Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MC33SB0400ES
NXP Semiconductors
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HQCCN; Package Shape: SQUARE;
INTERFACE CIRCUIT
S-XQCC-N48
e3
3
1
48
125 Cel
-40 Cel
UNSPECIFIED
HQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG
260
5.25 V
4.75 V
5 V
YES
MOS
AUTOMOTIVE
TIN
NO LEAD
QUAD
40
PI3EQX4951STZDE
Diodes Incorporated
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N20
4 mm
20
70 Cel
0 Cel
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.8 mm
3.6 V
3 V
3.3 V
COMMERCIAL
.5 mm
IP4856CX25/CZ
Nexperia
IP4856CX25/CZ by Nexperia is a 25-terminal interface IC with a supply voltage range of 1.7V to 3.6V. It features a very thin profile, fine pitch grid array package and operates in industrial temperature range (-40°C to 85°C). Ideal for applications requiring precise interface circuitry in compact spaces.
VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6
S-PBGA-B25
2.05 mm
25
85 Cel
PLASTIC/EPOXY
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.55 mm
1.7 V
1.8 V
INDUSTRIAL
BALL
.4 mm
BOTTOM
30
IP4855CX25/CAZ
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE;
VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5
2.04 mm
NOT SPECIFIED
1.1 V
IP4855CX25Z
TPD2S701QDSKRQ1
Texas Instruments
TPD2S701QDSKRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with a supply voltage range of 4.5V to 7V, ideal for automotive applications. It features a small outline package with dual terminals and nickel palladium gold finish, suitable for surface mount assembly. Operating temperature ranges from -40°C to 125°C, making it reliable in harsh environments.
S-PDSO-N10
e4
2.5 mm
2
10
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
AEC-Q100
7 V
4.5 V
NICKEL PALLADIUM GOLD
DUAL
TLE9263QXV33XUMA1
Infineon Technologies
TLE9263QXV33XUMA1 by Infineon operates at 5.5-28 V, ideal for automotive applications with AEC-Q100 screening. This interface IC features a 48-terminal chip carrier package with 0.5 mm pitch and 0.9 mm seated height, suitable for compact designs requiring a very thin profile. The no-lead terminal form and quad position make it easy to mount on PCBs for various function interface requirements.
S-PQCC-N48
7 mm
.9 mm
28 V
5.5 V
13.5 V
MADR-009150
M/a-com Technology Solutions
MADR-009150 by M/a-com: Interface IC with 16 terminals, 3.3V nominal supply, -40 to 85°C temp range. Square chip carrier for industrial applications requiring very thin profile and nickel palladium gold finish.
GENERAL PURPOSE
S-PQCC-N16
3 mm
16
LCC16,.12SQ,20
1 mm
DS250DF410ABMR
DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.
S-PBGA-B101
e1
6 mm
4
101
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.03 mm
TIN SILVER COPPER
DS250DF410ABMT
DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.
TLE9260QXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 5.5 V;
TLE9260QXXUMA2
TLE9260QXXUMA2 by Infineon operates at 5.5-28V, ideal for automotive applications with AEC-Q100 screening. It features a 48-terminal chip carrier package with 0.5mm pitch and no lead terminal form, suitable for very thin profile designs. This interface circuit IC has a compact square shape measuring 7x7mm, making it perfect for space-constrained environments.
TLE9262QXV33XUMA1
TLE9262QXV33XUMA1 by Infineon: Interface IC with 5.5-28V supply, AEC-Q100 screening for automotive apps. Quad terminal chip carrier, 0.9mm height, 0.5mm pitch ideal for thin profile designs in vehicles. Supports 13.5V nominal voltage with 48 terminals in plastic package.
TLE9262QXXUMA1
TLE9262QXXUMA1 by Infineon is an AEC-Q100 rated interface IC with 5.5-28V supply voltage range, ideal for automotive applications. It features a 48-terminal chip carrier package with 0.5mm terminal pitch and measures 7x7mm in size, suitable for compact designs requiring very thin profiles.
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;
TLE92623QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE92633QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE92633BQXV33XUMA1
TLE92633BQXV33XUMA1 by Infineon is a 48-terminal IC with max supply voltage of 28V, suitable for automotive applications. It features AEC-Q100 screening level and operates at nominal 13.5V, making it ideal for interface circuits in vehicles. With a compact square package style and low seated height of 0.9mm, it offers space-efficient design solutions.
