Loading...

DS560DF810ALUT

Texas Instruments

DS560DF810ALUT by Texas Instruments

DS560DF810ALUT by Texas Instruments is a low-profile interface IC with 8 channels, operating at -40 to 85°C. Featuring a grid array package style, it has 135 terminals with tin silver copper finish. Ideal for applications requiring fine pitch and surface mount technology.

Median Price

$96.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$96.000

100+ parts

$73.850

1k+ parts

$73.840

10k+ parts

-

250

$96.000

$73.850

$73.840

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,287 parts In-Stock

1+ parts

$61.484

100+ parts

-

1k+ parts

-

10k+ parts

-

1,287

$61.484

-

-

-

Vyrian

USA . 8,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,075

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 231 parts In-Stock

1+ parts

$55.010

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$55.010

-

-

-

Corphita

USA . 4,309 parts In-Stock

1+ parts

$58.248

100+ parts

-

1k+ parts

-

10k+ parts

-

4,309

$58.248

-

-

-

Semicontronic

India . 184 parts In-Stock

1+ parts

$60.840

100+ parts

$59.319

1k+ parts

$59.015

10k+ parts

-

184

$60.840

$59.319

$59.015

-

Corohmni

South Africa . 396 parts In-Stock

1+ parts

$64.720

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$64.720

-

-

-

Microchip USA

USA . 2,935 parts In-Stock

1+ parts

$123.770

100+ parts

$121.620

1k+ parts

$120.540

10k+ parts

$119.460

2,935

$123.770

$121.620

$120.540

$119.460

Northwest PG Solutions

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

Native Components

USA . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

655

-

-

-

-

Overview

Elevate your electronic designs with the DS560DF810ALUT by Texas Instruments. Crafted with precision and expertise, this interface IC offers unparalleled quality and reliability. Whether you're working on consumer electronics, telecommunications, or industrial applications, this product delivers exceptional performance. With its innovative design and advanced features, the DS560DF810ALUT provides value beyond compare. Trust Texas Instruments to bring you cutting-edge technology that pushes the boundaries of what's possible in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling or transportation.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for applications where space is limited.

No. of Terminals: 135

The high number of terminals allows for more connectivity options and flexibility in designing complex systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

The tin, silver, copper terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Width: 8 mm

The compact width of 8mm allows for efficient use of space on a PCB, enabling more components to be placed in a limited area.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage of 1.2V reduces power consumption and heat dissipation, making the product energy-efficient.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate level of moisture sensitivity, allowing for safe reflow soldering processes without damaging the IC.

Technical Specifications

Other Function Interface ICs DS560DF810ALUT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED 1.8V SUPPLY NOMINAL

Interface IC Type:

JESD-30 Code:

R-PBGA-B135

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

135

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA135,9X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.55 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 3