048 bit

MEMORY CIRCUIT

8

1

8

256 words

256

ASYNCHRONOUS

85 Cel

-40 Cel

256X8

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

2 mm

ST25TA02KD-C6H5 by STMicroelectronics

ST25TA02KD-C6H5

STMicroelectronics

ST25TA02KD-C6H5 from STMicroelectronics is a CMOS memory IC with 256x8 organization, operating b/w -40 °C to 85 °C. It features a compact chip carrier design and asynchronous mode for efficient data access. Ideal for industrial applications requiring reliable non-volatile storage.

R-PDSO-N5

1.7 mm

2048 bit

MEMORY CIRCUIT

8

1

5

256 words

256

ASYNCHRONOUS

85 Cel

-40 Cel

256X8

PLASTIC/EPOXY

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

.6 mm

YES

CMOS

INDUSTRIAL

NO LEAD

.4 mm

BOTTOM

NOT SPECIFIED

1.4 mm

ST25TA16K-AB6B3 by STMicroelectronics

ST25TA16K-AB6B3

STMicroelectronics

ST25TA16K-AB6B3 from STMicroelectronics is an industrial-grade CMOS memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount chip offers 8192 words organized in 8Kx8 format for versatile applications.

X-XUUC-N

65536 bit

MEMORY CIRCUIT

8

1

8192 words

8K

ASYNCHRONOUS

85 Cel

-40 Cel

8KX8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA512-AC6B5 by STMicroelectronics

ST25TA512-AC6B5

STMicroelectronics

ST25TA512-AC6B5 from STMicroelectronics is a CMOS memory IC with a density of 512 bits, organized as 64x8. It operates asynchronously and supports temperatures from -40 °C to 85 °C. Ideal for industrial applications, it features a no-lead design for efficient surface mounting.

X-XUUC-N

512 bit

MEMORY CIRCUIT

8

1

64 words

64

ASYNCHRONOUS

85 Cel

-40 Cel

64X8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA64K-AB6B3 by STMicroelectronics

ST25TA64K-AB6B3

STMicroelectronics

ST25TA64K-AB6B3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount chip is perfect for applications requiring reliable data storage in compact designs.

X-XUUC-N

65536 bit

MEMORY CIRCUIT

8

1

8192 words

8K

ASYNCHRONOUS

85 Cel

-40 Cel

8KX8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA02KP-C6C5 by STMicroelectronics

ST25TA02KP-C6C5

STMicroelectronics

ST25TA02KP-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with a 256x8 organization and operates asynchronously. It features an industrial temperature range of -40 °C to 85 °C and comes in a very thin profile package. Ideal for space-constrained applications requiring reliable data storage.

R-PDSO-N8

3 mm

2048 bit

MEMORY CIRCUIT

8

1

8

256 words

256

ASYNCHRONOUS

85 Cel

-40 Cel

256X8

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

2 mm

MT29C4G48MAYBBAHK-48AIT by Micron Technology

MT29C4G48MAYBBAHK-48AIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B137;

IT IS ALSO HAVING 2GBIT (X 32) LPDDR

R-PBGA-B137

e1

13 mm

4294967296 bit

MEMORY CIRCUIT

8

1

137

536870912 words

512M

SYNCHRONOUS

85 Cel

-40 Cel

512MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

10.5 mm

ST25TA02K-AC6G5 by STMicroelectronics

ST25TA02K-AC6G5

STMicroelectronics

ST25TA02K-AC6G5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, featuring a 256x8 organization and operating temperatures from -40 °C to 85 °C. Its asynchronous mode ensures efficient data access. Ideal for compact, surface-mount designs.

O-XUUC-N

2048 bit

MEMORY CIRCUIT

8

1

256 words

256

ASYNCHRONOUS

85 Cel

-40 Cel

256X8

UNSPECIFIED

DIE

ROUND

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA02KP-C6G5 by STMicroelectronics

ST25TA02KP-C6G5

STMicroelectronics

ST25TA02KP-C6G5 from STMicroelectronics is a CMOS memory IC with 256K x 8 organization, operating b/w -40 °C to 85 °C. This surface-mount chip features asynchronous operation and no lead terminals, ideal for industrial applications requiring reliable data storage.

O-XUUC-N

2097152 bit

MEMORY CIRCUIT

8

1

262144 words

256K

ASYNCHRONOUS

85 Cel

-40 Cel

256KX8

UNSPECIFIED

DIE

ROUND

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

ST25TA16KAB6G3 by STMicroelectronics

ST25TA16KAB6G3

STMicroelectronics

ST25TA16KAB6G3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount, no-lead chip is perfect for various applications in electronics.

O-XUUC-N

65536 bit

MEMORY CIRCUIT

8

1

8192 words

8K

ASYNCHRONOUS

85 Cel

-40 Cel

8KX8

UNSPECIFIED

DIE

ROUND

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

ST25TA64K-AB6G3 by STMicroelectronics

ST25TA64K-AB6G3

STMicroelectronics

ST25TA64K-AB6G3 from STMicroelectronics is a CMOS memory IC with 8K x 8 organization, operating b/w -40 °C to 85 °C. This surface-mount, no-lead chip is ideal for industrial applications requiring reliable asynchronous data storage. With a density of 65536 bits, it ensures efficient performance in compact designs.