TLE92633BQXXUMA1
TLE92633BQXXUMA1 by Infineon is a 48-terminal interface IC with max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's ideal for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
PI2EQX6814NJEX
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
S-PBGA-B100
11 mm
100
LBGA
BGA100,10X10,40
GRID ARRAY, LOW PROFILE
1.7 mm
1.26 V
1.14 V
1.2 V
PI2EQX6814NJE
PI3EQX6801ZDEX
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
ALSO OPERATE WITH 3.3V SUPPLY
1.575 V
1.425 V
1.5 V
Nickel/Palladium/Gold (Ni/Pd/Au)
PR5331C3HN/C370Y
PR5331C3HN/C370Y by NXP Semiconductors is a 40-terminal interface IC with a supply voltage range of 2.5V to 3.6V, suitable for applications requiring an operating temperature b/w -30°C to 85°C. This chip carrier has a square shape, measures 6mm in width and length, and features a no-lead terminal form for surface mounting at a pitch of 0.5mm.
S-PQCC-N40
-30 Cel
LCC40,.24SQ,20
2.5 V
PTN5110HQZ
PTN5110HQZ by NXP Semiconductors is a 16-terminal interface IC with a supply voltage range of 2.7V to 5.5V, operating temperature from -40°C to 85°C. It features a square package style and is suitable for applications requiring other function interface ICs in compact designs.
2.6 mm
LCC16,.1SQ,16
2.7 V
PTN5110THQZ
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
TDA8026ET/C3K
INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,32;
S-PBGA-B64
64
-25 Cel
BGA64,8X8,32
1.2 mm
2746595
Phoenix Contact
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
S-PQFP-G44
44
QFP
FLATPACK
GULL WING
DS150DF1610FB/NOPB
DS150DF1610FB/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a peak reflow temperature of 245°C. This IC is suitable for applications requiring high-speed data transmission in electronic systems.
S-PBGA-B196
15.05 mm
196
-10 Cel
BGA
GRID ARRAY
245
2.94 mm
2.625 V
2.375 V
OTHER
DS250DF210ABMR
DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.
MC33SB0401ES
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
LCC48(UNSPEC)
20 V
6 V
SMARTMOS
PR5331C3HN/C360,518
PR5331C3HN/C360,518 by NXP Semiconductors is a 40-terminal interface IC with a supply voltage range of 2.5V to 3.6V. It operates b/w -30°C to 85°C and comes in a square chip carrier package suitable for surface mounting applications. Ideal for various interface circuit requirements due to its robust design and high temperature tolerance.
PM8562B-F3EI
Microchip Technology
INTERFACE CIRCUIT; Package Shape: SQUARE; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
TSB41BA3FTPFPEP
TSB41BA3FTPFPEP by Texas Instruments is an 80-terminal interface IC with a supply voltage range of 1.75V to 2V. It operates in temperatures from -40°C to 110°C, making it suitable for industrial applications requiring high reliability and performance. The package style is flatpack with a thin profile, ideal for surface mount assembly processes.
S-PQFP-G80
12 mm
80
110 Cel
HTFQFP
QFP80,.55SQ,20
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
2 V
1.75 V
1.85 V
TSB82AF15TPZTEP
TSB82AF15TPZTEP by Texas Instruments is a 100-terminal interface IC with a supply voltage range of 1.4V to 1.6V, suitable for industrial applications. It features a thin profile flatpack package style and operates b/w -40°C to 110°C temperature range. With nickel palladium gold terminal finish, it is ideal for surface mount assembly processes at peak reflow temperature of 260°C within 30 seconds.
S-PQFP-G100
14 mm
TFQFP
TQFP100,.63SQ
FLATPACK, THIN PROFILE, FINE PITCH
1.6 V
1.4 V
SN65DSI86ZXHR
SN65DSI86ZXHR by Texas Instruments is a 64-terminal interface IC with a package style of grid array, very thin profile, and fine pitch. It operates b/w -40 to 85 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for industrial applications requiring high-speed data transmission in compact electronic devices.
5 mm
BGA64,9X9,20
TUSB216IRWBT
TUSB216IRWBT by Texas Instruments is a 12-terminal interface IC with a supply voltage range of 2.3V to 6.5V, suitable for industrial applications. It features a compact square chip carrier package style with very thin profile and operates in temperatures ranging from -40°C to 85°C. The IC supports surface mount installation and has a moisture sensitivity level of 2, making it ideal for various electronic devices requiring reliable connectivity.
S-PQCC-N12
1.6 mm
12
VQCCN
LCC12,.062SQ,16
CHIP CARRIER, VERY THIN PROFILE
36 mA
6.5 V
2.3 V
2988117
Phoenix Contact 2988117 is a digital I/O module with 64 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.97-3.63V and is surface mountable in industrial applications. The package material is plastic/epoxy, shaped square with Gull Wing terminals for reliable connectivity.
DIGITAL I/O MODULE
S-PQFP-G64
3.63 V
2.97 V
PI6ULS5V9617BUEX
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
IT ALSO REQUIRES 2.2 TO 5.5 V
S-PDSO-G8
8
TSSOP
TSSOP8,.19
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
.6 V
.95 V
CMOS
.65 mm
TC9595XBG(EL)
Toshiba
TC9595XBG(EL) by Toshiba is an 80-terminal interface circuit IC in a square plastic/epoxy package with surface mount capability. It features ball terminals at the bottom and is designed for various applications requiring interface circuit functionality.
S-PBGA-B80
TUSB216RWBTQ1
TUSB216RWBTQ1 by Texas Instruments is a 12-terminal interface IC with a supply voltage range of 2.3V to 6.5V, ideal for automotive applications due to AEC-Q100 screening and nickel palladium gold terminal finish. It features a compact square chip carrier package style with very thin profile, suitable for surface mount assembly in tight spaces with operating temperatures ranging from -40°C to 105°C.
105 Cel
LCC12,.06SQ,16
TCA9537DGSR
TCA9537DGSR by Texas Instruments is a small outline interface IC with 10 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and matte tin terminal finish. Ideal for applications requiring precise control in compact spaces like consumer electronics and industrial automation systems.
S-PDSO-G10
SOP
SMALL OUTLINE
1.65 V
MATTE TIN
TLE9274QXXUMA2
TLE9274QXXUMA2 by Infineon operates at 4.5-28V, with AEC-Q100 screening for automotive applications. It features a 48-terminal chip carrier package, -40 to 150°C operating range, and 0.5mm terminal pitch. Ideal for interface circuits in compact designs requiring high reliability under harsh conditions.
150 Cel
LCC48,.27SQ,20
HDL6M05585
Ablic
Ablic's HDL6M05585 is a 68-terminal IC with supply voltage range of 1.7V to 5.25V, operating temperature up to 75°C. It features ULTRASOUND PULSER interface type and SOI-CMOS technology, suitable for applications requiring high-frequency ultrasound signal generation in compact devices.
Operating Supply in Clock mode is 2.4V to 3.6V
ULTRASOUND PULSER
S-XQCC-N68
10.2 mm
68
75 Cel
LCC68,.4SQ,20
.95 mm
SOI-CMOS
PI3EQX501IZAEX
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Maximum Seated Height: .8 mm;
S-PDSO-N8
2 mm
SOLCC8,.08,20
PTN5110NTHQZ
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .4 mm;
DS560DF410AMNR
DS560DF410AMNR by Texas Instruments is a 4-function interface IC with 81 terminals, operating from -40 to 85°C. It features a square package body made of plastic/epoxy and supports a nominal voltage of 1.2V. Ideal for applications requiring an interface circuit with 4 channels, such as communication systems or industrial automation.
IT ALSO HAS 1.8V SUPPLY VOLTAGE
S-PBGA-B81
81
BGA81(UNSPEC)
DS560DF410AMNT
DS560DF410AMNT by Texas Instruments is a 4-function interface IC with 81 terminals, operating b/w -40 to 85°C. It features a square package body made of plastic/epoxy and supports a nominal voltage of 1.2V. Ideal for applications requiring multiple channels and interface circuitry in surface-mount configurations.
© 2023 All rights reserved