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INDUSTRIAL Other Function Memory ICs 106

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
ST25TB512-AT6G6 by STMicroelectronics

ST25TB512-AT6G6

STMicroelectronics

ST25TB512-AT6G6 from STMicroelectronics is a round, no-lead memory IC designed for industrial applications. It operates b/w -40 °C to 85 °C with a density of 512 bits and an organization of 512x1 words. Ideal for surface mount integration in various electronic devices.

O-XUUC-N

512 bit

MEMORY CIRCUIT

1

1

512 words

512

85 Cel

-40 Cel

512X1

UNSPECIFIED

DIE

DIE OR CHIP

ROUND

UNCASED CHIP

YES

INDUSTRIAL

NO LEAD

UNSPECIFIED

MB85AS4MTPF-G-BCERE1 by Fujitsu

MB85AS4MTPF-G-BCERE1

Fujitsu

Fujitsu's MB85AS4MTPF-G-BCERE1 is a 512KX8 memory IC with CMOS technology. Operating at 3.3V, it has a memory density of 4194304 bit and supports synchronous operation. Ideal for industrial applications, this small outline package measures 5.85mm x 5.3mm with a max temperature of 85°C.

R-PDSO-G8

5.85 mm

4194304 bit

MEMORY CIRCUIT

8

1

8

524288 words

512K

SYNCHRONOUS

85 Cel

-40 Cel

512KX8

PLASTIC/EPOXY

SOP

SOP8,.3

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

1.73 mm

3.6 V

1.65 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

5.3 mm

MR45V200BRAZAARL by Lapis Semiconductor

MR45V200BRAZAARL

Lapis Semiconductor

MR45V200BRAZAARL by Lapis Semiconductor is a 256KX8 memory IC with CMOS technology. Operating at 3.3V, it has an industrial temperature grade and offers 2097152 bits of memory density. Ideal for applications requiring synchronous operation in industrial settings.

R-PDIP-T8

9.2 mm

2097152 bit

MEMORY CIRCUIT

8

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.6 V

2.7 V

3.3

NO

CMOS

INDUSTRIAL

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MR44V100AMAZAATL by Lapis Semiconductor

MR44V100AMAZAATL

Lapis Semiconductor

MR44V100AMAZAATL by Lapis Semiconductor is a 128KX8 MEMORY CIRCUIT with 1048576 bit Memory Density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and is ideal for industrial applications requiring small outline, low profile Package Style.

R-PDSO-G8

4.9 mm

1048576 bit

MEMORY CIRCUIT

8

1

8

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

LSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

1.65 mm

3.6 V

1.8 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

3.9 mm

MR45V032AMAZBATL by Lapis Semiconductor

MR45V032AMAZBATL

Lapis Semiconductor

MR45V032AMAZBATL by Lapis Semiconductor is a small outline, low profile memory IC with a capacity of 4096 words and a memory density of 32768 bits. It operates synchronously at a nominal voltage of 3.3V and can withstand temperatures ranging from -40 to 85°C. This memory circuit is commonly used in industrial applications requiring compact and reliable storage solutions.

R-PDSO-G8

4.9 mm

32768 bit

MEMORY CIRCUIT

8

1

8

4096 words

4K

SYNCHRONOUS

85 Cel

-40 Cel

4KX8

PLASTIC/EPOXY

LSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

1.65 mm

3.6 V

2.7 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

3.9 mm

MT29C4G96MAZBACJG-5IT by Micron Technology

MT29C4G96MAZBACJG-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX16;

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.9 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C8G96MAZBADJV-5IT by Micron Technology

MT29C8G96MAZBADJV-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

8589934592 bit

MEMORY CIRCUIT

16

1

168

536870912 words

512M

SYNCHRONOUS

85 Cel

-40 Cel

512MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

AF4GUDI-OEM by Atp Electronics

AF4GUDI-OEM

Atp Electronics

AF4GUDI-OEM by Atp Electronics is a CMOS memory circuit with 4GX8 organization, 8-bit memory width, and 34.36 Gb density. It operates in industrial temperature range (-40 to 85°C) and is surface mountable for various applications requiring high-density memory solutions.

X-XUUC-N

34359738368 bit

MEMORY CIRCUIT

8

1

4294967296 words

4G

85 Cel

-40 Cel

4GX8

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

CMOS

INDUSTRIAL

NO LEAD

UPPER

MT29C1G12MAAIVAMD-5ITTR by Micron Technology

MT29C1G12MAAIVAMD-5ITTR

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

47L64-I/SN by Microchip Technology

47L64-I/SN

Microchip Technology

47L64-I/SN by Microchip Technology is a small outline memory IC with 8KX8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for industrial applications requiring a memory density of 65536 bit, fast access time of 550 ns, and a supply voltage range from 2.7V to 3.6V.

550 ns

R-PDSO-G8

4.9 mm

65536 bit

MEMORY CIRCUIT

8

EEPROM+SRAM

1

1

8

8192 words

8K

SYNCHRONOUS

85 Cel

-40 Cel

8KX8

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

3.6 V

2.7 V

3.3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

3.9 mm