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ST25TB512-AT6G6

STMicroelectronics

ST25TB512-AT6G6 by STMicroelectronics

ST25TB512-AT6G6 from STMicroelectronics is a round, no-lead memory IC designed for industrial applications. It operates b/w -40 °C to 85 °C with a density of 512 bits and an organization of 512x1 words. Ideal for surface mount integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,038 parts In-Stock

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7,038

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Anansix

USA . 1,328 parts In-Stock

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1,328

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Digiode

USA . 465 parts In-Stock

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465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,374 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

$2.385

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1,374

$2.650

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$2.385

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MKK Technologies

India . 2,204 parts In-Stock

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$4.982

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2,204

$4.982

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DigiPath Technology Company

USA . 2,204 parts In-Stock

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$4.982

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2,204

$4.982

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AZTECH Wire

Italy . 582 parts In-Stock

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$13.370

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582

$13.370

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Parana Technologies

USA . 1,889 parts In-Stock

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$3.168

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1,889

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$3.168

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Corphita

USA . 1,506 parts In-Stock

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1,506

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Overview

Elevate your projects with the ST25TB512-AT6G6 from STMicroelectronics, a leader in innovative memory solutions. This robust memory IC ensures reliability across extreme temperatures, making it perfect for industrial applications. Its compact design and superior performance streamline your designs while enhancing efficiency. Trust in STMicroelectronics' quality to drive your technology forward, empowering you to create smarter, more reliable devices.

Feature Benefit Bullets

Surface Mount: YES

Being a surface mount component allows for easier integration into compact designs, minimizing the overall footprint.

Package Shape: ROUND

The round package shape enhances the thermal dissipation and provides a reliable physical structure for mounting.

Package Style (Meter): UNCASED CHIP

As an uncased chip, this product offers flexibility for custom applications and integration into various electronic circuits.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C makes it suitable for a wide range of industrial applications.

Organization: 512X1

The 512X1 organization enables efficient data storage and retrieval for specific applications needing low-density memory.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability and performance in extreme environments.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness, making it ideal for use in harsh conditions where other components might fail.

Terminal Form: NO LEAD

The no-lead design facilitates compatibility with advanced packaging techniques, reducing footprint and improving assembly efficiency.

No. of Words: 512 words

With a capacity of 512 words, it meets the needs of applications that require moderate memory without excessive redundant capacity.

No. of Words Code: 512

The simplicity of 512 words presents a straightforward architecture for easy data management in basic memory applications.

Memory Density: 512 bit

The low memory density of 512 bits is well-suited for low-power and cost-sensitive devices, ensuring efficient functionality.

Memory IC Type: MEMORY CIRCUIT

Being a dedicated memory circuit, it fulfills specific storage needs while ensuring quick access and reliability.

Technical Specifications

Other Function Memory ICs ST25TB512-AT6G6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

O-XUUC-N

Memory Density:

512 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Trade Compliance

ST25TB512-AT6G6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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