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SQUARE Other Function Interface ICs 240

Other Function Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Maximum Delay Display Mode Driver No. of Bits Interface IC Type Interface Standard JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Backplanes No. of Bits No. of Channels No. of Digits/Characters No. of Functions No. of Segments No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Maximum Output Current Output Latch/Register Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Receive Delay Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
MC33SB0400ES by NXP Semiconductors

MC33SB0400ES

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HQCCN; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-XQCC-N48

e3

3

1

48

125 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

5.25 V

4.75 V

5 V

YES

MOS

AUTOMOTIVE

TIN

NO LEAD

QUAD

40

PI3EQX4951STZDE by Diodes Incorporated

PI3EQX4951STZDE

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-XQCC-N20

4 mm

1

20

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.8 mm

3.6 V

3 V

3.3 V

YES

COMMERCIAL

NO LEAD

.5 mm

QUAD

4 mm

IP4856CX25/CZ by Nexperia

IP4856CX25/CZ

Nexperia

IP4856CX25/CZ by Nexperia is a 25-terminal interface IC with a supply voltage range of 1.7V to 3.6V. It features a very thin profile, fine pitch grid array package and operates in industrial temperature range (-40°C to 85°C). Ideal for applications requiring precise interface circuitry in compact spaces.

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

INTERFACE CIRCUIT

S-PBGA-B25

2.05 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.55 mm

3.6 V

1.7 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

30

2.05 mm

IP4855CX25/CAZ by Nexperia

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE;

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

INTERFACE CIRCUIT

S-PBGA-B25

2.04 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.5 mm

3.6 V

1.1 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.04 mm

IP4855CX25Z by Nexperia

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE;

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

INTERFACE CIRCUIT

S-PBGA-B25

2.04 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.5 mm

3.6 V

1.1 V

1.8 V

YES

INDUSTRIAL

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.04 mm

TPD2S701QDSKRQ1 by Texas Instruments

TPD2S701QDSKRQ1

Texas Instruments

TPD2S701QDSKRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with a supply voltage range of 4.5V to 7V, ideal for automotive applications. It features a small outline package with dual terminals and nickel palladium gold finish, suitable for surface mount assembly. Operating temperature ranges from -40°C to 125°C, making it reliable in harsh environments.

INTERFACE CIRCUIT

S-PDSO-N10

e4

2.5 mm

2

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.8 mm

7 V

4.5 V

5 V

YES

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

DUAL

30

2.5 mm

TLE9263QXV33XUMA1 by Infineon Technologies

TLE9263QXV33XUMA1

Infineon Technologies

TLE9263QXV33XUMA1 by Infineon operates at 5.5-28 V, ideal for automotive applications with AEC-Q100 screening. This interface IC features a 48-terminal chip carrier package with 0.5 mm pitch and 0.9 mm seated height, suitable for compact designs requiring a very thin profile. The no-lead terminal form and quad position make it easy to mount on PCBs for various function interface requirements.

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

3

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

7 mm

MADR-009150 by M/a-com Technology Solutions

MADR-009150

M/a-com Technology Solutions

MADR-009150 by M/a-com: Interface IC with 16 terminals, 3.3V nominal supply, -40 to 85°C temp range. Square chip carrier for industrial applications requiring very thin profile and nickel palladium gold finish.

INTERFACE CIRCUIT

GENERAL PURPOSE

S-PQCC-N16

e4

3 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

3 V

3.3 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

3 mm

DS250DF410ABMR by Texas Instruments

DS250DF410ABMR

Texas Instruments

DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMT by Texas Instruments

DS250DF410ABMT

Texas Instruments

DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

TLE9260QXXUMA1 by Infineon Technologies

TLE9260QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 5.5 V;

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

7 mm

TLE9260QXXUMA2 by Infineon Technologies

TLE9260QXXUMA2

Infineon Technologies

TLE9260QXXUMA2 by Infineon operates at 5.5-28V, ideal for automotive applications with AEC-Q100 screening. It features a 48-terminal chip carrier package with 0.5mm pitch and no lead terminal form, suitable for very thin profile designs. This interface circuit IC has a compact square shape measuring 7x7mm, making it perfect for space-constrained environments.