O-XUUC-N

65536 bit

MEMORY CIRCUIT

8

1

8192 words

8K

ASYNCHRONOUS

85 Cel

-40 Cel

8KX8

UNSPECIFIED

DIE

ROUND

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

47C04-I/ST by Microchip Technology

47C04-I/ST

Microchip Technology

47C04-I/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, 512X8 organization, and 4096-bit memory density. It operates synchronously at temperatures ranging from -40 to 85°C. This small outline package with 0.65mm terminal pitch is ideal for industrial applications requiring fast access times.

400 ns

R-PDSO-G8

e3

4.4 mm

4096 bit

MEMORY CIRCUIT

8

EEPROM+SRAM

1

1

1

8

512 words

512

SYNCHRONOUS

85 Cel

-40 Cel

512X8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.2 mm

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

40

3 mm

47C16T-I/SN by Microchip Technology

47C16T-I/SN

Microchip Technology

47C16T-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with an organization of 2KX8 and a memory density of 16384 bit. It operates at a nominal voltage of 5V and has a max access time of 400 ns. This memory circuit is commonly used in industrial applications requiring reliable data storage.

400 ns

R-PDSO-G8

e3

4.9 mm

16384 bit

MEMORY CIRCUIT

8

EEPROM+SRAM

3

1

1

8

2048 words

2K

SYNCHRONOUS

85 Cel

-40 Cel

2KX8

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

260

1.75 mm

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

40

3.9 mm

47L04T-I/ST by Microchip Technology

47L04T-I/ST

Microchip Technology

47L04T-I/ST by Microchip Technology is a small outline, thin profile memory IC with EEPROM+SRAM mixed memory type. Operating in synchronous mode, it offers 512x8 organization and 4096-bit memory density. Ideal for industrial applications requiring fast access times at temperatures ranging from -40 to 85°C.

400 ns

R-PDSO-G8

e3

4.4 mm

4096 bit

MEMORY CIRCUIT

8

EEPROM+SRAM

1

1

1

8

512 words

512

SYNCHRONOUS

85 Cel

-40 Cel

512X8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.2 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

40

3 mm

47L16T-I/ST by Microchip Technology

47L16T-I/ST

Microchip Technology

47L16T-I/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for industrial applications requiring a memory density of 16384 bit, fast access time of 400 ns, and operating temperature range from -40 to 85°C.

400 ns

R-PDSO-G8

e3

4.4 mm

16384 bit

MEMORY CIRCUIT

8

EEPROM+SRAM

1

1

1

8

2048 words

2K

SYNCHRONOUS

85 Cel

-40 Cel

2KX8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.2 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

40

3 mm

SMC128AFB6E by STMicroelectronics

SMC128AFB6E

STMicroelectronics

SMC128AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 1 Gb and operates b/w -40 °C to 85 °C. It features a 128Mx8 organization and comes in a no-lead, uncasded chip package. Ideal for high-performance applications requiring reliable data storage.

X-XUUC-N

1073741824 bit

MEMORY CIRCUIT

8

1

134217728 words

128M

ASYNCHRONOUS

85 Cel

-40 Cel

128MX8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

SMC512AFB6E by STMicroelectronics

SMC512AFB6E

STMicroelectronics

SMC512AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 4 Gb and operates b/w -40 °C to 85 °C. It features a 512M x 8 organization in a no-lead package, ideal for space-constrained applications. This CMOS technology ensures reliable performance in various electronic devices.

X-XUUC-N

4294967296 bit

MEMORY CIRCUIT

8

1

536870912 words

512M

ASYNCHRONOUS

85 Cel

-40 Cel

512MX8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

MT29C1G12MAAIVAMD-5IT by Micron Technology

MT29C1G12MAAIVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

IT ALSO CONTAINS 512MBIT(32MBIT X 16) MOBILE LPDDR

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAIYAMR-5AIT by Micron Technology

MT29C1G12MAAIYAMR-5AIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B130;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAJVAMD-5IT by Micron Technology

MT29C1G12MAAJVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Width: 8 mm;

IT ALSO CONTAINS 512MBIT(32MBIT X 16) MOBILE LPDDR

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

16

1

130

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAJYAMD-5IT by Micron Technology

