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ST25TB04K-AC6G6

STMicroelectronics

ST25TB04K-AC6G6 by STMicroelectronics

ST25TB04K-AC6G6 from STMicroelectronics is a CMOS memory IC with 4K words and operates asynchronously. It features a -40 °C to 85 °C industrial temp range and comes in a no-lead, rectangular package. Ideal for compact applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,499 parts In-Stock

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5,499

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Digiode

USA . 1,715 parts In-Stock

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1,715

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Anansix

USA . 1,460 parts In-Stock

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1,460

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,278 parts In-Stock

1+ parts

$1.956

100+ parts

-

1k+ parts

$1.760

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2,278

$1.956

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$1.760

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MKK Technologies

India . 1,971 parts In-Stock

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$3.678

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1,971

$3.678

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DigiPath Technology Company

USA . 1,971 parts In-Stock

1+ parts

$3.678

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1,971

$3.678

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AZTECH Wire

Italy . 1,200 parts In-Stock

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$19.990

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1,200

$19.990

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Perfect Parts

USA . 181,440 parts In-Stock

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181,440

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Corphita

USA . 3,145 parts In-Stock

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3,145

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Parana Technologies

USA . 2,123 parts In-Stock

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$2.339

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2,123

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$2.339

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Overview

Unlock the potential of your designs with the ST25TB04K-AC6G6 from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers unparalleled quality in memory solutions, ensuring reliability and performance across diverse applications. This compact, surface-mount memory IC operates seamlessly in demanding environments, making it ideal for industrial use. Elevate your projects with a trusted partner that offers not only advanced technology but also the advantage of industry-leading support and innovation!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layout, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized footprint, facilitating easier integration into various circuit designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation ensures faster data access without the need for clock synchronization, improving system responsiveness.

No. of Terminals: 4

With only four terminals, this IC simplifies connection to microcontrollers and other components, reducing overall board complexity.

Package Style (Meter): UNCASED CHIP

The uncased chip style allows for direct mounting on circuit boards, enhancing thermal performance and reducing height.

Maximum Operating Temperature: 85 °C

This maximum operating temperature ensures reliability in moderately hot environments, making it suitable for industrial applications.

Organization: 4KX1

The 4Kx1 organization provides flexibility in storage configurations, accommodating various data handling needs.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C allows this memory IC to be used in extreme environments, ensuring consistent performance in harsh conditions.

Terminal Position: UPPER

Upper terminal positioning facilitates easy access and better soldering options for efficient and robust connections.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade indicates that this product is built to endure extreme environmental conditions, enhancing durability.

Technology: CMOS

CMOS technology ensures low power consumption, making this memory IC energy-efficient, which is crucial for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form minimizes space usage and improves electrical performance by reducing inductance.

No. of Words: 4096 words

With 4096 words of memory, this IC suffices for a variety of applications, providing adequate data storage for embedded systems.

No. of Words Code: 4K

The 4K words code denotes its compact data storage capability, making it ideal for small-scale applications.

Memory Density: 4096 bit

A memory density of 4096 bits ensures efficient use of board space while providing sufficient memory for specific functions.

Memory IC Type: MEMORY CIRCUIT

Being categorized as a memory circuit indicates its essential role in storing and recalling data, vital for numerous electronic devices.

Technical Specifications

Other Function Memory ICs ST25TB04K-AC6G6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XUUC-N4

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

ST25TB04K-AC6G6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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