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

3

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

7 mm

TLE9262QXV33XUMA1 by Infineon Technologies

TLE9262QXV33XUMA1

Infineon Technologies

TLE9262QXV33XUMA1 by Infineon: Interface IC with 5.5-28V supply, AEC-Q100 screening for automotive apps. Quad terminal chip carrier, 0.9mm height, 0.5mm pitch ideal for thin profile designs in vehicles. Supports 13.5V nominal voltage with 48 terminals in plastic package.

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

TLE9262QXXUMA1 by Infineon Technologies

TLE9262QXXUMA1

Infineon Technologies

TLE9262QXXUMA1 by Infineon is an AEC-Q100 rated interface IC with 5.5-28V supply voltage range, ideal for automotive applications. It features a 48-terminal chip carrier package with 0.5mm terminal pitch and measures 7x7mm in size, suitable for compact designs requiring very thin profiles.

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

7 mm

TLE9263QXXUMA1 by Infineon Technologies

TLE9263QXXUMA1

Infineon Technologies

TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.

INTERFACE CIRCUIT

S-PQCC-N48

7 mm

1

48

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

7 mm

TLE92623QXV33XUMA1 by Infineon Technologies

TLE92623QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;

INTERFACE CIRCUIT

S-XQCC-N48

7 mm

1

48

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

TLE92623QXXUMA2 by Infineon Technologies

TLE92623QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;

INTERFACE CIRCUIT

S-XQCC-N48

7 mm

1

48

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

TLE92633QXV33XUMA1 by Infineon Technologies

TLE92633QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;

INTERFACE CIRCUIT

S-XQCC-N48

7 mm

1

48

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

TLE92633BQXV33XUMA1 by Infineon Technologies

TLE92633BQXV33XUMA1

Infineon Technologies

TLE92633BQXV33XUMA1 by Infineon is a 48-terminal IC with max supply voltage of 28V, suitable for automotive applications. It features AEC-Q100 screening level and operates at nominal 13.5V, making it ideal for interface circuits in vehicles. With a compact square package style and low seated height of 0.9mm, it offers space-efficient design solutions.

INTERFACE CIRCUIT

S-XQCC-N48

e3

7 mm

3

1

48

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

TIN

NO LEAD

.5 mm

QUAD

7 mm

TLE92633BQXXUMA1 by Infineon Technologies

TLE92633BQXXUMA1

Infineon Technologies

TLE92633BQXXUMA1 by Infineon is a 48-terminal interface IC with max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's ideal for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.

INTERFACE CIRCUIT

S-XQCC-N48

e3

7 mm

3

1

48

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

5.5 V

13.5 V

YES

TIN

NO LEAD

.5 mm

QUAD

7 mm

PI2EQX6814NJEX by Diodes Incorporated

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B100

11 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

1.7 mm

1.26 V

1.14 V

1.2 V

YES

INDUSTRIAL

BALL

1 mm

BOTTOM

11 mm

PI2EQX6814NJE by Diodes Incorporated

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PBGA-B100

11 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

1.7 mm

1.26 V

1.14 V

1.2 V

YES

INDUSTRIAL

BALL

1 mm

BOTTOM

11 mm

PI3EQX6801ZDEX by Diodes Incorporated

PI3EQX6801ZDEX

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

ALSO OPERATE WITH 3.3V SUPPLY

INTERFACE CIRCUIT

S-XQCC-N20

e4

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.575 V

1.425 V

1.5 V

YES

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

4 mm

PR5331C3HN/C370Y by NXP Semiconductors

PR5331C3HN/C370Y

NXP Semiconductors

PR5331C3HN/C370Y by NXP Semiconductors is a 40-terminal interface IC with a supply voltage range of 2.5V to 3.6V, suitable for applications requiring an operating temperature b/w -30°C to 85°C. This chip carrier has a square shape, measures 6mm in width and length, and features a no-lead terminal form for surface mounting at a pitch of 0.5mm.