MT29C1G12MAAJYAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

16

1

130

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

THGBMHG6C1LBAU6 by Toshiba

THGBMHG6C1LBAU6

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PBGA-B153

68719476736 bit

MEMORY CIRCUIT

8

1

153

8589934592 words

8G

105 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG7C2LBAU7 by Toshiba

THGBMHG7C2LBAU7

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

R-PBGA-B153

137438953472 bit

MEMORY CIRCUIT

8

1

153

17179869184 words

16G

105 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG8C4LBAU7 by Toshiba

THGBMHG8C4LBAU7

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

R-PBGA-B153

274877906944 bit

MEMORY CIRCUIT

8

1

153

34359738368 words

32G

105 Cel

-40 Cel

32GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG9C8LBAU8 by Toshiba

THGBMHG9C8LBAU8

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

105 Cel

-40 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG6C1LBAWL by Toshiba

THGBMHG6C1LBAWL

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

R-PBGA-B153

68719476736 bit

MEMORY CIRCUIT

8

1

153

8589934592 words

8G

ASYNCHRONOUS

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG7C2LBAWR by Toshiba

THGBMHG7C2LBAWR

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PBGA-B153

137438953472 bit

MEMORY CIRCUIT

8

1

153

17179869184 words

16G

ASYNCHRONOUS

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG8C4LBAWR by Toshiba

THGBMHG8C4LBAWR

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PBGA-B153

274877906944 bit

MEMORY CIRCUIT

8

1

153

34359738368 words

32G

ASYNCHRONOUS

85 Cel

-40 Cel

32GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG9C8LBAWG by Toshiba

THGBMHG9C8LBAWG

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

ASYNCHRONOUS

85 Cel

-40 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

ST25TA512-AC6G5 by STMicroelectronics

ST25TA512-AC6G5

STMicroelectronics

ST25TA512-AC6G5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, operating in asynchronous mode. It features a 512-bit density with a temperature range of -40 °C to 85 °C and comes in a no-lead rectangular package. Ideal for compact designs, it offers reliable performance in harsh environments.

R-XUUC-N

512 bit

MEMORY CIRCUIT

8

1

512 words

64

ASYNCHRONOUS

85 Cel

-40 Cel

64X8

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

M24SR64-YDW8T/2 by STMicroelectronics

M24SR64-YDW8T/2

STMicroelectronics

M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.

R-PDSO-G8

4.3 mm

65536 bit

MEMORY CIRCUIT

1

1

8

65536 words

64K

SYNCHRONOUS

105 Cel

-40 Cel

64KX1

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

1.2 mm

5.5 V

2.7 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

2.9 mm

M24SR64-YMN8T/2 by STMicroelectronics

M24SR64-YMN8T/2

STMicroelectronics

M24SR64-YMN8T/2 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates in synchronous mode, has 65536-bit memory density, and supports a supply voltage range of 2.7V to 5.5V. This small outline package is ideal for industrial applications requiring reliable data storage and retrieval capabilities.

R-PDSO-G8

4.9 mm

65536 bit

MEMORY CIRCUIT

1

1

8

65536 words

64K

SYNCHRONOUS

105 Cel

-40 Cel

64KX1

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

1.75 mm

5.5 V

2.7 V

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

3.9 mm

ST25TB512-AC6G6 by STMicroelectronics

ST25TB512-AC6G6

STMicroelectronics

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP; Surface Mount: YES;

X-XUUC-N

512 bit

MEMORY CIRCUIT

32

1

16 words

16

ASYNCHRONOUS

85 Cel

-40 Cel

16X32

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

MT29C2G24MAAAAHAMD-5IT by Micron Technology

MT29C2G24MAAAAHAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C2G24MAABAHAMD-5EIT by Micron Technology

MT29C2G24MAABAHAMD-5EIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Additional Features: ALSO ORGANISED AS 64M X 16;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

8 mm

MT29C2G24MAABAHAMD-5IT by Micron Technology

MT29C2G24MAABAHAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C2G24MAABAKAMD-5IT by Micron Technology

MT29C2G24MAABAKAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 32;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

8 mm

MT29C1G12MAACVAMD-5IT by Micron Technology

MT29C1G12MAACVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

MT29C1G12MAACYAMD-5IT by Micron Technology

MT29C1G12MAACYAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

MT29C1G12MAADVAMD-5IT by Micron Technology

MT29C1G12MAADVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

ST25TB02K-AC6G6 by STMicroelectronics

ST25TB02K-AC6G6

STMicroelectronics

ST25TB02K-AC6G6 from STMicroelectronics is a round, no-lead memory IC designed for industrial applications. It operates b/w -40 °C and 85 °C, with a density of 2048 bits organized as 2Kx1. Ideal for surface mount solutions requiring reliable data storage.

O-XUUC-N

2048 bit

MEMORY CIRCUIT

1

1

2048 words

2K

85 Cel

-40 Cel

2KX1

UNSPECIFIED

DIE

DIE OR CHIP

ROUND

UNCASED CHIP

YES

INDUSTRIAL

NO LEAD

UNSPECIFIED

ST25TB04K-AC6G6 by STMicroelectronics

ST25TB04K-AC6G6

STMicroelectronics

ST25TB04K-AC6G6 from STMicroelectronics is a CMOS memory IC with 4K words and operates asynchronously. It features a -40 °C to 85 °C industrial temp range and comes in a no-lead, rectangular package. Ideal for compact applications requiring reliable data storage.

R-XUUC-N4

4096 bit

MEMORY CIRCUIT

1

1

4

4096 words

4K

ASYNCHRONOUS

85 Cel

-40 Cel

4KX1

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER