Loading...

DS560DF410AMNT

Texas Instruments

DS560DF410AMNT by Texas Instruments

DS560DF410AMNT by Texas Instruments is a 4-function interface IC with 81 terminals, operating b/w -40 to 85°C. It features a square package body made of plastic/epoxy and supports a nominal voltage of 1.2V. Ideal for applications requiring multiple channels and interface circuitry in surface-mount configurations.

Median Price

$45.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,980 parts In-Stock

1+ parts

$34.349

100+ parts

$30.532

1k+ parts

$22.450

10k+ parts

-

1,980

$34.349

$30.532

$22.450

-

Mouser Electronics

USA . 247 parts In-Stock

1+ parts

$57.250

100+ parts

$42.940

1k+ parts

$39.920

10k+ parts

-

247

$57.250

$42.940

$39.920

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,826 parts In-Stock

1+ parts

$32.632

100+ parts

-

1k+ parts

-

10k+ parts

-

2,826

$32.632

-

-

-

Vyrian

USA . 8,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,167

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 215 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$15.000

-

-

-

Northwest PG Solutions

USA . 376 parts In-Stock

1+ parts

$16.500

100+ parts

$14.850

1k+ parts

-

10k+ parts

-

376

$16.500

$14.850

-

-

Semicontronic

India . 764 parts In-Stock

1+ parts

$29.200

100+ parts

$28.470

1k+ parts

$28.324

10k+ parts

-

764

$29.200

$28.470

$28.324

-

Ampacity Inc.

Singapore . 713 parts In-Stock

1+ parts

$29.200

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$29.200

-

-

-

Corphita

USA . 1,237 parts In-Stock

1+ parts

$30.914

100+ parts

-

1k+ parts

-

10k+ parts

-

1,237

$30.914

-

-

-

Corohmni

South Africa . 168 parts In-Stock

1+ parts

$34.349

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$34.349

-

-

-

Overview

Unlock the potential of your electronic devices with the DS560DF410AMNT by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the category of Other Function Interface ICs. This versatile product offers 4 functions in a compact square package with 81 terminals, ensuring seamless integration into any design. With a wide operating temperature range and durable construction, this interface circuit provides maximum performance and value for customers across various applications. Discover the endless possibilities with Texas Instruments' DS560DF410AMNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving time and effort in manufacturing processes.

No. of Functions: 4

With 4 functions incorporated into one IC, this product offers versatility and functionality for various applications.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board, making it efficient for compact designs.

No. of Terminals: 81

Having 81 terminals provides ample connectivity options, allowing for the IC to interface with multiple components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of environments, making the IC versatile and adaptable.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes enhances conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and assembly, improving efficiency in the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the IC can withstand soldering processes without compromising its performance.

No. of Channels: 4

Having 4 channels allows for multiple data streams or signals to be processed concurrently, increasing the IC's versatility.

Nominal Supply Voltage: 1.2 V

With a low nominal supply voltage, this IC is energy-efficient and suitable for battery-powered applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the IC can withstand moderate exposure to moisture during storage and handling, ensuring reliability.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type, this IC enables communication between different components or systems, enhancing connectivity and compatibility.

Technical Specifications

Other Function Interface ICs DS560DF410AMNT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO HAS 1.8V SUPPLY VOLTAGE

Interface IC Type:

JESD-30 Code:

S-PBGA-B81

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA81(UNSPEC)

Package Shape:

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DS560DF410AMNT Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 3