INTERFACE CIRCUIT

S-PQCC-N40

6 mm

2

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.5 V

3.3 V

YES

NO LEAD

.5 mm

QUAD

6 mm

PTN5110HQZ by NXP Semiconductors

PTN5110HQZ

NXP Semiconductors

PTN5110HQZ by NXP Semiconductors is a 16-terminal interface IC with a supply voltage range of 2.7V to 5.5V, operating temperature from -40°C to 85°C. It features a square package style and is suitable for applications requiring other function interface ICs in compact designs.

INTERFACE CIRCUIT

S-PQCC-N16

2.6 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.1SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.4 mm

5.5 V

2.7 V

3.3 V

YES

NO LEAD

.4 mm

QUAD

2.6 mm

PTN5110THQZ by NXP Semiconductors

PTN5110THQZ

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

INTERFACE CIRCUIT

S-PQCC-N16

2.6 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.1SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.4 mm

5.5 V

2.7 V

3.3 V

YES

NO LEAD

.4 mm

QUAD

2.6 mm

TDA8026ET/C3K by NXP Semiconductors

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,32;

INTERFACE CIRCUIT

S-PBGA-B64

7 mm

2

1

64

85 Cel

-25 Cel

PLASTIC/EPOXY

TFBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

5.5 V

2.7 V

3.3 V

YES

BALL

.8 mm

BOTTOM

7 mm

2746595 by Phoenix Contact

2746595

Phoenix Contact

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-PQFP-G44

1

44

85 Cel

-40 Cel

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

NOT SPECIFIED

5.5 V

4.5 V

5 V

YES

INDUSTRIAL

GULL WING

QUAD

NOT SPECIFIED

DS150DF1610FB/NOPB by Texas Instruments

DS150DF1610FB/NOPB

Texas Instruments

DS150DF1610FB/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a peak reflow temperature of 245°C. This IC is suitable for applications requiring high-speed data transmission in electronic systems.

INTERFACE CIRCUIT

S-PBGA-B196

e1

15.05 mm

4

16

1

196

85 Cel

-10 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

2.94 mm

2.625 V

2.375 V

2.5 V

YES

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

15.05 mm

DS250DF210ABMR by Texas Instruments

DS250DF210ABMR

Texas Instruments

DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

MC33SB0401ES by NXP Semiconductors

MC33SB0401ES

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

INTERFACE CIRCUIT

S-XQCC-N48

e3

3

1

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48(UNSPEC)

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

20 V

6 V

YES

SMARTMOS

TIN

NO LEAD

QUAD

40

PR5331C3HN/C360,518 by NXP Semiconductors

PR5331C3HN/C360,518

NXP Semiconductors

PR5331C3HN/C360,518 by NXP Semiconductors is a 40-terminal interface IC with a supply voltage range of 2.5V to 3.6V. It operates b/w -30°C to 85°C and comes in a square chip carrier package suitable for surface mounting applications. Ideal for various interface circuit requirements due to its robust design and high temperature tolerance.

INTERFACE CIRCUIT

S-PQCC-N40

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

3.6 V

2.5 V

3.3 V

YES

OTHER

NO LEAD

QUAD

PM8562B-F3EI by Microchip Technology

PM8562B-F3EI

Microchip Technology

INTERFACE CIRCUIT; Package Shape: SQUARE; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;

INTERFACE CIRCUIT

e1

1

UNSPECIFIED

SQUARE

TIN SILVER COPPER

TSB41BA3FTPFPEP by Texas Instruments

TSB41BA3FTPFPEP

Texas Instruments

TSB41BA3FTPFPEP by Texas Instruments is an 80-terminal interface IC with a supply voltage range of 1.75V to 2V. It operates in temperatures from -40°C to 110°C, making it suitable for industrial applications requiring high reliability and performance. The package style is flatpack with a thin profile, ideal for surface mount assembly processes.

INTERFACE CIRCUIT

S-PQFP-G80

e4

12 mm

3

1

80

110 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

2 V

1.75 V

1.85 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

TSB82AF15TPZTEP by Texas Instruments

TSB82AF15TPZTEP

Texas Instruments

TSB82AF15TPZTEP by Texas Instruments is a 100-terminal interface IC with a supply voltage range of 1.4V to 1.6V, suitable for industrial applications. It features a thin profile flatpack package style and operates b/w -40°C to 110°C temperature range. With nickel palladium gold terminal finish, it is ideal for surface mount assembly processes at peak reflow temperature of 260°C within 30 seconds.

INTERFACE CIRCUIT

S-PQFP-G100

e4

14 mm

3

1

100

110 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

1.6 V

1.4 V

1.5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

SN65DSI86ZXHR by Texas Instruments

SN65DSI86ZXHR

Texas Instruments

SN65DSI86ZXHR by Texas Instruments is a 64-terminal interface IC with a package style of grid array, very thin profile, and fine pitch. It operates b/w -40 to 85 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for industrial applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B64

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA64,9X9,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.26 V

1.14 V

1.2 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

TUSB216IRWBT by Texas Instruments

TUSB216IRWBT

Texas Instruments

TUSB216IRWBT by Texas Instruments is a 12-terminal interface IC with a supply voltage range of 2.3V to 6.5V, suitable for industrial applications. It features a compact square chip carrier package style with very thin profile and operates in temperatures ranging from -40°C to 85°C. The IC supports surface mount installation and has a moisture sensitivity level of 2, making it ideal for various electronic devices requiring reliable connectivity.

INTERFACE CIRCUIT

S-PQCC-N12

e4

1.6 mm

2

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

LCC12,.062SQ,16

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

.4 mm

36 mA

6.5 V

2.3 V

5 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

2988117 by Phoenix Contact

2988117

Phoenix Contact

Phoenix Contact 2988117 is a digital I/O module with 64 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.97-3.63V and is surface mountable in industrial applications. The package material is plastic/epoxy, shaped square with Gull Wing terminals for reliable connectivity.

DIGITAL I/O MODULE

S-PQFP-G64

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

SQUARE

3.63 V

2.97 V

3.3 V

YES

INDUSTRIAL

GULL WING

QUAD

PI6ULS5V9617BUEX by Diodes Incorporated

PI6ULS5V9617BUEX

Diodes Incorporated

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

IT ALSO REQUIRES 2.2 TO 5.5 V

INTERFACE CIRCUIT

S-PDSO-G8

3 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.19

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.1 mm

5.5 V

.6 V

.95 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

3 mm

TC9595XBG(EL) by Toshiba

TC9595XBG(EL)

Toshiba

TC9595XBG(EL) by Toshiba is an 80-terminal interface circuit IC in a square plastic/epoxy package with surface mount capability. It features ball terminals at the bottom and is designed for various applications requiring interface circuit functionality.

INTERFACE CIRCUIT

S-PBGA-B80

1

80

PLASTIC/EPOXY

SQUARE

YES

BALL

BOTTOM

TUSB216RWBTQ1 by Texas Instruments

TUSB216RWBTQ1

Texas Instruments

TUSB216RWBTQ1 by Texas Instruments is a 12-terminal interface IC with a supply voltage range of 2.3V to 6.5V, ideal for automotive applications due to AEC-Q100 screening and nickel palladium gold terminal finish. It features a compact square chip carrier package style with very thin profile, suitable for surface mount assembly in tight spaces with operating temperatures ranging from -40°C to 105°C.

INTERFACE CIRCUIT

S-PQCC-N12

e4

1.6 mm

2

1

1

12

105 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

LCC12,.06SQ,16

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

AEC-Q100

.4 mm

36 mA

6.5 V

2.3 V

5 V

YES

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

1.6 mm

TCA9537DGSR by Texas Instruments

TCA9537DGSR

Texas Instruments

TCA9537DGSR by Texas Instruments is a small outline interface IC with 10 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and matte tin terminal finish. Ideal for applications requiring precise control in compact spaces like consumer electronics and industrial automation systems.

INTERFACE CIRCUIT

S-PDSO-G10

e3

3 mm

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SQUARE

SMALL OUTLINE

260

1.1 mm

5.5 V

1.65 V

1.8 V

YES

MATTE TIN

GULL WING

.5 mm

DUAL

3 mm

TLE9274QXXUMA2 by Infineon Technologies

TLE9274QXXUMA2

Infineon Technologies

TLE9274QXXUMA2 by Infineon operates at 4.5-28V, with AEC-Q100 screening for automotive applications. It features a 48-terminal chip carrier package, -40 to 150°C operating range, and 0.5mm terminal pitch. Ideal for interface circuits in compact designs requiring high reliability under harsh conditions.

INTERFACE CIRCUIT

S-XQCC-N48

e3

7 mm

3

1

48

150 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

28 V

4.5 V

13.5 V

YES

TIN

NO LEAD

.5 mm

QUAD

7 mm

HDL6M05585 by Ablic

HDL6M05585

Ablic

Ablic's HDL6M05585 is a 68-terminal IC with supply voltage range of 1.7V to 5.25V, operating temperature up to 75°C. It features ULTRASOUND PULSER interface type and SOI-CMOS technology, suitable for applications requiring high-frequency ultrasound signal generation in compact devices.

Operating Supply in Clock mode is 2.4V to 3.6V

ULTRASOUND PULSER

S-XQCC-N68

10.2 mm

1

68

75 Cel

0 Cel

UNSPECIFIED

HVQCCN

LCC68,.4SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.95 mm

5.25 V

1.7 V

1.8 V

YES

SOI-CMOS

NO LEAD

.5 mm

QUAD

10.2 mm

PI3EQX501IZAEX by Diodes Incorporated

PI3EQX501IZAEX

Diodes Incorporated

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Maximum Seated Height: .8 mm;

INTERFACE CIRCUIT

S-PDSO-N8

2 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.08,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.8 mm

3.6 V

3 V

3.3 V

YES

NO LEAD

.5 mm

DUAL

2 mm

PTN5110NTHQZ by NXP Semiconductors

PTN5110NTHQZ

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .4 mm;

INTERFACE CIRCUIT

S-PQCC-N16

e3

2.6 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.1SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.4 mm

5.5 V

2.7 V

3.3 V

YES

TIN

NO LEAD

.4 mm

QUAD

30

2.6 mm

DS560DF410AMNR by Texas Instruments

DS560DF410AMNR

Texas Instruments

DS560DF410AMNR by Texas Instruments is a 4-function interface IC with 81 terminals, operating from -40 to 85°C. It features a square package body made of plastic/epoxy and supports a nominal voltage of 1.2V. Ideal for applications requiring an interface circuit with 4 channels, such as communication systems or industrial automation.

IT ALSO HAS 1.8V SUPPLY VOLTAGE

INTERFACE CIRCUIT

S-PBGA-B81

e1

3

4

4

81

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA81(UNSPEC)

SQUARE

260

1.2 V

YES

TIN SILVER COPPER

BALL

BOTTOM

DS560DF410AMNT by Texas Instruments

DS560DF410AMNT

Texas Instruments

DS560DF410AMNT by Texas Instruments is a 4-function interface IC with 81 terminals, operating b/w -40 to 85°C. It features a square package body made of plastic/epoxy and supports a nominal voltage of 1.2V. Ideal for applications requiring multiple channels and interface circuitry in surface-mount configurations.

IT ALSO HAS 1.8V SUPPLY VOLTAGE

INTERFACE CIRCUIT

S-PBGA-B81

e1

3

4

4

81

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA81(UNSPEC)

SQUARE

260

1.2 V

YES

TIN SILVER COPPER

BALL

BOTTOM